인터페이스 기타 인터페이스

4채널 600Mbps~3.75Gbps 다중 속도 트랜시버

제품 상세 정보

Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
BGA (ZEL) 289 361 mm² 19 x 19
  • Four-Channel 600Mbps to 3.75Gbps Multi-Rate Transceiver
  • Supports 10GbE (XAUI), 1X/2X/10X Fibre Channel (FC), CPRI (x1/x2/x4), OBSAI (x1/x2/x4), and 1GbE (1000Base-X) Data Rates
  • Complete IEEE Compliant 10 GbE XGXS (XAUI) Compliant Core and 1000Base-X PCS Support
  • Supports Independent Channel SERDES Operation Modes in 8/10 Bit Data Modes (TBI and 8 Bit + Control)
  • Serial Side Transmit De-Emphasis and Receive Adaptive Equalization to Allow Extended Backplane Reach
  • Low Jitter LC Oscillator Jitter-Cleaner Allows use of Poor Quality REFCLK
  • Full Datapath Loopback Capability (Serial/Parallel Side)
  • Support PRBS 27-1 and 223 - 1 Gen/Verify. Support standard defined CJPAT, CRPAT, High and Low Frequency, and Mixed Freq Testing.
  • XGMII/GMII/RGMII: HSTL Class 1 I/O With On-Chip 50 Termination on Inputs/Outputs (1.5/1.8 V Power Supply)
  • XGMII/GMII/RGMII: Source And Data Centered I/O Timing Modes
  • Supports Jumbo Packet (9600 byte maximum) Operation.
  • XAUI Align Character Skew Support of 30 Bit Times at Chip Pins
  • MDIO: IEEE 802.3ae Clause 22 and Clause 45 Compliant Management Data Input / Output Interface Modes (Either 1.2 V or 2.5 V MDIO I/O)
  • 1.2 V Core, 1.5 V/1.8 V HSTL I/O Supply, and 2.5 V LVCMOS I/O Supply
  • JTAG: IEEE 1149.1/1149.6 Test Interface
  • ±200 ppm Clock Tolerance in XAUI TX and 1000Base-X/XAUI RX Datapaths
  • 90 nm Advanced CMOS Technology
  • Package: PBGA, 19×19mm, 289 Ball, 1mm Pitch
  • 1.3W Maximum Power Dissipation (1.5 V HSTL XAUI Mode, Input HSTL Termination Disabled)
  • Asymmetric RX/TX Rates Supported in Independent Channel Modes
  • Industrial Ambient Operating Temperature (–40°C to 85°C) at Full Rate
  • APPLICATIONS
    • Gigabit Ethernet links
    • CPRI/OBSAI Links
    • Point-to-Point High-Speed Backplane Links
  • Four-Channel 600Mbps to 3.75Gbps Multi-Rate Transceiver
  • Supports 10GbE (XAUI), 1X/2X/10X Fibre Channel (FC), CPRI (x1/x2/x4), OBSAI (x1/x2/x4), and 1GbE (1000Base-X) Data Rates
  • Complete IEEE Compliant 10 GbE XGXS (XAUI) Compliant Core and 1000Base-X PCS Support
  • Supports Independent Channel SERDES Operation Modes in 8/10 Bit Data Modes (TBI and 8 Bit + Control)
  • Serial Side Transmit De-Emphasis and Receive Adaptive Equalization to Allow Extended Backplane Reach
  • Low Jitter LC Oscillator Jitter-Cleaner Allows use of Poor Quality REFCLK
  • Full Datapath Loopback Capability (Serial/Parallel Side)
  • Support PRBS 27-1 and 223 - 1 Gen/Verify. Support standard defined CJPAT, CRPAT, High and Low Frequency, and Mixed Freq Testing.
  • XGMII/GMII/RGMII: HSTL Class 1 I/O With On-Chip 50 Termination on Inputs/Outputs (1.5/1.8 V Power Supply)
  • XGMII/GMII/RGMII: Source And Data Centered I/O Timing Modes
  • Supports Jumbo Packet (9600 byte maximum) Operation.
  • XAUI Align Character Skew Support of 30 Bit Times at Chip Pins
  • MDIO: IEEE 802.3ae Clause 22 and Clause 45 Compliant Management Data Input / Output Interface Modes (Either 1.2 V or 2.5 V MDIO I/O)
  • 1.2 V Core, 1.5 V/1.8 V HSTL I/O Supply, and 2.5 V LVCMOS I/O Supply
  • JTAG: IEEE 1149.1/1149.6 Test Interface
  • ±200 ppm Clock Tolerance in XAUI TX and 1000Base-X/XAUI RX Datapaths
  • 90 nm Advanced CMOS Technology
  • Package: PBGA, 19×19mm, 289 Ball, 1mm Pitch
  • 1.3W Maximum Power Dissipation (1.5 V HSTL XAUI Mode, Input HSTL Termination Disabled)
  • Asymmetric RX/TX Rates Supported in Independent Channel Modes
  • Industrial Ambient Operating Temperature (–40°C to 85°C) at Full Rate
  • APPLICATIONS
    • Gigabit Ethernet links
    • CPRI/OBSAI Links
    • Point-to-Point High-Speed Backplane Links

The TLK3134 is a flexible four-channel independently configurable serial transceiver. It can be configured to be compliant with the 10Gbps Ethernet XAUI specification. It can also be configured to be compliant with the 1000Base-X 1Gbps Ethernet Specification (Auto-Negotiation not supported). The TLK3134 provides high-speed bidirectional point-to-point data transmissions with up to 30 Gbps of raw data transmission capacity. The primary application of this device is in backplanes and front panel connections requiring 10Gbps connections over controlled impedance media of approximately 50. The transmission media can be printed circuit board (PCB) traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling into the lines.

The TLK3134 performs the parallel-to-serial, serial-to-parallel conversion, and clock extraction functions for a physical layer interface. The TLK3134 provides a complete XGXS/PCS function defined in Clause 47/48 of the IEEE 802.3ae 10Gbps Ethernet standard. The TLK3134 also provides 1000Base-X (PCS) layer functionality described in Clause 36 of 802.3-2002. The serial transmitter is implemented using differential Current Mode Logic (CML) with integrated termination resistors.

The TLK3134 can be optionally configured as a XAUI or 10GFC transceiver. TLK3134 supports a 32-bit data path, 4-bit control, 10 Gigabit Media Independent Interface (XGMII) to the protocol device.

Many common applications may be enabled by way of externally available control pins. Detailed control of the TLK3134 on a per channel basis is available by way of accessing a register space of control bits available through a two-wire access port called the Management Data Input/Output (MDIO) interface.

The PCS (Physical Coding Sublayer) functions such as the CTC FIFO are designed to be compliant for an IEEE 802.3 XAUI or 1000Base-X PCS link. However, each of the PCS functions may be disabled or bypassed until the TLK3134 is operating at its most basic state, that of a simple four channel 10-bit SERDES suitable for a wide range of applications such as CPRI or OBSAI wireless infrastructure links.

The differential output swing for the TLK3134 is suitable for compliance with IEEE 802.3 XAUI links, which is also suitable for CPRI LV serial links. The TLK3134 provides for setting larger output signal swing suitable for CPRI HV links by setting an appropriate register bit available though MDIO.

The TLK3134 is a flexible four-channel independently configurable serial transceiver. It can be configured to be compliant with the 10Gbps Ethernet XAUI specification. It can also be configured to be compliant with the 1000Base-X 1Gbps Ethernet Specification (Auto-Negotiation not supported). The TLK3134 provides high-speed bidirectional point-to-point data transmissions with up to 30 Gbps of raw data transmission capacity. The primary application of this device is in backplanes and front panel connections requiring 10Gbps connections over controlled impedance media of approximately 50. The transmission media can be printed circuit board (PCB) traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling into the lines.

The TLK3134 performs the parallel-to-serial, serial-to-parallel conversion, and clock extraction functions for a physical layer interface. The TLK3134 provides a complete XGXS/PCS function defined in Clause 47/48 of the IEEE 802.3ae 10Gbps Ethernet standard. The TLK3134 also provides 1000Base-X (PCS) layer functionality described in Clause 36 of 802.3-2002. The serial transmitter is implemented using differential Current Mode Logic (CML) with integrated termination resistors.

The TLK3134 can be optionally configured as a XAUI or 10GFC transceiver. TLK3134 supports a 32-bit data path, 4-bit control, 10 Gigabit Media Independent Interface (XGMII) to the protocol device.

Many common applications may be enabled by way of externally available control pins. Detailed control of the TLK3134 on a per channel basis is available by way of accessing a register space of control bits available through a two-wire access port called the Management Data Input/Output (MDIO) interface.

The PCS (Physical Coding Sublayer) functions such as the CTC FIFO are designed to be compliant for an IEEE 802.3 XAUI or 1000Base-X PCS link. However, each of the PCS functions may be disabled or bypassed until the TLK3134 is operating at its most basic state, that of a simple four channel 10-bit SERDES suitable for a wide range of applications such as CPRI or OBSAI wireless infrastructure links.

The differential output swing for the TLK3134 is suitable for compliance with IEEE 802.3 XAUI links, which is also suitable for CPRI LV serial links. The TLK3134 provides for setting larger output signal swing suitable for CPRI HV links by setting an appropriate register bit available though MDIO.

다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기6
유형 직함 날짜
* Data sheet 4 Channel Multi-Rate Transceiver datasheet (Rev. F) 2009/12/17
User guide User's Guide for Sonic MDIO Software 2013/11/26
EVM User's guide TLK3134 XAUI Transceiver / 4 Channel Multi-Rate Tranceiver EVM User's Guide (Rev. A) 2013/11/20
White paper Implementing a CameraLink HS Interface Using the TLK3134 2012/03/30
Application note TLK313x/CDCM7005 Multi-hop Performance 2009/11/01
User guide TLK3134 XAUI Transceiver / 4 Channel Multi-Rate Tranceiver EVM User's Guide 2008/05/20

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

시뮬레이션 모델

TLK3134 IBIS Model Version 1.2

SLLM055.ZIP (252 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 다운로드
BGA (ZEL) 289 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상