Product details

Protocols Bluetooth 5.2 Low Energy, Thread, Zigbee 3.0 RAM (KB) 152 Type Wireless MCU Features Bluetooth LE support, Bluetooth mesh, Border router, Direction finding, Direction finding/AoA, End device, FTD, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), MTD, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor GPIO 26 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Device identity, Debug security, Secure boot, Secure firmware update, Crypto acceleration (RNG, AES, SHA, ECC) Sensitivity (best) (dBm) -104 Operating temperature range (C) -40 to 105 Rating Catalog
Protocols Bluetooth 5.2 Low Energy, Thread, Zigbee 3.0 RAM (KB) 152 Type Wireless MCU Features Bluetooth LE support, Bluetooth mesh, Border router, Direction finding, Direction finding/AoA, End device, FTD, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), MTD, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor GPIO 26 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Security Device identity, Debug security, Secure boot, Secure firmware update, Crypto acceleration (RNG, AES, SHA, ECC) Sensitivity (best) (dBm) -104 Operating temperature range (C) -40 to 105 Rating Catalog
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.10 mA active mode, CoreMark
    • 65 µA/MHz running CoreMark
    • 0.9 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 29.2 µA in 2 MHz mode
    • 799 µA in 24 MHz mode
  • Radio Consumption:
    • 6.4 mA RX
    • 21 mA TX at +10 dBm
    • 101 mA TX at +20 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.10 mA active mode, CoreMark
    • 65 µA/MHz running CoreMark
    • 0.9 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 29.2 µA in 2 MHz mode
    • 799 µA in 24 MHz mode
  • Radio Consumption:
    • 6.4 mA RX
    • 21 mA TX at +10 dBm
    • 101 mA TX at +20 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC2652P7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2652P7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC2652P7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC2652P7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2652P7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC2652P7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

Download

Similar products you might be interested in

open-in-new Compare products
Pin-for-pin with same functionality to the compared device.
CC2652P ACTIVE SimpleLink™ Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with integrated power amplifier Pin-to-pin compatible with reduced flash and RAM.

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Type Title Date
* Data sheet CC2652P7 SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU With Integrated Power Amplifier datasheet (Rev. A) 30 Nov 2021
* Errata CC2652P7 Silicon Errata 30 Nov 2021
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways 20 Dec 2021
User guide CC13x2x7 and CC26x2x7 Technical Reference Manual 24 Nov 2021
Application note Hardware Migration to CC2652R7 and CC2652P7 10 Nov 2021
White paper Exploring Thread and Zigbee for home and building automation 12 Apr 2021
Technical article An out-of-the-box Internet of Things: building a seamless and secure smart home network 12 Jun 2018
Technical article Thread vs. Zigbee – what’s the difference? 16 May 2018
Technical article Your microcontroller deserves a nap – designing “sleepy” wireless applications 28 Mar 2018
Technical article SimpleLink™ MCU SDKs: Breaking down TI Drivers 12 Apr 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Development kit

LP-CC1352P7 — CC1352P7 LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU

This LaunchPad™ development kit speeds development on devices with integrated power amplifier and multi-band radio support for concurrent Sub-1GHz and 2.4-GHz operation. Protocols supported include Bluetooth® Low Energy, Sub-1 GHz, Thread, Zigbee®, 802.15.4, and proprietary RF with the compatible (...)

Software development kit (SDK)

SIMPLELINK-CC13XX-CC26XX-SDK — SimpleLink™ CC13xx and CC26xx software development kit (SDK)

The SimpleLink™ CC13xx and CC26xx software development kit (SDK) provides a comprehensive software package for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Thread, 802.15.4-based, proprietary, and multiprotocol solutions on (...)
IDE, configuration, compiler or debugger

ARM-CGT — Arm® code generation tools - compiler

The TI Arm® code generation tools support development of applications for TI Arm-based platforms, especially those featuring TI Arm Cortex-M and Cortex-R series devices. There are now two TI Arm® C/C++ compiler toolchains both of which can be used to compile and link C/C++ and assembly (...)
IDE, configuration, compiler or debugger

CCSTUDIO-WCS — Code Composer Studio™ integrated development environment (IDE) for wireless connectivity

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, (...)
Package Pins Download
VQFN (RGZ) 48 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos