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CC2652RB

現行

具有無晶體震盪 BAW 諧振器的 SimpleLink™ 32 位元 ARM Cortex-M4F 多協定 2.4 GHz 無線 MCU

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CC2652RB

現行
產品規格表 立即訂購

產品詳細資料

CPU Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Cryptographic accelerators RNG Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Edge AI enabled No
CPU Arm® Cortex®-M4F Technology Bluetooth® LE, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 UART, 2 comparators, 3 SPI, 4 timers, 8-bit DAC, BAW, I2C, I2S, Sensor controller Features Advertising extension, Channel select algorithm, Direction finding, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 31 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Cryptographic accelerators RNG Operating system FreeRTOS, TI RTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 85 Edge AI enabled No
VQFN (RGZ) 48 49 mm² (7 mm × 7 mm)
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
    • On-chip buck DC/DC converter
  • Low power
    • Wide supply voltage range
      • Normal operation: 1.8 to 3.8 V
      • External regulator mode: 1.7 to 1.95 V
    • Active mode RX: 7.3 mA
    • Active mode TX 0 dBm: 7.9 mA
    • Active mode TX 5 dBm: 10.2 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
  • Radio section
    • 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
    • Programmable output power up to +5 dBm
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • EN 300 328, (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T66 (Japan)
  • Wireless protocols
    • Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.

The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:

  • Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
  • Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
  • Optimized Bill of Material (BOM) and PCB area savings (12% average).
  • Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
  • Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
  • Mitigation of potential timing related side channel attacks from external clock tampering.

The highlighted features of the SimpleLink™ MCU platform include:

  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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CC2652R 現行 具有 352kB 快閃記憶體的 SimpleLink™ 32 位元 Arm Cortex-M4F 多協定 2.4 GHz 無線 MCU This product does not include the BAW resonator and requires an external 48MHz crystal.
CC2652P 現行 具有整合式功率放大器的 SimpleLink™ ARM Cortex-M4F 多協定 2.4 GHz 無線 MCU This product offers an integrated power amplifier but does not offer BAW resonator solution.

技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CC2652RB SimpleLink™ Crystal-less BAW Multiprotocol 2.4 GHz Wireless MCU datasheet (Rev. D) PDF | HTML 2021/2/16
* 使用指南 CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 2024/6/28
* 勘誤表 CC2652RB SimpleLink™ Multiprotocol 2.4-GHz MCU Device Revision E Silicon Errata (Rev. A) 2019/12/4
應用說明 Configuration methods for BQB RF-PHY testing and SRRC fixed frequency testing for TI Bluetooth products (Rev. A) PDF | HTML 2026/5/29
應用說明 How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025/11/18
應用說明 CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024/8/6
應用說明 CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2024/5/2
應用說明 Antenna Impedance Measurement and Matching PDF | HTML 2022/3/22
選擇指南 無線連線技術選擇指南 (Rev. B) Download English Version (Rev.B) 2022/3/7
應用說明 Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022/2/25
應用說明 Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 2021/12/20
更多文件說明 Bluetooth® Low Energy connectivity solutions for automotive applications 2021/12/15
應用說明 Hardware Migration From CC26x0 to CC26x2R (Rev. D) 2021/8/23
技術文章 How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic PDF | HTML 2021/7/23
Application brief Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A) PDF | HTML 2021/5/13
白皮書 Dynamic Multi-Protocol (DMM) Performance 2021/4/21
白皮書 Exploring Thread and Zigbee for home and building automation PDF | HTML 2021/4/12
技術文章 Back to basics: Exploring the benefits of affordable Bluetooth® Low Energy PDF | HTML 2020/8/20
網路安全諮詢 Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020/7/17
網路安全諮詢 Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 2020/6/5
網路安全諮詢 Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/5/18
應用說明 Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 2020/3/31
應用說明 Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 2020/2/5
應用說明 Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 2020/1/28
應用說明 Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 2020/1/27
應用說明 Minimizing Frequency Error Due to Soldering Process on CC2652RB Crystal-Less MCU PDF | HTML 2020/1/15
技術文章 Testing TI BAW resonator technology in mechanical shock and vibration environments PDF | HTML 2020/1/9
技術文章 Going crystal-less is easy with the world's first crystal-less, wireless SimpleLin PDF | HTML 2020/1/2
白皮書 Exploring IoT wireless connectivity in mechanical shock and vibration environme 2019/11/7
技術文章 VIDEO: TI Bulk Acoustic Wave (BAW) resonator technology with Bluetooth 5 PDF | HTML 2019/9/26
應用說明 Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 2019/9/23
Application brief What's New in Zigbee 3.0 (Rev. A) PDF | HTML 2019/6/6
應用說明 Bluetooth® Low Energy Tree Structure Network PDF | HTML 2019/5/29
應用說明 Debugging Communication Range (Rev. A) PDF | HTML 2019/5/23
應用說明 Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs PDF | HTML 2019/4/15
技術文章 Top 5 things to know about TI BAW resonator technology PDF | HTML 2019/2/27
應用說明 Getting Started With CC2652RB for Crystal-less BAW Operation PDF | HTML 2019/2/20
白皮書 SimpleLink Crystal-Less Wireless MCU based on TI BAW technology 2019/2/18
應用說明 Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 2019/1/10
應用說明 RF PCB Simulation Cookbook 2019/1/9
使用指南 LP-CC2652RB quick start guide 2018/12/21
應用說明 Low-Power ADC Solution for CC13x2 and CC26x2 2018/3/2
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller PDF | HTML 2018/2/27
應用說明 Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 2018/2/27
應用說明 Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 2017/3/5
應用說明 TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017/2/28

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WriteNow! 系統內編程器系列是可編程產業的一大突破。此編程器支援多家製造商的眾多裝置 (例如微控制器、記憶體、CPLD 與其他可編程裝置)。其尺寸精巧，便於整合至 ATE 與固定裝置。編程器可單機運作，或透過內建的 RS-232、LAN 與 USB 連接埠與主機電腦連線，並隨附操作簡易的工具軟體。

從：Algocraft
支援產品和硬體
軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

支援產品和硬體
軟體開發套件 (SDK)

SIMPLELINK-TI-OPENTHREAD-SDK — SimpleLink™ family of devices OpenThread software

This Texas Instruments OpenThread GitHub repository (ot-ti) contains all the software development components and tools that enable engineers to develop Thread based products.
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軟體開發套件 (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK — TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

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IDE、配置、編譯器或偵錯程式

ARM-CGT — ARM Code Generation Tools - Compiler

The TI Arm® compiler tools are an essential component of the CCStudio™ development ecosystem, providing robust support for TI Arm-based platforms. They are engineered to maximize the potential of TI Arm Cortex®-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the (...)

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IDE、配置、編譯器或偵錯程式

ARM-CGT-CLANG — Arm® code generation tools - compiler

The TI Arm® compiler tools are an essential component of the CCStudio™ development ecosystem, providing robust support for TI Arm-based platforms. They are engineered to maximize the potential of TI Arm Cortex®-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the (...)

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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

支援產品和硬體
IDE、配置、編譯器或偵錯程式

CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
支援產品和硬體
IDE、配置、編譯器或偵錯程式

SENSOR-CONTROLLER-STUDIO — Sensor Controller Studio

Sensor Controller Studio is used to write, test and debug code for the CC26xx/CC13xx Sensor Controller, enabling ultra-low power application design. The tool generates an interface driver consisting of C source files with the firmware image, associated definitions, and generic functions that allow (...)

支援產品和硬體
IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

支援產品和硬體
線上培訓

SIMPLELINK-ACADEMY-CC13XX-CC26XX — SimpleLink™ CC13xx and CC26xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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軟體程式設計工具

FLASH-PROGRAMMER-2 — SmartRF Flash Programmer v2

SmartRF Flash Programmer 2 可在德州儀器 ARM 架構低功耗 RF 無線 MCU 中，透過偵錯與序列介面進行快閃記憶體編程。查看支援產品相容性清單。Uniflash 也可用於編程任何 SimpleLink 產品。

SmartRF Flash Programmer 可在德州儀器 8051 型低功耗 RF 無線 MCU 中的進行快閃記憶體編程，並可在 SmartRF05 評估電路板、SmartRF 收發器評估電路板 (TrxEB) 和 CC 偵錯器上升級韌體和開機載入程式。

SmartRF Flash Programmer 和 SmartRF Flash (...)

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軟體程式設計工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash 是 TI 龐大 CCStudio™ 開發生態系統的一部分，是一款用於在 TI 微控制器與無線連線裝置上對晶片內快閃記憶體進行燒錄，以及在 TI 處理器上對板載快閃記憶體進行燒錄的軟體工具。UniFlash 提供圖形化介面與命令行介面，並可在桌面上或雲端中執行。

UniFlash 可從 CCStudio™ 開發人員區上的雲端執行，或在下載後於 Windows®、Linux® 和 macOS® 電腦中使用。

請注意，mmWave、AMx、K2G 和 J7 裝置不支援 macOS。AMx、K2G 和 J7 裝置僅於命令列上支援。

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支援軟體

RF-RANGE-ESTIMATOR — RF Range Estimator

This tool is used to calculate a range estimate for indoor and outdoor RF links using TI wireless devices. The outdoor calculation is based upon Line-of-Sight (LOS). For the indoor estimation, construction materials can be selected that are between the Tx and Rx unit. The greater the attenuation (...)
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計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
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計算工具

PACKET-SNIFFER-2 — SmartRF Packet Sniffer 2

The SmartRF Packet Sniffer is a PC software application that can display and store radio packets captured by a listening RF device. The capture device is connected to the PC via USB. Various RF protocols are supported. The Packet Sniffer filters and decodes packets and displays them in a convenient (...)

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計算工具

SMARTRF-STUDIO-7 — SmartRF Studio

SmartRF™ Studio 是一款 Windows 應用程式，功用在於協助射頻系統的設計人員在為所有 TI CC1xxx 及 CC2xxx 低功耗射頻裝置設計過程中，能在早期階段輕鬆評估無線電。此程式簡化了配置暫存器值和命令的產生，以及射頻系統的實際測試和除錯。

SmartRF Studio 支援下列 TI 裝置：

 

資源

支援產品和硬體
計算工具

ZIGBEE-POWER-CALC — Z-Stack™ 功率計算機工具

此工具讓 SimpleLink™ Z-Stack™ 軟體使用者可在 Zigbee 應用中分析休眠終端裝置的系統電源設定檔。此計算機可讓使用者評估系統電池的潛在使用壽命，並透過配置系統設定、堆疊參數、有效載荷設定檔和使用參數來最佳化電池壽命，從而透過模擬系統設計選擇來實現預期的性能目標。
支援產品和硬體
設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

SimpleLink 硬體設計審核流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。一個簡單的三步驟流程用於請求審查，以及相關技術文件和資源的連結，可在此處找到。

入門指南

一般設計問題應張貼在我們的 E2E 討論區中，然後才能要求 2.4 GHz 硬體設計審查。

請確實備妥下列必要文件，隨硬體設計審查申請表一起傳送：

  • 確認產品頁上提供的所有硬體文件均已經過審查，例如產品規格表、設計指南、使用指南和其他硬體資源
  • 電路圖的可攜式文件格式 (PDF) 版本可供檢閱
  • 物料清單 (BOM) 可供檢閱
  • 堆疊詳細資料可供檢閱
  • 電路板設計的 Gerber 檔案 (含零件位置和參考指示項) (...)
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RGZ) 48 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

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