SLLA305A May   2010  – September 2023 ESD441 , TPD12S015 , TPD12S015A , TPD12S016 , TPD12S520 , TPD12S521 , TPD13S523 , TPD1E05U06 , TPD1E10B06 , TPD1E10B09 , TPD1E6B06 , TPD1S414 , TPD1S514 , TPD2E001 , TPD2E001-Q1 , TPD2E009 , TPD2E1B06 , TPD2E2U06 , TPD2E2U06-Q1 , TPD2EUSB30 , TPD2EUSB30A , TPD2S017 , TPD3F303 , TPD3S014 , TPD3S044 , TPD4E001 , TPD4E001-Q1 , TPD4E004 , TPD4E02B04 , TPD4E05U06 , TPD4E05U06-Q1 , TPD4E101 , TPD4E1B06 , TPD4E1U06 , TPD4E6B06 , TPD4EUSB30 , TPD4S010 , TPD4S012 , TPD4S014 , TPD4S1394 , TPD4S214 , TPD5E003 , TPD5S115 , TPD5S116 , TPD6E001 , TPD6E004 , TPD6E05U06 , TPD6F002 , TPD6F002-Q1 , TPD6F003 , TPD7S019 , TPD8E003 , TPD8F003 , TPD8S009

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Device Summary
  6. 3Pin Configuration and Functions
  7. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings - JEDEC
    3. 4.3 ESD Ratings - AEC
    4. 4.4 ESD Ratings - IEC
    5. 4.5 ESD Ratings - ISO
    6. 4.6 Recommended Operating Conditions
    7. 4.7 Thermal Information
    8. 4.8 Electrical Characteristics
      1. 4.8.1 Reverse Standoff Voltage (VRWM)
      2. 4.8.2 Breakdown Voltage (VBR)
      3. 4.8.3 Leakage Current (ILEAK)
      4. 4.8.4 Dynamic Resistance (RDYN)
      5. 4.8.5 Line Capacitance (CL)
      6. 4.8.6 Clamping Voltage (VCLAMP)
    9. 4.9 Typical Characteristics
      1. 4.9.1 TLP Plot
      2. 4.9.2 ± 8kV Clamped IEC Waveform
      3. 4.9.3 Capacitance vs. Bias Voltage
      4. 4.9.4 Leakage Current vs. Temperature
      5. 4.9.5 Capacitance vs. Temperature
      6. 4.9.6 Insertion Loss
  8. 5Summary
  9. 6References
  10. 7Revision History

3 Pin Configuration and Functions

The pin configuration and functions section varies depending on the ESD protection device. The section consists of the device package or packages and gives an overview of the pin functions for the specific package or packages. Instead of showing package options for a device, Table 3-1 lists and explains the pin functions that may be seen in an ESD protection device data sheet. For more information on packaging and layout, refer to the application note ESD Packaging and Layout Guide.

Table 3-1 Pin Functions and Descriptions
Pin Name Type Description
GND Ground Connect to ground
Exposed thermal pad (EP) Ground/NC The thermal pad allows for a better ground connection and thermal performance. The larger surface area to ground lowers the impedance helping dissipate large ESD currents resulting in less inductance to ground meaning lower voltage spikes. Some devices, specifically TVS bi-directional devices, require the thermal pad to be floating or not connected due to failures when the applied voltage is negative.
IO (D+/D-) Input/Output IO and D+/D- are common when referring to an ESD protected channel. For these pins, always place as close to the source of ESD (usually an interface connector to the outside world) as possible to limit the possibility of EMI coupling.
IN Input IN is the terminology used for a surge protected channel such as in the TVS device family. The optimum placement for these pins are as close to the source of ESD as possible to also minimize the potential of EMI coupling.
VCC Protection pin VCC can be used for protecting a USB bus voltage (VBUS). VCC can also be used to set voltages for IO pins resulting in an increase in the clamping voltage (example is TPD4E001) along with other use cases. A VCC pin is not as common on ESD devices because a separate diode generally provides better protection compared to a device with built in protection. A 0.1-µF ceramic capacitor is recommended to be placed between the VCC trace and the VCC pin on the diode to filter out noise.
No connect (NC) NC NC pins are not connected internally and can be left floating, grounded, or used for straight-through routing.