SN54LVTH574-SP
QML-V, 3.3V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs
SN54LVTH574-SP
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Support Unregulated Battery Operation Down to 2.7 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Ioff and Power-Up 3-State Support Hot Insertion
- Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
- Latch-Up Performance Exceeds 500 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The eight flip-flops of the ’LVTH574 devices are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.
OE\ does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | SN54LVTH574, SN74LVTH574 datasheet (Rev. G) | 2003. 9. 15 | ||
| * | SMD | SN54LVTH574-SP SMD 5962-95832 | 2016. 7. 8 | ||
| 선택 가이드 | TI Space Products (Rev. L) | 2026. 3. 27 | |||
| Application brief | DLA Approved Optimizations for QML Products (Rev. C) | PDF | HTML | 2025. 6. 17 | ||
| 애플리케이션 노트 | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. B) | PDF | HTML | 2025. 6. 10 | ||
| 추가 자료 | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) | 2025. 2. 20 | |||
| 애플리케이션 노트 | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022. 12. 15 | ||
| 애플리케이션 노트 | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022. 10. 19 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CFP (W) | 20 | Ultra Librarian |