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SN74AUP1G17DBVR ACTIVE

Low-Power Single Schmitt-Trigger Buffer

NEW - Custom reel may be available
Inventory: 71,497  
 

Quality information

RoHS Yes
REACH Yes
Lead finish / Ball material NIPDAU, SN
MSL rating / Peak reflow Level-1-260C-UNLIM
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
View or download

Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (℃)
SOT-23 (DBV) | 5 3,000 | LARGE T&R
Custom reel may be available
-40 to 85
Package | Pins SOT-23 (DBV) | 5
Package qty | Carrier: 3,000 | LARGE T&R
Custom reel may be available
Operating temperature range (℃) -40 to 85
View TI packaging information

Features for the SN74AUP1G17

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model(C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

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Description for the SN74AUP1G17

The AUP family of devices is TI’s premier solution to the industry’s low-power needs inbattery-powered portable applications. This family ensures a very low static- and dynamic-powerconsumption across the entire VCC range of 0.8 V to 3.6 V, resulting inincreased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power Family and Excellent Signal Integrity).

This device functions as an independent gate with Schmitt-trigger inputs, which allowsfor slow input transition and better switching-noise immunity at the input.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using thedie as the package.

This device is fully specified for partial-power-down applications usingIoff. The Ioff circuitry disables the outputs whenthe device is powered down. This inhibits current backflow into the device which prevents damage tothe device.

Pricing


Qty Price (USD)
1-99 0.172
100-249 0.117
250-999 0.09
1,000-9,999 0.06
10,000+ 0.053