BQ79600-Q1
- Qualified for automotive applications
- AEC-Q100 Qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Functional Safety-Compliant
- Developed for functional safety applications
- Documentation available to aid ISO 26262 system design
- Systematic capability up to ASIL-D
- Hardware capability up to ASIL-D
- Automatic wake up of BMS/BMU system when fault is detected in ring architecture
- Support supply from 4.75-V to 40-V
- UART/SPI Host interface
- Compatible with 3.3-V/5-V logic
- Isolated differential daisy chain
- Support ring architecture with one device
- Support transformer/ capacitor isolation
- Designed for BCI/EMI/EMC robustness
- Supports BQ7961X-Q1 family, BQ7965X, BQ7963X and future products
The BQ79600-Q1 is a communication (bridge) IC designed to interface between a microcontroller (MCU) and TI battery monitoring ICs, for example the BQ7961X-Q1. The information from the MCU is translated by the device to signals recognized by TI’s battery management daisy chain protocol, and transmitted out. And signals from daisy chain are decoded to bit stream and then sent back to MCU.
When the MCU and PMIC are in SHUTDOWN/ SLEEP, the BQ79600-Q1 can wake them up if any unmasked fault is detected when using ring architecture.
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開發板
BQ79600EVM — 具有自動主機喚醒功能且符合功能安全規範的 SPI/UART 轉菊輪鍊橋接器介面
The BQ79600EVM is an evaluation module (EVM) for the BQ79600-Q1 device used as bridge IC to interface between a microcontroller (MCU) and the TI battery monitoring ICs (for example, BQ7961X-Q1 and BQ79606A-Q1). The information from the MCU is translated by the device to pulses recognized by TI's (...)
支援軟體
參考設計
TIDA-010253 — Battery control unit reference design for energy storage systems
This reference design is a central controller for a high-voltage Lithium-ion (Li-ion), lithium iron phosphate (LiFePO4) battery rack. This design provides driving circuits for high-voltage relay, communication interfaces, (including RS-485, controller area network (CAN), daisy chain, and Ethernet), (...)
Design guide: PDF
封裝 | 引腳 | 下載 |
---|---|---|
TSSOP (PW) | 16 | 檢視選項 |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。