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홈
로직 및 전압 변환
전압 변환기 및 레벨 시프터
전압 변환기

TWL1200-Q1

활성

차량용 카탈로그 SDIO, UART 및 오디오 전압 변환 트랜시버

지금 주문
데이터 시트

TWL1200-Q1

활성
데이터 시트 지금 주문

제품 상세 정보

Bits (#) 19 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction, Direction-controlled Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 1.1 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO, UART Audio Features Output enable Technology family TWL Supply current (max) (mA) 0.03 Rating Automotive Operating temperature range (°C) -40 to 85
Bits (#) 19 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction, Direction-controlled Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 1.1 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO, UART Audio Features Output enable Technology family TWL Supply current (max) (mA) 0.03 Rating Automotive Operating temperature range (°C) -40 to 85
TQFP (PFB) 48 81 mm² 9 x 9
  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 3: –40°C to +85°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H1C
    • Device CDM ESD Classification Level C3B
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility Gap
    Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 3: –40°C to +85°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H1C
    • Device CDM ESD Classification Level C3B
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility Gap
    Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II

The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.

The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.
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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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5개 모두 보기
유형 직함 날짜
* Data sheet SDIO, UART, and Audio Voltage-Translation Transceiver, TWL1200-Q1 datasheet (Rev. A) 2012/04/28
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024/07/12
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024/07/03
Selection guide Voltage Translation Buying Guide (Rev. A) 2021/04/15
More literature Automotive Logic Devices Brochure 2014/08/27

설계 및 개발

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패키지 핀 CAD 기호, 풋프린트 및 3D 모델
TQFP (PFB) 48 Ultra Librarian
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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포럼 주제 모두 보기(영문)

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