ULN2003V12
- 7-Channel High Current Sink Drivers
- Supports Up to 20-V Output Pullup Voltage
- Low Output VOL of 0.6 V (Typical) With:
- 100-mA (Typical) Current Sink per Channel at 3.3-V Logic Input(1)
- 140-mA (Typical) Current Sink per Channel at 5-V Logic Input(1)
- Compatible to 3.3-V and 5-V Microcontrollers and Logic Interface
- Internal Free-Wheeling Diodes for Inductive Kick-Back Protection
- Input Pulldown Resistors Allows Tri-Stating the Input Driver
- Input RC-Snubber to Eliminate Spurious Operation in Noisy Environment
- Low Input and Output Leakage Currents
- ESD Protection Exceeds JESD 22:
- 2-kV HBM, 500-V CDM
The ULN2003V12 device is a low-power upgrade of TI’s popular ULN2003 family of 7-channel Darlington transistor array. The ULN2003V12 sink driver features 7 low-output impedance drivers that minimize on-chip power dissipation. When driving a typical 12-V relay coil, a ULN2003V12 can dissipate up to 12 times lower power than an equivalent ULN2003A. The ULN2003V12 driver is pin-to-pin compatible with ULN2003 family of devices.
The ULN2003V12 supports 3.3-V to 5-V CMOS logic input interface thus making it compatible to a wide range of microcontrollers and other logic interfaces. The ULN2003V12 also supports other logic input levels, like TTL or 1.8 V. Each output of the ULN2003V12 features an internal free-wheeling diode connected in a common-cathode configuration at the COM pin.
The ULN2003V12 provides flexibility of increasing current sink capability through combining several adjacent channels in parallel. Under typical conditions the ULN2003V12 can support up to 1 A of load current when all 7-channels are connected in parallel.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | ULN2003V12 7-Channel Relay and Inductive Load Sink Driver datasheet (Rev. C) | PDF | HTML | 2016/11/18 |
| Application note | Stepper Motor Driving with Peripheral Drivers (Rev. A) | PDF | HTML | 2016/12/02 | |
| Application note | Improved Thermal Dissipation and Energy Efficiency for Peripheral Driving | 2014/10/30 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.