SimpleLink™ CC13x2 and CC26x2 software development kit

SIMPLELINK-CC13X2-26X2-SDK_3.40.00.02

What's New?

Bulk Acoustic Wave (BAW)

• Initial production release of the SimpleLink™ CC2652RB Arm® Cortex®-M4F multiprotocol 2.4 GHz crystal-less BAW wireless MCU supporting Bluetooth Low Energy, Thread and Zigbee. Any CC2652RB applications developed using earlier SDKs must be updated to use this version of the SDK. Refer to the porting guide for more details.
• The RF Lib now does continuous temperature compensation when running on the CC2652RB device. This will improve the device RF frequency consistency across the supported temperature range.

CC2642R-Q1

• This is the first SDK that supports the Automotive AEC-Q100 qualified SimpleLink CC2642R-Q1 Bluetooth Low Energy wireless MCU. All Bluetooth 5.1 (BLE5-Stack), Real Time Localization Services (RTLS) and TI Drivers examples for the CC2642R are supported on the CC2642R-Q1. The CC26x2R LaunchPad is the development kit for the CC2642R-Q1.

Bluetooth 5.1 (BLE5-Stack)

• It is now possible to follow up to eight connections while doing AoA. This allows one master to follow multiple slave nodes.
• The multi role and OAD examples can now be run on the CC2652RB device.

TI 15.4-Stack

• OAD for the TI 15.4-Stack has been updated to be more flexible and in most cases faster on low data rate connections. See the Turbo OAD feature chapter of the User’s Guide for more information.

RFLib

• 2.4 GHz proprietary modes are now supported in SysConfig for all relevant devices.
• RF driver now runs continuous temperature compensation when running on the CC2652RB device.

EasyLink

• 2.4 GHz mode is now supported for all relevant devices.

Dynamic Multi-protocol Manager (DMM)

• All 2.4 GHz examples can now be run on the CC2652RB device.

Updated CoreSDK component to version 4.40.00.03. The CoreSDK is comprised of the TI-RTOS SYS/BIOS kernel, DriverLib and TI Drivers.

Refer to the Document Overview for the individual release notes and details for starting development with each SDK component

Refer to the included Change Log for a summary of new features and fixed issues since the last SDK release

Release Information

The SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13x2 and CC26x2 family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13x2 and CC26x2 wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.1, Thread 1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack as well as the TI-RTOS kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU through time division multiplexing.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

This is version 3.40.00.02 of the SimpleLink CC13x2 / CC26x2 SDK.

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