TPD4E6B06
- IEC 61000-4-2 Level 4
- ±15-kV Contact Discharge
- ±15-kV Air Gap Discharge
- IEC 61000-4-5 (Surge): 3 A (8/20 µs)
- IO Capacitance: 4.8 pF (Typical)
- RDYN: 0.75 Ω (Typical)
- DC Breakdown Voltage: ±6 V (Minimum)
- Ultra Low Leakage Current: 100 nA (Maximum)
- Clamping Voltage: 10 V (Maximum at IPP = 1 A)
- Industrial Temperature Range: –40°C to +125°C
- Space Saving DPW Package (0.8 mm × 0.8 mm)
The TPD4E6B06 is a four channel electrostatic discharge (ESD) protection device in an ultra small DPW package. It is the industry’s smallest 4-channel transient voltage suppressor (TVS) diode with a 0.48-mm pitch. This larger pitch helps save on printed-circuit board (PCB) manufacturing costs. The device provides IEC61000-4-2 compliance up to 15-kV contact discharge. It has an ESD clamp circuit with back-to-back diodes for bipolar-bidirectional signal support. The 4.8-pF (typical) line capacitance is suitable for a wide range of applications supporting data rates up to 700 MHz.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPD4E6B06 4-Channel Bidirectional Low Capacitance ESD Protection Device With 15-kV Contact and Ultra-Low Clamping Voltage datasheet (Rev. C) | PDF | HTML | 2017年 2月 23日 |
User guide | Reading and Understanding an ESD Protection Data Sheet (Rev. A) | PDF | HTML | 2023年 9月 19日 | |
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
Application note | ESD Protection Layout Guide (Rev. A) | PDF | HTML | 2022年 4月 7日 | |
User guide | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2021年 9月 27日 | |
White paper | Designing USB for short-to-battery tolerance in automotive environments | 2016年 2月 10日 | ||
Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012年 9月 25日 |
設計與開發
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ESDEVM — 通用 ESD 評估模組
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
X2SON (DPW) | 4 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。