제품 상세 정보

Integrated VCO No Frequency (min) (MHz) 10 Frequency (max) (MHz) 12800 Current consumption (mA) 405 Features 1:4 fanout, Integrated multiplier and divider modes, JESD204B/C SYSREF support, Phase synchronization, Programmable Delay, Programmable phase offset, RF clock distribution, Ultra-low additive jitter Rating HiRel Enhanced Product Operating temperature range (°C) to Lock time (µs) (typ) (s) Loop BW dependent
Integrated VCO No Frequency (min) (MHz) 10 Frequency (max) (MHz) 12800 Current consumption (mA) 405 Features 1:4 fanout, Integrated multiplier and divider modes, JESD204B/C SYSREF support, Phase synchronization, Programmable Delay, Programmable phase offset, RF clock distribution, Ultra-low additive jitter Rating HiRel Enhanced Product Operating temperature range (°C) to Lock time (µs) (typ) (s) Loop BW dependent
VQFN (RHA) 40 36 mm² 6 x 6
  • VID #V62/25648
  • Output frequency: 300MHz to 12.8GHz
  • Noiseless adjustable input delay up to 60ps with 1.1ps resolution
  • Individual adjustable output delays up to 55ps with 0.9ps resolution
  • Ultra-low noise
    • Noise floor: –159dBc/Hz at 6GHz output
    • Additive jitter (DC to fCLK): 36fs
    • Additive jitter (100Hz to 100MHz): 10fs
  • Four high-frequency clocks with corresponding SYSREF outputs
    • Shared divide by 1 (Bypass), 2, 3, 4, 5, 6, 7, and 8
    • Shared programmable multiplier x2, x3, x4, x5, x6, x7 and x8
  • LOGICLK output with corresponding SYSREF output
    • On separate divide bank
    • 1, 2, 4 pre-divider
    • 1 (bypass), 2, …, 1023 post divider
    • Second logic clock option with additional divider 1, 2, 4 & 8
  • Six programmable output power levels
  • Synchronized SYSREF clock outputs
    • 508 delay step adjustments of less than 2.5ps at 12.8GHz
    • Generator, repeater and repeater retime modes
    • Windowing feature for SYSREFREQ pins to optimize timing
  • SYNC feature to all divides and multiple devices
  • Operating voltage: 2.5V
  • Operating temperature: –55ºC to +85ºC
  • High Reliability
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Product Traceability
  • VID #V62/25648
  • Output frequency: 300MHz to 12.8GHz
  • Noiseless adjustable input delay up to 60ps with 1.1ps resolution
  • Individual adjustable output delays up to 55ps with 0.9ps resolution
  • Ultra-low noise
    • Noise floor: –159dBc/Hz at 6GHz output
    • Additive jitter (DC to fCLK): 36fs
    • Additive jitter (100Hz to 100MHz): 10fs
  • Four high-frequency clocks with corresponding SYSREF outputs
    • Shared divide by 1 (Bypass), 2, 3, 4, 5, 6, 7, and 8
    • Shared programmable multiplier x2, x3, x4, x5, x6, x7 and x8
  • LOGICLK output with corresponding SYSREF output
    • On separate divide bank
    • 1, 2, 4 pre-divider
    • 1 (bypass), 2, …, 1023 post divider
    • Second logic clock option with additional divider 1, 2, 4 & 8
  • Six programmable output power levels
  • Synchronized SYSREF clock outputs
    • 508 delay step adjustments of less than 2.5ps at 12.8GHz
    • Generator, repeater and repeater retime modes
    • Windowing feature for SYSREFREQ pins to optimize timing
  • SYNC feature to all divides and multiple devices
  • Operating voltage: 2.5V
  • Operating temperature: –55ºC to +85ºC
  • High Reliability
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Product Traceability

The high frequency capability, extremely low jitter and programmable clock input and output delay of this device, makes a great approach to clock high precision, high-frequency data converters without degradation of signal-to-noise ratio. Each of the four high frequency clock outputs and additional LOGICLK outputs with larger divider range, is paired with a SYSREF output clock signal. The SYSREF signal for JESD204B/C interfaces can either be internally generated or passed in as an input and re-clocked to the device clocks. The noiseless delay adjustment at input path of the high frequency clock input and individual clock output paths insures low skew clocks in multi-channel system. For data converter clocking application, having the jitter of the clock less than the aperture jitter of the data converter is important. In applications where more than four data converters need to be clocked, a variety of cascading architectures can be developed using multiple devices to distribute all the high frequency clocks and SYSREF signals required. This device, combined with an ultra-low noise reference clock source, is an exemplary choice for clocking data converters, especially when sampling above 3GHz.

The high frequency capability, extremely low jitter and programmable clock input and output delay of this device, makes a great approach to clock high precision, high-frequency data converters without degradation of signal-to-noise ratio. Each of the four high frequency clock outputs and additional LOGICLK outputs with larger divider range, is paired with a SYSREF output clock signal. The SYSREF signal for JESD204B/C interfaces can either be internally generated or passed in as an input and re-clocked to the device clocks. The noiseless delay adjustment at input path of the high frequency clock input and individual clock output paths insures low skew clocks in multi-channel system. For data converter clocking application, having the jitter of the clock less than the aperture jitter of the data converter is important. In applications where more than four data converters need to be clocked, a variety of cascading architectures can be developed using multiple devices to distribute all the high frequency clocks and SYSREF signals required. This device, combined with an ultra-low noise reference clock source, is an exemplary choice for clocking data converters, especially when sampling above 3GHz.

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기술 자료

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2개 모두 보기
유형 직함 날짜
* Data sheet LMX1205-EP Low-Noise, High-Frequency JESD Buffer/Multiplier/Divider datasheet PDF | HTML 2025/12/11
* Radiation & reliability report LMX1205-EP Enhanced Product Qualification and Reliability Report PDF | HTML 2025/12/19

설계 및 개발

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패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RHA) 40 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

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