SLVSEE9D April   2020  – April 2021 DRV8889-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic Level Pin Diagrams
        1. 7.3.10.1 nFAULT Pin
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.11.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.11.4 Open-Load Detection (OL)
        5. 7.3.11.5 Stall Detection
        6. 7.3.11.6 Thermal Shutdown (OTSD)
          1. 7.3.11.6.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.11.6.2 Automatic Recovery (OTSD_MODE = 1b)
        7. 7.3.11.7 Overtemperature Warning (OTW)
        8. 7.3.11.8 Undertemperature Warning (UTW)
        9.       53
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, DRVOFF = 1)
      3. 7.4.3 Operating Mode (nSLEEP = 1, DRVOFF = 0)
      4. 7.4.4 nSLEEP Reset Pulse
      5.      59
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
          1. 8.2.4.1.1 Conduction Loss
          2. 8.2.4.1.2 Switching Loss
          3. 8.2.4.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.4.1.4 Total Power Dissipation
        2. 8.2.4.2 PCB Types
        3. 8.2.4.3 Thermal Parameters for HTSSOP Package
        4. 8.2.4.4 Thermal Parameters for VQFN Package
        5. 8.2.4.5 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The DRV8889-Q1 and DRV8889A-Q1 devices are integrated motor-driver solutions for bipolar stepper motors. The device integrates two N-channel power MOSFET H-bridges, integrated current sense and regulation circuitry, and a microstepping indexer. The device can be powered with a supply voltage from 4.5 to 45 V and is capable of providing an output current up to 2.4-A peak, 1.5-A full-scale, or 1.1-A root mean square (rms). The actual full-scale and rms current depends on the ambient temperature, supply voltage, and PCB thermal capability. Compared to the DRV8889-Q1, the DRV8889A-Q1 features additional settings for the open-load detection time and slow-decay to drive blanking time. Additionally, the H-bridges are by default enabled after power-up for the DRV8889-Q1 and disabled for the DRV8889A-Q1.

The device uses an integrated current-sense architecture which eliminates the need for two external power sense resistors. This architecture removes the power dissipated in the sense resistors by using a current mirror approach and using the internal power MOSFETs for current sensing. The current regulation set point is adjusted by the voltage at the VREF pin. These features reduces external component cost, board PCB size, and system power consumption.

A simple STEP/DIR interface allows for an external controller to manage the direction and step rate of the stepper motor. The internal indexer can execute high-accuracy microstepping without requiring the external controller to manage the winding current level. The indexer is capable of full step, half step, and 1/4, 1/8, 1/16, 1/32, 1/64, 1/128 and 1/256 microstepping. In addition to a standard half stepping mode, a noncircular half stepping mode is available for increased torque output at higher motor RPM.

The current regulation is configurable between several decay modes. The decay mode can be selected as a slow-mixed, mixed decay, smart tune Ripple Control, or smart tune Dynamic Decay current regulation scheme. The slow-mixed decay mode uses slow decay on increasing steps and mixed decay on decreasing steps. The smart tune decay modes automatically adjust for optimal current regulation performance and compensate for motor variation and aging effects. Smart tune Ripple Control uses a variable off-time, ripple control scheme to minimize distortion of the motor winding current. Smart tune Dynamic Decay uses a fixed off-time, dynamic decay percentage scheme to minimize distortion of the motor winding current while also minimizing frequency content. In smart tune Ripple Control mode, the device can detect a motor overload stall condition or an end-of-line travel, by detecting back-emf phase shift between rising and falling current quadrants of the motor current.

The device integrates a spread spectrum clocking feature for both the internal digital oscillator and internal charge pump. This feature combined with output slew rate control minimizes the radiated emissions from the device.

A torque DAC feature allows the controller to scale the output current without needing to scale the VREF voltage reference. The torque DAC is accessed using a digital input pin which allows the controller to save system power by decreasing the motor current consumption when high output torque is not required.

A low-power sleep mode is included which allows the system to save power when not actively driving the motor.