驅動程式或資料庫
TX73L64-DESIGN — TX73L64 design resources
The full data sheet and other design resources for this device are available here
TX73L64
- Transmitter supports:
- 64-channel 3-level pulser and active transmit/ receive (T/R) switch
- 3-level pulser:
- Maximum output voltage: ±100V
- Minimum output voltage: ±1V
- Maximum output current: 1A
- True return to zero to discharge output to ground
- Second harmonic of –40dBc at 5MHz
- –3-dB Bandwidth with 400Ω || 125pF load
- 22MHz for a ±100-V supply
- Very low receive power: 2.8mW/ch
- Active transmit/receive (T/R) switch with:
- Turn on resistance of 22Ω
- Turn on and Turn off time: 100ns
- 2:1 Channel Muxing to LNA input
- LNA
- Supports a maximum input swing of 500mVpp
- Gain of 24dB
- HD2 of -55 dBc and HD3 of 40dBc at 5MHz
- Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
- On-chip beam former with:
- Channel based T/R switch on and off controls
- Delay resolution: half beamformer clock period, minimum 2.5ns
- Maximum delay: 214 beamformer clock period
- Maximum beamformer clockspeed: 200MHz
- On-Chip RAM for pattern and delay profile
- One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
- Global repeat feature present, enabling long duration patterns
- High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
- Low programming time: ≈1µs for delay profile update
- 32-bit Checksum to detect wrong SPI writes
- Supports CMOS serial programming interface (50MHz maximum)
- High reliability features:
- Internal temperature sensor and automatic thermal shutdown
- No specific power sequencing requirement
- Error flag register to detect faulty conditions
- Integrated passives for the floating supplies and bias voltages
- Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.
TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.
Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.
技術文件
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檢視所有 3 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TX73L64 3-Level, 64-Channel Transmitter with On-Chip Beamformer, T/R Switch, 32- Channel Multiplexed Receivers with LNA datasheet | PDF | HTML | 2025年 4月 29日 |
| Application note | An Overview of TI's Transmitter Products for Ultrasound Applications | PDF | HTML | 2025年 7月 8日 | |
| Certificate | TX73L64EVM EU Declaration of Conformity (DoC) | 2025年 2月 28日 |
設計與開發
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開發板
TX73L64EVM — TX73L64 評估模組
TX73L64EVM 用於評估在不同驅動強度、不同電壓位準和不同裝置模式下的 TX73L64 裝置。評估模組包含所有必要的控制訊號及板載功率產生，能大幅降低對外部設備的需求。評估系統也包括適用於 Microsoft® Windows® 的 GUI 軟體，可輕鬆將各種模式和模式編程至裝置中。
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI 是有助於評估類比電路功能的設計和模擬環境。這款全功能設計和模擬套件使用 Cadence® 的類比分析引擎。PSpice for TI 包括業界最大的模型庫之一，涵蓋我們的類比和電源產品組合，以及特定類比行為模型，且使用無需支付費用。
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| FCCSP (ACP) | 196 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。