THS788
- Four Event Channels + Sync Channel
- Single-Shot Accuracy: 8 ps, One Sigma
- Precision: 13 ps
- Result Interface Range: 0 s to 7 s
- Event Input Rate: 200 MHz
- Programmable Serial-Result Interface Speed:
75 MHz to 300 MHz - High-Speed Serial Host-Processor Bus Interface:
50 MHz - High-Speed LVDS-Compatible Serial-Result Bus
per Channel - Programmable Serial-Result Bus Length
- Temperature Sensor
- Single 3.3-V Supply
- Power: 675 mW per Channel, 18 Bits, 300 MHz,
Four Channels
The THS788 device is a four-channel timing measurement unit (TMU) that incorporates a time-to-digital converter (TDC) architecture for fast and accurate measurements. The TMU can provide 8 ps of single-shot accuracy. The TDC has a 13-ps resolution (LSB), which is derived from an external master clock of 200 MHz. The TDC uses fast LVDS-compatible interfaces for all of its event inputs and serial result outputs, which allows for fast and reliable data transfer. Each channel can process timestamps at a maximum speed of 200 MSPS.
The THS788 device has a wide range of programmability that makes it flexible in different applications. The serial-result interface has programmable data length, frequency, and data-rate mode (DDR and normal). The event channels can be programmed to take timestamps on rising edges or falling edges. The TMU has a mode for event management, in which the user can program wait times before measurements. This programming is achieved through a 50-MHz LVCMOS interface.
The THS788 device is available in an HTQFP-100 package with a heat slug on top for easy heat-sink access. The device is built using TIs RF SiGe process technology, which allows for maximum timing accuracy with low power.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | THS788 Quad-Channel Time Measurement Unit (TMU) datasheet (Rev. D) | PDF | HTML | 2015/03/18 |
Application note | Noise Analysis for High Speed Op Amps (Rev. A) | 2005/01/17 |
설계 및 개발
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패키지 | 핀 | 다운로드 |
---|---|---|
HTQFP (PFD) | 100 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치