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ESD 防護二極體

TPD2E007

現行

適用於 AC 訊號資料介面的雙路 10-pF、±13-V、±8-kV ESD 防護二極體

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產品規格表

TPD2E007

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 2 Vrwm (V) 13 Bi-/uni-directional Bi-directional Package name LGA (PicoStar), SC70-3 Peak pulse power (8/20 μs) (max) (W) 0.27 IO capacitance (typ) (pF) 10 IEC 61000-4-2 contact (±V) 8000 IEC 61000-4-5 (A) 4.5 Clamping voltage (V) 20 Dynamic resistance (typ) 3.5 Interface type Audio Breakdown voltage (min) (V) 14 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -40 to 85
Number of channels 2 Vrwm (V) 13 Bi-/uni-directional Bi-directional Package name LGA (PicoStar), SC70-3 Peak pulse power (8/20 μs) (max) (W) 0.27 IO capacitance (typ) (pF) 10 IEC 61000-4-2 contact (±V) 8000 IEC 61000-4-5 (A) 4.5 Clamping voltage (V) 20 Dynamic resistance (typ) 3.5 Interface type Audio Breakdown voltage (min) (V) 14 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -40 to 85
PICOSTAR (YFM) 4 0.5929 mm² (— mm × — mm) SOT-SC70 (DCK) 3 4.2 mm² (2 mm × 2.1 mm)
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±8-kV IEC 61000-4-2 Contact Discharge
    • ±15-kV IEC 61000-4-2 Air-Gap Discharge
  • IEC 61000-4-5 Surge Protection
    • 4.5-A Peak Pulse Current (8/20-µs Pulse)
  • IO Capacitance 15 pF (Max)
  • Low 50-nA Leakage Current
  • Space-Saving PicoStar™ and SOT Package
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±8-kV IEC 61000-4-2 Contact Discharge
    • ±15-kV IEC 61000-4-2 Air-Gap Discharge
  • IEC 61000-4-5 Surge Protection
    • 4.5-A Peak Pulse Current (8/20-µs Pulse)
  • IO Capacitance 15 pF (Max)
  • Low 50-nA Leakage Current
  • Space-Saving PicoStar™ and SOT Package

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
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技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TPD2E007 2-Channel ESD Protection Array for AC-Coupled/Negative-Rail Data Interfaces datasheet (Rev. I) PDF | HTML 2016/3/22
選擇指南 System-Level ESD Protection Guide (Rev. E) PDF | HTML 2025/8/5
應用說明 ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022/8/18
白皮書 Designing USB for short-to-battery tolerance in automotive environments 2016/2/10
類比設計期刊 Design Considerations for System-Level ESD Circuit Protection 2012/9/25

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

ESDEVM — 適用於 ESD 二極體封裝的通用評估模組，包括 0402、0201等

靜電敏感裝置 (ESD) 評估模組 (EVM) 是我們大多數 ESD 產品組合的開發平台。此電路板配備所有傳統 ESD 元件封裝，可測試任意數量的裝置。裝置可以焊接到其相應的元件封裝上，然後進行測試。對於一般高速 ESD 二極體，會實作阻抗控制的配置以取得 S 參數並取消內嵌電路板軌跡。對於非高速 ESD 二極體，其元件封裝會包含連接至測試點的軌跡，讓您輕鬆執行 DC 測試，例如崩潰電壓、保持電壓、洩漏等。電路板配置也可以透過將訊號針腳短路到訊號所在的任何地方，讓任何裝置針腳都能輕鬆地連接到電源 (VCC) 或接地。
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許多 TI 參考設計包含 TPD2E007

使用我們的參考設計選擇工具，以檢視並找出最適合您的應用和參數的設計。
封裝 針腳 CAD 符號、佔位空間與 3D 模型
PICOSTAR (YFM) 4 Ultra Librarian
SOT-SC70 (DCK) 3 Ultra Librarian
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