ESD751
- IEC 61000-4-2 level 4 ESD protection:
- ±22-kV or ±15-kV contact discharge
- ±22-kV or ±15-kV air-gap discharge
- Robust surge protection:
- IEC 61000-4-5 (8/20 µs): 2.8 A or 1.8 A
- 24-V working voltage
- Bidirectional ESD protection
- Low clamping voltage protects downstream components
- Temperature range: –55°C to +150°C
- I/O capacitance = 1.6 pF or 1.1 pF (typical)
- Offered in a standard leaded package and 0402 footprint package: SOD-523 (DYA) and X1SON (DPY)
- Leaded packages used for automatic optical inspection (AOI)
The ESD751 and ESD761 are single-channel low capacitance bidirectional ESD protection devices for USB power delivery (USB-PD). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±22-kV Contact, ±22-kV Airgap) and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key because industrial systems require a high level of robustness and reliability.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ESD751 and ESD761 24-V 1-Channel ESD Protection Diodes datasheet (Rev. C) | PDF | HTML | 2022年 12月 15日 |
Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024年 1月 11日 | |
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012年 9月 25日 |
設計與開發
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ESDEVM — 通用 ESD 評估模組
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
SOT-5X3 (DYA) | 2 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。