ESD451
- IEC 61000-4-2 level 4 ESD protection:
- ±30kV contact discharge
- ±30kV air gap discharge
- IEC 61000-4-5 surge protection:
- 6A (8/20µs)
- IO capacitance:
- 0.5pF (typical)
- DC breakdown voltage: ±8V (typical)
- Ultra low leakage current: 50nA (maximum)
- Extremely low ESD clamping voltage
- 10.4V at 16A TLP
- RDYN: 0.19Ω
- Low insertion loss: 3.5GHz (-3dB bandwidth)
- Supports high speed interfaces up to 6Gbps
- Industrial temperature range: –55°C to +150°C
- Space saving industry standard 0201 (0.6mm x 0.3mm) and 0402 footprint (1.0mm x 0.6mm)
The ESD451 is a bidirectional ESD protection diode for protecting data line and other I/O ports. The ESD451 is rated to dissipate ESD strikes up to ±30kV per the IEC 61000-4-2 international standard (greater than Level 4).
This device features a 0.5pF (typical) IO capacitance enabling high-speed interface protection for protocols such as USB 3.0. The extremely low dynamic resistance (0.19Ω) and clamping voltage (10.4V at 16A TLP) is specified for system-level protection against transient events.
The ±30kV ESD rating and 6A surge provides robust transient protection in a tiny package for protecting 5.5V power rails and data lines in portable electronics and other space constrained applications such as wearables.
The ESD451 is offered in the industry standard 0201 and 0402 package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | ESD451 1-Channel ±30kV Bidirectional ESD Diode in an 0201 and 0402 Package datasheet (Rev. B) | PDF | HTML | 2025年 12月 2日 |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — 適用於 ESD 二極體封裝的通用評估模組，包括 0402、0201等
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| X1SON (DPY) | 2 | Ultra Librarian |
| X2SON (DPL) | 2 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。