SLVSEE9D April   2020  – April 2021 DRV8889-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic Level Pin Diagrams
        1. 7.3.10.1 nFAULT Pin
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.11.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.11.4 Open-Load Detection (OL)
        5. 7.3.11.5 Stall Detection
        6. 7.3.11.6 Thermal Shutdown (OTSD)
          1. 7.3.11.6.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.11.6.2 Automatic Recovery (OTSD_MODE = 1b)
        7. 7.3.11.7 Overtemperature Warning (OTW)
        8. 7.3.11.8 Undertemperature Warning (UTW)
        9.       53
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, DRVOFF = 1)
      3. 7.4.3 Operating Mode (nSLEEP = 1, DRVOFF = 0)
      4. 7.4.4 nSLEEP Reset Pulse
      5.      59
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
          1. 8.2.4.1.1 Conduction Loss
          2. 8.2.4.1.2 Switching Loss
          3. 8.2.4.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.4.1.4 Total Power Dissipation
        2. 8.2.4.2 PCB Types
        3. 8.2.4.3 Thermal Parameters for HTSSOP Package
        4. 8.2.4.4 Thermal Parameters for VQFN Package
        5. 8.2.4.5 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Over recommended operating conditions unless otherwise noted. Typical limits apply for TJ = 25°C and VVM = 13.5 V 
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLIES (VM, DVDD, VSDO)
IVMVM operating supply currentDRVOFF = 0, nSLEEP = 1, No output57mA
IVMQVM sleep mode supply currentnSLEEP = 024μA
tSLEEPSleep timenSLEEP = 0 to sleep-mode75μs
tRESETnSLEEP reset pulsenSLEEP low to only clear fault registers1835μs
tWAKEWake-up timeDRV8889-Q1, nSLEEP = 1 to output transition0.60.9ms
DRV8889A-Q1, nSLEEP = 1 to SPI ready100200μs
tONTurn-on timeDRV8889-Q1, VM > UVLO to output transition0.60.9ms
DRV8889A-Q1, SPI ready, VM > UVLO to output transition0.40.9ms
VDVDDInternal regulator voltageNo external load, 6 V < VVM < 45 V4.555.5V
CHARGE PUMP (VCP, CPH, CPL)
VVCPVCP operating voltageVM + 5V
f(VCP)Charge pump switching frequencyVVM > UVLO; nSLEEP = 1400kHz
LOGIC-LEVEL INPUTS (STEP, DIR, nSLEEP, nSCS, SCLK, SDI, DRVOFF)
VILInput logic-low voltage00.6V
VIHInput logic-high voltage1.55.5V
VHYSInput logic hysteresis150mV
IIL1Input logic-low currentVIN = 0 V (nSCS, DRVOFF)812μA
IIL2Input logic-low currentVIN = 0 V–11μA
IIH1Input logic-high currentVIN = DVDD (nSCS, DRVOFF)500nA
IIH2Input logic-high currentVIN = 5 V50μA
PUSH-PULL OUTPUT (SDO)
RPD,SDOInternal pull-down resistance5mA load, with respect to GND4075Ω
RPU,SDOInternal pull-up resistance5mA load, with respect to VSDO3060Ω
ISDOSDO Leakage CurrentSDO = VSDO and 0V-11μA
CONTROL OUTPUTS (nFAULT)
VOLOutput logic-low voltageIO = 5 mA0.4V
IOHOutput logic-high leakageVVM = 13.5 V–11μA
MOTOR DRIVER OUTPUTS (AOUT1, AOUT2, BOUT1, BOUT2)
RDS(ONH)High-side FET on resistanceTJ = 25°C, IO = -1 A450550mΩ
TJ = 125°C, IO = -1 A700850mΩ
TJ = 150°C, IO = -1 A780950mΩ
RDS(ONL)Low-side FET on resistanceTJ = 25°C, IO = 1 A450550mΩ
TJ = 125°C, IO = 1 A700850mΩ
TJ = 150°C, IO = 1 A780950mΩ
tSROutput slew rateSR = 00b, VM = 13.5 V, IO = 0.5 A10V/µs
SR = 01b, VM = 13.5 V, IO = 0.5 A35
SR = 10b, VM = 13.5 V, IO = 0.5 A50
SR = 11b, VM = 13.5 V, IO = 0.5 A105
PWM CURRENT CONTROL (VREF)
KVTransimpedance gain2.2V/A
tOFFPWM off-timeTOFF = 00b7μs
TOFF = 01b16
TOFF = 10b24
TOFF = 11b32
ΔITRIPCurrent trip accuracyIO = 1.5 A, 10% to 20% current setting–1310%
IO = 1.5 A, 20% to 67% current setting–88
IO = 1.5 A, 67% to 100% current setting–7.57.5
IO,CHAOUT and BOUT current matchingIO = 1.5 A–2.52.5%
PROTECTION CIRCUITS
VUVLOVM UVLO lockoutVM falling, UVLO falling4.154.254.35V
VM rising, UVLO rising4.254.354.45
VUVLO,HYSUndervoltage hysteresisRising to falling threshold100mV
VRSTVM UVLO resetVM falling, device reset, no SPI communications3.9V
VCPUVCharge pump undervoltageVCP falling; CPUV reportVM + 2V
IOCPOvercurrent protection Current through any FET2.4A
tOCPOvercurrent deglitch timeVVM < 37 V3μs
VVM ≥ 37 V0.5
tRETRYOvercurrent retry timeOCP_MODE = 1b4ms
tOLOpen load detection timeDRV8889-Q1, EN_OL = 1b200ms
DRV8889A-Q1, EN_OL = 1b, OL_TIME = 00b200
DRV8889A-Q1, EN_OL = 1b, OL_TIME = 01b125
DRV8889A-Q1, EN_OL = 1b, OL_TIME = 10b75
DRV8889A-Q1, EN_OL = 1b, OL_TIME = 11b3
IOLOpen load current threshold30mA
TOTWOvertemperature warningDie temperature TJ135150165°C
TUTWUndertemperature warningDie temperature TJ-25-105°C
TOTSDThermal shutdownDie temperature TJ150165180°C
THYS_OTSDThermal shutdown hysteresisDie temperature TJ20°C
THYS_OTWOvertemperature warning hysteresisDie temperature TJ20°C
THYS_UTWUndertemperature warning hysteresisDie temperature TJ10°C