ESDS314
- IEC 61000-4-2 ESD protection:
- ±30kV Contact Discharge
- ±30kV Air Gap Discharge
- IEC 61000-4-4 EFT protection:
- 80A (5/50ns)
- IEC 61000-4-5 surge protection:
- 25A (8/20µs)
- IO capacitance:
- 4.5pF (typical)
- DC breakdown voltage: 5.5V (minimum)
- Ultra low leakage current: 5nA (typical)
- Supports high speed interfaces up to 5Gbps
- Industrial temperature range: –40°C to +125°C
- Easy flow-through routing package (ESDS312)
The ESDS31x devices are unidirectional TVS ESD protection diode array for Ethernet, USB and general purpose data line surge protection up to 25A (8/20µs). The ESDS31x devices are rated to dissipate ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4).
The devices feature a 4.5pF IO capacitance per channel making the device an excellent choice for protecting high-speed interfaces such as Ethernet 10/100/1000, USB 2.0 and GPIO. The low dynamic resistance and low clamping voltage provides system level protection against transient events.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ESDS31x Data-Line Surge and ESD Protection Diode Array datasheet (Rev. C) | PDF | HTML | 2024年 2月 5日 |
Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022年 9月 7日 | ||
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
Application note | Protecting Ethernet Ports from Surge Events (Rev. A) | PDF | HTML | 2022年 4月 27日 | |
Technical article | Top 3 considerations for harsh industrial Ethernet | PDF | HTML | 2019年 11月 4日 | |
White paper | Demystifying surge protection | 2018年 11月 6日 | ||
Application note | IEC61000-4-2, IEC 61000-4-4 and IEC 61000-4-5 tests for TI’s protection devices | 2015年 6月 1日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — 通用 ESD 評估模組
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
SOT-23 (DBV) | 5 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。