제품 상세 정보

Bits (#) 18 Data rate (max) (Mbps) 400 Topology Open drain, Push-Pull Direction control (typ) Fixed-direction Vin (min) (V) 3.15 Vin (max) (V) 3.45 Vout (min) (V) 3.15 Vout (max) (V) 3.45 Applications GTL Features Partial power down (Ioff) Technology family GTL Supply current (max) (mA) 60 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 18 Data rate (max) (Mbps) 400 Topology Open drain, Push-Pull Direction control (typ) Fixed-direction Vin (min) (V) 3.15 Vin (max) (V) 3.45 Vout (min) (V) 3.15 Vout (max) (V) 3.45 Applications GTL Features Partial power down (Ioff) Technology family GTL Supply current (max) (mA) 60 Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 64 137.7 mm² 17 x 8.1
  • Member of Texas Instruments' Widebus™ Family
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • D-Type Flip-Flops With Qualified Storage Enable
  • Translates Between GTL/GTL+ Signal Levels and LVTTL Logic Levels
  • Supports Mixed-Mode (3.3 V and 5 V) Signal Operation on A-Port and Control Inputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors on A Port
  • Distributed VCC and GND Pins Minimize High-Speed Noise
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and Widebus are trademarks of Texas Instruments.

  • Member of Texas Instruments' Widebus™ Family
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • D-Type Flip-Flops With Qualified Storage Enable
  • Translates Between GTL/GTL+ Signal Levels and LVTTL Logic Levels
  • Supports Mixed-Mode (3.3 V and 5 V) Signal Operation on A-Port and Control Inputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors on A Port
  • Distributed VCC and GND Pins Minimize High-Speed Noise
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and Widebus are trademarks of Texas Instruments.

The SN74GTL16622A is an 18-bit registered bus transceiver that provides LVTTL-to-GTL/GTL+ and GTL/GTL+-to-LVTTL signal-level translation. This device is partitioned as two separate 9-bit transceivers with individual clock-enable controls and contains D-type flip-flops for temporary storage of data flowing in either direction. This device provides an interface between cards operating at LVTTL logic levels and a backplane operating at GTL/GTL+ signal levels. Higher speed operation is a direct result of the reduced output swing (<1 V), reduced input threshold levels, and OEC™ circuitry.

The user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or the preferred higher noise margin GTL+ (VTT = 1.5 V and VREF = 1 V) signal levels. GTL+ is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The B port normally operates at GTL or GTL+ signal levels, while the A-port and control inputs are compatible with LVTTL logic levels and are 5-V tolerant. VREF is the reference input voltage for the B port.

Data flow in each direction is controlled by the output-enable (OEAB\ and OEBA\) and clock (CLKAB and CLKBA) inputs. The clock-enable (CEAB\ and CEBA\) inputs control each 9-bit transceiver independently, which makes the device more versatile. For A-to-B data flow, the device operates on the low-to-high transition of CLKAB if CEAB\ is low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B, but uses OEBA\, CLKBA, and CEBA\.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Active bus-hold circuitry holds unused or undriven LVTTL inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTL16622A is an 18-bit registered bus transceiver that provides LVTTL-to-GTL/GTL+ and GTL/GTL+-to-LVTTL signal-level translation. This device is partitioned as two separate 9-bit transceivers with individual clock-enable controls and contains D-type flip-flops for temporary storage of data flowing in either direction. This device provides an interface between cards operating at LVTTL logic levels and a backplane operating at GTL/GTL+ signal levels. Higher speed operation is a direct result of the reduced output swing (<1 V), reduced input threshold levels, and OEC™ circuitry.

The user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or the preferred higher noise margin GTL+ (VTT = 1.5 V and VREF = 1 V) signal levels. GTL+ is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The B port normally operates at GTL or GTL+ signal levels, while the A-port and control inputs are compatible with LVTTL logic levels and are 5-V tolerant. VREF is the reference input voltage for the B port.

Data flow in each direction is controlled by the output-enable (OEAB\ and OEBA\) and clock (CLKAB and CLKBA) inputs. The clock-enable (CEAB\ and CEBA\) inputs control each 9-bit transceiver independently, which makes the device more versatile. For A-to-B data flow, the device operates on the low-to-high transition of CLKAB if CEAB\ is low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B, but uses OEBA\, CLKBA, and CEBA\.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Active bus-hold circuitry holds unused or undriven LVTTL inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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기술 자료

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유형 직함 날짜
* Data sheet 18-Bit LVTTL-to-GTL/GTL+ Bus Transceiver datasheet (Rev. F) 2001/08/06
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024/07/12
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024/07/03
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Voltage Translation Buying Guide (Rev. A) 2021/04/15
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
User guide GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 2001/09/15
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A) 1997/03/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01
Selection guide Logic Guide (Rev. AC) PDF | HTML 1994/06/01

설계 및 개발

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시뮬레이션 모델

SN74GTL16622A IBIS Model

SCEM155.ZIP (13 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
TSSOP (DGG) 64 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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