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工業數位微鏡裝置（DMD）
UV (<420nm) DMD

DLP300S

不推薦在新設計中採用

0.3 吋 WQHD 近 UV DLP® 數位微鏡裝置 (DMD)

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產品規格表
DLP300S 不建議用於新設計
此產品將繼續向現有客戶提供。新設計應考量替代產品。
open-in-new 比較替代產品
功能相同，但引腳輸出與所比較的裝置不同
DLP301S 現行 0.3 吋 WQHD 高功率近 UV DLP® 數位微鏡裝置 (DMD) Same micromirror array in a package with higher-power output capability

DLP300S

不推薦在新設計中採用
產品規格表 立即訂購

產品詳細資料

Illumination wavelength (min) (nm) 400 Illumination wavelength (max) (nm) 550 Display resolution (max) WQHD (2560x1440) Pattern rate, binary (max) (Hz) 60 Pattern rate, 8-bit (max) (Hz) 60 Array diagonal (in) 0.3 Micromirror array size 1280 x 720 Micromirror pitch (mm) 0.0054 Micromirror array orientation Orthogonal Rating Catalog Operating temperature range (°C) 0 to 40
Illumination wavelength (min) (nm) 400 Illumination wavelength (max) (nm) 550 Display resolution (max) WQHD (2560x1440) Pattern rate, binary (max) (Hz) 60 Pattern rate, 8-bit (max) (Hz) 60 Array diagonal (in) 0.3 Micromirror array size 1280 x 720 Micromirror pitch (mm) 0.0054 Micromirror array orientation Orthogonal Rating Catalog Operating temperature range (°C) 0 to 40
DLP-S245 (FQK) 57 127.4 mm² 18.2 x 7
  • 0.3-Inch (7.93-mm) diagonal micromirror array
    • 1280 × 720 array of aluminum micrometer-sized mirrors, in an orthogonal layout
    • 3.6 Megapixels, 2560 x 1440 pixels on the resin
    • 5.4 micron micromirror pitch
    • ±17° micromirror tilt (relative to flat surface)
    • Side illumination for optimal efficiency and optical engine size
    • Polarization independent aluminum micromirror surface
  • 8-Bit SubLVDS input data bus
  • Dedicated DLPC1438 3D print controller and DLPA200x PMIC/LED driver for reliable operation
  • 0.3-Inch (7.93-mm) diagonal micromirror array
    • 1280 × 720 array of aluminum micrometer-sized mirrors, in an orthogonal layout
    • 3.6 Megapixels, 2560 x 1440 pixels on the resin
    • 5.4 micron micromirror pitch
    • ±17° micromirror tilt (relative to flat surface)
    • Side illumination for optimal efficiency and optical engine size
    • Polarization independent aluminum micromirror surface
  • 8-Bit SubLVDS input data bus
  • Dedicated DLPC1438 3D print controller and DLPA200x PMIC/LED driver for reliable operation

The DLP300S digital micromirror device (DMD) is a digitally controlled micro-opto-electromechanical system (MOEMS) spatial light modulator (SLM). When coupled to an appropriate optical system, the DMD displays a very crisp and high quality image. This DMD is part of the chipset comprising the DLP300S DMD, DLPC1438 3D print controller and DLPA200x PMIC/LED driver. The compact physical size of the DLP300S DMD coupled with the controller and the PMIC/LED driver provides a complete system solution that enables fast, high resolution, reliable DLP 3D printers.

Get started with TI DLP® light-control technology page to learn how to get started with the DLP300S.

The DLP advanced light control resources on ti.com accelerate time to market, which include reference designs, optical module manufacturers, and DLP design network partners.

The DLP300S digital micromirror device (DMD) is a digitally controlled micro-opto-electromechanical system (MOEMS) spatial light modulator (SLM). When coupled to an appropriate optical system, the DMD displays a very crisp and high quality image. This DMD is part of the chipset comprising the DLP300S DMD, DLPC1438 3D print controller and DLPA200x PMIC/LED driver. The compact physical size of the DLP300S DMD coupled with the controller and the PMIC/LED driver provides a complete system solution that enables fast, high resolution, reliable DLP 3D printers.

Get started with TI DLP® light-control technology page to learn how to get started with the DLP300S.

The DLP advanced light control resources on ti.com accelerate time to market, which include reference designs, optical module manufacturers, and DLP design network partners.
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類型 標題 日期
* Data sheet DLP300S 0.3-Inch 3.6-Megapixel DMD for Low Cost TI DLP 3D Printers datasheet (Rev. B) PDF | HTML 2022年 5月 17日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點