SLVSGH7B november   2022  – july 2023 DRV8410

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
  9. 8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 External Components
    4. 9.4 Feature Description
      1. 9.4.1 Bridge Control
        1. 9.4.1.1 Parallel Bridge Interface
      2. 9.4.2 Current Regulation
      3. 9.4.3 Protection Circuits
        1. 9.4.3.1 Overcurrent Protection (OCP)
        2. 9.4.3.2 Thermal Shutdown (TSD)
        3. 9.4.3.3 Undervoltage Lockout (UVLO)
    5. 9.5 Device Functional Modes
      1. 9.5.1 Active Mode
      2. 9.5.2 Low-Power Sleep Mode
      3. 9.5.3 Fault Mode
    6. 9.6 Pin Diagrams
      1. 9.6.1 Logic-Level Inputs
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Stepper Motor Application
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
            1. 10.1.1.1.2.1 Stepper Motor Speed
            2. 10.1.1.1.2.2 Current Regulation
            3. 10.1.1.1.2.3 Stepping Modes
              1. 10.1.1.1.2.3.1 Full-Stepping Operation
              2. 10.1.1.1.2.3.2 Half-Stepping Operation with Fast Decay
              3. 10.1.1.1.2.3.3 Half-Stepping Operation with Slow Decay
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 Dual BDC Motor Application
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
            1. 10.1.1.2.2.1 Motor Voltage
            2. 10.1.1.2.2.2 Current Regulation
            3. 10.1.1.2.2.3 Sense Resistor
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Thermal Considerations
          1. 10.1.1.3.1 Maximum Output Current
          2. 10.1.1.3.2 Power Dissipation
          3. 10.1.1.3.3 Thermal Performance
            1. 10.1.1.3.3.1 Steady-State Thermal Performance
            2. 10.1.1.3.3.2 Transient Thermal Performance
        4. 10.1.1.4 Multi-Sourcing with Standard Motor Driver Pinout
  12. 11Power Supply Recommendations
    1. 11.1 Bulk Capacitance
    2. 11.2 Power Supply and Logic Sequencing
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|16
  • RTE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information
10.1.1.2.2.3 Sense Resistor

For optimal performance, the sense resistor must:

  • Be a surface mount component
  • Have low inductance
  • Be rated for high enough power
  • Be placed closely to the motor driver

The power dissipated by the sense resistor equals IRMS2 × R. In this example, the peak current is 600 mA, the RMS motor current is 490 mA, and the sense resistor value is 200 mΩ. Therefore, the sense resistors (RSENSE12 and RSENSE34) dissipate 48 mW (490 mA2 × 200 mΩ = 48 mW). The power quickly increases with higher current levels.

Resistors typically have a rated power within some ambient temperature range, along with a derated power curve for high ambient temperatures. When a printed circuit board (PCB) is shared with other components generating heat, margin should be added. For best practice, measure the actual sense resistor temperature in a final system, along with the power MOSFETs, because those components are often the hottest.

Because power resistors are larger and more expensive than standard resistors, the common practice is to use multiple standard resistors in parallel, between the sense node and ground. This practice distributes the current and heat dissipation.