首頁 邏輯元件和電壓轉換 正反器、鎖存器和暫存器 D 型正反器
首頁
邏輯元件和電壓轉換
正反器、鎖存器和暫存器
D 型正反器

SN54ABT273

現行

具有清除功能的八路邊緣觸發 D 型正反器

立即訂購
產品規格表

SN54ABT273

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 8 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 150 IOL (max) (mA) 48 IOH (max) (mA) -24 Supply current (max) (µA) 30000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 150 IOL (max) (mA) 48 IOH (max) (mA) -24 Supply current (max) (µA) 30000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

 

EPIC-IIB is a trademark of Texas Instruments Incorporated.
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

 

EPIC-IIB is a trademark of Texas Instruments Incorporated.

The 'ABT273 are 8-bit positive-edge-triggered D-type flip-flops with a direct clear () input. They are particularly suitable for implementing buffer and storage registers, shift registers, and pattern generators.

Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D input signal has no effect at the output.

The SN54ABT273 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT273 is characterized for operation from -40°C to 85°C.

 

 

The 'ABT273 are 8-bit positive-edge-triggered D-type flip-flops with a direct clear () input. They are particularly suitable for implementing buffer and storage registers, shift registers, and pattern generators.

Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D input signal has no effect at the output.

The SN54ABT273 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT273 is characterized for operation from -40°C to 85°C.

 

 
filter 尋找其它 D 型正反器
下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 21
類型 標題 日期
* Data sheet Octal Edge-Triggered D-Type Flip-Flops With Clear datasheet (Rev. B) 1997年 1月 1日
* SMD SN54ABT273 SMD 5962-93217 2016年 6月 21日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004年 2月 16日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
Selection guide Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997年 3月 1日
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996年 12月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日
Selection guide Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 針腳 CAD 符號、佔位空間與 3D 模型
CDIP (J) 20 Ultra Librarian
CFP (W) 20 Ultra Librarian
LCCC (FK) 20 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片