SBASAO8 June   2025 DAC39RF20

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - AC Specifications
    7. 6.7  Electrical Characteristics - Power Consumption
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 SPI Interface Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RF Mode
        3. 7.3.1.3 DES Modes
      2. 7.3.2  DAC Core
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-Scale Current Adjustment
      3. 7.3.3  DEM and Dither
      4. 7.3.4  Offset Adjustment
      5. 7.3.5  Clocking Subsystem
        1. 7.3.5.1 Converter Phase Locked Loop (CPLL)
        2. 7.3.5.2 Clock and SYSREF Delay
        3. 7.3.5.3 SYSREF Capture and Monitoring
          1. 7.3.5.3.1 SYSREF Frequency Requirements
          2. 7.3.5.3.2 SYSREF Pulses for Full Alignment
          3. 7.3.5.3.3 Automatic SYSREF Calibration and Tracking
            1. 7.3.5.3.3.1 SYSREF Automatic Calibration Procedure
            2. 7.3.5.3.3.2 Multi-device Alignment
            3. 7.3.5.3.3.3 Calibration Failure
            4. 7.3.5.3.3.4 SYSREF Tracking
        4. 7.3.5.4 Trigger Clocking
      6. 7.3.6  Digital Signal Processing Blocks
        1. 7.3.6.1  Bypass Mode
        2. 7.3.6.2  DUC Mode
          1. 7.3.6.2.1 Digital Upconverter (DUC)
            1. 7.3.6.2.1.1 Interpolation Filters
            2. 7.3.6.2.1.2 Numerically Controlled Oscillator (NCO)
              1. 7.3.6.2.1.2.1 Phase-continuous NCO Update Mode
              2. 7.3.6.2.1.2.2 Phase-coherent NCO Update Mode
              3. 7.3.6.2.1.2.3 Phase-sync NCO Update Mode
              4. 7.3.6.2.1.2.4 NCO Synchronization
                1. 7.3.6.2.1.2.4.1 JESD204C LSB Synchronization
        3. 7.3.6.3  DDS SPI Mode
        4. 7.3.6.4  DDS Vector Mode
          1. 7.3.6.4.1 Second Order Amplitude Support
          2. 7.3.6.4.2 Vector Order and Symmetric Vector Mode
          3. 7.3.6.4.3 Initial Startup
          4. 7.3.6.4.4 Trigger Queuing
          5. 7.3.6.4.5 Trigger Burst
          6. 7.3.6.4.6 Hold Mode
          7. 7.3.6.4.7 Indexing Mode
          8. 7.3.6.4.8 Queued or Burst Triggers in Indexing-Mode
          9. 7.3.6.4.9 Writing Vectors While DDS is Enabled
        5. 7.3.6.5  DDS Streaming Mode
        6. 7.3.6.6  DSP Triggering
          1. 7.3.6.6.1 Trigger Latency
        7. 7.3.6.7  NCO Square Wave Mode
          1. 7.3.6.7.1 Square Wave Enable
        8. 7.3.6.8  DSP Mute Function
        9. 7.3.6.9  DSP Output Gain
        10. 7.3.6.10 Complex Output Support
        11. 7.3.6.11 Channel Bonder
        12. 7.3.6.12 Programmable FIR Filter
          1. 7.3.6.12.1 PFIR Coefficients
          2. 7.3.6.12.2 PFIR Reflection Cancellation Mode
          3. 7.3.6.12.3 PFIR Power Savings
          4. 7.3.6.12.4 PFIR Usage
        13. 7.3.6.13 DES Interpolator
          1. 7.3.6.13.1 DAC Mute Function
      7. 7.3.7  Serdes Physical Layer
        1. 7.3.7.1 Serdes PLL
          1. 7.3.7.1.1 Enabling the Serdes PLL
          2. 7.3.7.1.2 Reference Clock
          3. 7.3.7.1.3 PLL VCO Calibration
          4. 7.3.7.1.4 Serdes PLL Loop Bandwidth
        2. 7.3.7.2 Serdes Receiver
          1. 7.3.7.2.1 Serdes Data Rate Selection
          2. 7.3.7.2.2 Serdes Receiver Termination
          3. 7.3.7.2.3 Serdes Receiver Polarity
          4. 7.3.7.2.4 Serdes Clock Data Recovery
          5. 7.3.7.2.5 Serdes Equalizer
            1. 7.3.7.2.5.1 Adaptive Equalization
            2. 7.3.7.2.5.2 Fixed Equalization
            3. 7.3.7.2.5.3 Pre and Post Cursor Analysis
          6. 7.3.7.2.6 Serdes Receiver Eyescan
            1. 7.3.7.2.6.1 Eyescan Procedure
            2. 7.3.7.2.6.2 Building an Eye Diagram
        3. 7.3.7.3 Serdes PHY Status
      8. 7.3.8  JESD204C Interface
        1. 7.3.8.1 Deviation from JESD204C Standard
        2. 7.3.8.2 Link Layer
          1. 7.3.8.2.1 Serdes Crossbar
          2. 7.3.8.2.2 Bit Error Rate Tester
          3. 7.3.8.2.3 Scrambler and Descrambler
          4. 7.3.8.2.4 64b and 66b Decoding Link Layer
            1. 7.3.8.2.4.1 Sync Header Alignment
            2. 7.3.8.2.4.2 Extended Multiblock Alignment
            3. 7.3.8.2.4.3 Data Integrity
          5. 7.3.8.2.5 8B and 10B Encoding Link Layer
            1. 7.3.8.2.5.1 Code Group Synchronization (CGS)
            2. 7.3.8.2.5.2 Initial Lane Alignment Sequence (ILAS)
            3. 7.3.8.2.5.3 Multi-frames and the Local Multiframe Clock (LMFC)
            4. 7.3.8.2.5.4 Frame and Multiframe Monitoring
            5. 7.3.8.2.5.5 Link Restart
            6. 7.3.8.2.5.6 Link Error Reports
            7. 7.3.8.2.5.7 Watchdog Timer (JTIMER)
        3. 7.3.8.3 SYSREF Alignment Required in Subclass 1 Mode
        4. 7.3.8.4 Transport Layer
        5. 7.3.8.5 JESD204C Debug Capture (JCAP)
          1. 7.3.8.5.1 Physical Layer Debug Capture
          2. 7.3.8.5.2 Link Layer Debug Capture
          3. 7.3.8.5.3 Transport Layer Debug Capture
        6. 7.3.8.6 JESD204C Interface Modes
          1. 7.3.8.6.1 JESD204C Format Diagrams
            1. 7.3.8.6.1.1 16-bit Formats
            2. 7.3.8.6.1.2 12-bit Formats
            3. 7.3.8.6.1.3 8-bit Formats
          2. 7.3.8.6.2 DUC and DDS Modes
      9. 7.3.9  Data Path Latency
      10. 7.3.10 Multi-Device Synchronization and Deterministic Latency
        1. 7.3.10.1 Programming RBD
        2. 7.3.10.2 Multiframe Lengths less than 32 Octa-Bytes (256 Bytes)
        3. 7.3.10.3 Recommended Algorithm to Determine the RBD Value
        4. 7.3.10.4 Operation in Subclass 0 Systems
      11. 7.3.11 Link Reset
      12. 7.3.12 Alarm Generation
        1. 7.3.12.1 Over Range Detection
        2. 7.3.12.2 Over Range Masking
      13. 7.3.13 Mute Function
        1. 7.3.13.1 Alarm Data Path Muting
        2. 7.3.13.2 Transmit Enables
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
  9. 8 Programming
    1. 8.1 Using the Standard SPI Interface
      1. 8.1.1 SCS
      2. 8.1.2 SCLK
      3. 8.1.3 SDI
      4. 8.1.4 SDO
      5. 8.1.5 Serial Interface Protocol
      6. 8.1.6 Streaming Mode
    2. 8.2 Using the Fast Reconfiguration Interface
    3. 8.3 Register Maps
      1. 8.3.1  Standard_SPI-3.1 Registers
      2. 8.3.2  System Registers
      3. 8.3.3  Trigger Registers
      4. 8.3.4  CPLL_AND_CLOCK Registers
      5. 8.3.5  SYSREF Registers
      6. 8.3.6  JESD204C Registers
      7. 8.3.7  JESD204C_Advanced Registers
      8. 8.3.8  SerDes_Equalizer Registers
      9. 8.3.9  SerDes_Eye-Scan Registers
      10. 8.3.10 SerDes_Lane_Status Registers
      11. 8.3.11 SerDes_PLL Registers
      12. 8.3.12 DAC_and_Analog_Configuration Registers
      13. 8.3.13 Datapath Registers
      14. 8.3.14 NCO_and_Mixer Registers
      15. 8.3.15 Alarm Registers
      16. 8.3.16 Fuse_Control Registers
      17. 8.3.17 Fuse_Backed Registers
      18. 8.3.18 DDS_Vector_Mode Registers
      19. 8.3.19 Programmable_FIR Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Startup Procedure
      2. 9.1.2 Bandwidth Optimization for Square Wave Mode
    2. 9.2 Typical Application: Ku-Band Radar Transmitter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Up and Down Sequence
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines and Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ANH|289
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3 Power Supply Recommendations

The device has three supply voltages and requires seven supply domains to achieve data sheet performance as shown in Table 9-2:

Table 9-2 Recommended Power Supply Domains
VoltageSupply DomainDevice Supplies
+1.8VVDDAVDDA18A, VDDA18B
VDDIOVDDIO
VDDCSRVDDCLK, VDDSYS, VDDR
VDDSP18VDDSP18
VDDCP18VDDCP18
+0.8VVDDLVDDLA, VDDLB
VDDCLK08VDDCLK08
DVDDVDDDIG, VDDT, VDDEA and VDDEB
-1.8VVEExVEEAM18, VEEBM18

The recommended power supply is shown in Figure 9-9. The power-supply voltages must be low in noise and provide the needed current to achieve rated device performance. A step down high-efficiency switching converter is used first, followed by a second stage of regulation using LDOs to provide switching noise reduction and improved voltage accuracy. The user can also refer to the TI WEBENCH® Power Designer which can be used to select and design the individual power supply elements as needed. The recommended switching regulators are:

  • TPSM82913 = +2.3V for the VDDA, VDDIO, VDDCSR, VDDL and VDCCCLK domains
  • TPS543820 (8A) or TPS543A22 (12A) = +0.8V for DVDD
  • TPSM82913 = +3.8V for VEEx domain

Recommended LDOs include:

  • TPS7A9401 for +1.8V and +0.8V
  • LM27762 for -1.8V

DAC39RF20 Recommended Power Supply Block DiagramFigure 9-9 Recommended Power Supply Block Diagram

The VDDA supply is regulated by an LDO, or low-noise drop-out linear regulator, with a +1.8V output and is further broken down into the following subgroup power domains:

  • VDDA: VDDA18A, VDDA18B
  • VDDIO
  • VDDCSR: VDDCLK18, VDDSYS18, VDDR18
  • VDDSP18
  • VDDCP18

Each device supply can be tied to a single LDO but are isolated with a ferrite bead and/or three-terminal capacitor or similar.

The VDDL supply is +0.8V and is further broken down into VDDLA and VDDLB. Each device supply can be tied to a single LDO but are isolated with a ferrite bead and/or three-terminal capacitor or similar.

The VDDCLK08 supply is +0.8V and is the most sensitive for achieving the best phase noise performance. VDDCLK08 must be isolated to a LDO to prevent noise from other 0.8V supplies coupling into the clock path.

The DVDD supply is +0.8V and can be directly connected to a switching power supply. The DVDD encompasses the following device supplies, VDDDIG, VDDT, VDDDEA and VDDDEB, which can all be connected together. No further isolation with a ferrite bead and/or three-terminal capacitor or similar is required.

The VEEx supply is -1.8V derived from a single LDO and is further broken down into VEEAM18 and VEEBM18, which are isolated with a ferrite bead and/or three-terminal capacitor or similar.

The recommendation is to follow these important power supply design considerations:

  1. Decouple all power supply rails and bus voltages as they come onto the system board. Further place additional decoupling at or near the DAC for each power domain. Typically, one low ESL 0.1μF decoupling capacitor per power supply pin is recommended unless specified in the data sheet or EVM assembly.
  2. Remember that approximately 20dB/decade noise suppression is gained for each additional filtering stage.
  3. Decouple for both high and low frequencies, which might require multiple capacitor values.
  4. Series ferrite beads and feed through capacitors are commonly used at the power plain entry point and can be used for addition power domain isolation. This is done for each individual supply voltage on the system board whether the voltage comes from an LDO or a switching regulator.
  5. For added capacitance, use tightly stacked power and ground plane pairs (≤4 mil spacing) this adds inherent high-frequency (>500MHz) decoupling to the PCB design.
  6. Keep supplies away from sensitive analog circuitry such as the front-end RF stage of the DAC and high-speed clocking and digital circuits if possible.
  7. Keep power domains that demand higher currents, near the top of the stack-up or layer that has power plain entry point. This minimizes the overall loop inductance.
  8. Any open or voided areas on power plane, fill with ground to provide additional isolation and shielding.
  9. Keep a 20 to 25 mil gap between all adjacent power and/or ground plane fills. This helps eliminate all gap coupling between adjacent power domains and/or grounds within the same layer.
  10. Some switcher regulator circuitry/components could be located on the opposite side of the PCB for added isolation.
  11. Follow the IC manufacture recommendations; if they are not directly stated in an application note or data sheet, then study the evaluation board. These are great vehicles to learn from. Applying these points above can help provide a solid power supply design yielding data sheet performance in many applications.

Each application has different tolerances for noise on the supply voltage, so understanding these trades is best described in the following two application notes for more details:

Also refer to Figure 9-15 through Figure 9-18 to illustrate the one power supply layout and stack-up approach.