TPS63820
- Input voltage range: 1.8V to 5.5V
- 2.0V minimum input voltage for start-up
- VOUT range: I2C-configurable 1.2V to 5.5V with 25mV step
- Output current
- Up to 3.5A for VIN ≥ 2.5V, VOUT = 3.3V
- Up to 4A for VIN ≥ 3V, VOUT = 3.3V
- High efficiency over the entire load range
- Low 2.3µA operating quiescent current
- Automatic power save mode, ultra-sonic mode, and forced PWM mode
- 91.94% efficiency at VIN = 3.6V, VOUT = 3.3V, IOUT = 100µA (in buck-boost mode)
- 95.33% efficiency at VIN = 3.6V, VOUT = 3.3V, IOUT = 2A (in buck-boost mode)
- Supports 1.2V logic I/O
- Three I2C target addresses available by ADDR pin connection
- Programmable soft start time, current limit, and buck-boost window
- Output discharge function
- Safety and robust protection features
- Overtemperature protection
- Input and output overvoltage protection
- True load disconnect during shutdown
- Forward and backward current limit
- Hiccup protection
- Two device options:
- TPS63820: Pre-programmed 3.3V VOUT
- TPS638201: Program VOUT prior to start-up
- 15-ball WCSP package (2.0mm × 1.2mm)
The TPS63820 and TPS638201 are low quiescent current, high output current buck-boost converters fully programmable through I2C. The 2.3µA quiescent current and four low Rdson MOSFETs enable high efficiency from a light to a heavy load range.
Depending on the input voltage, the devices automatically operate in boost, buck, or in buck-boost mode when the input voltage is approximately equal to the output voltage. The transitions between modes occur at defined thresholds and avoid unwanted toggling within the modes which reduces output voltage ripple.
The devices have a fast dynamic response, which enables the regulation of output voltage tightly, even in the event of heavy load transients.
The devices offer a small solution size in WCSP. The solution size is <20mm2 with only four external components.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | TPS63820 – Low Quiescent Current, 4A Buck-Boost Converters with I2C Interface datasheet | PDF | HTML | 2026年 3月 9日 |
設計與開發
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TPS63820EVM — TPS63820 評估模組
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YBG) | 15 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。