SBOS558D April   2011  – April 2025 INA200-Q1 , INA201-Q1 , INA202-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Current-Shunt Monitor
    6. 6.6 Electrical Characteristics: Comparator
    7. 6.7 Electrical Characteristics: General
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Hysteresis
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Comparator
      2. 8.3.2 Output Voltage Range
    4. 8.4 Device Functional Modes
  10. 9 Application Information
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 Selecting RS
      3. 9.1.3 Input Filtering
      4. 9.1.4 Accuracy Variations as a Result of VSENSE and Common-Mode Voltage
        1. 9.1.4.1 Normal Case 1: VSENSE ≥ 20 mV, VCM ≥ VS
        2. 9.1.4.2 Normal Case 2: VSENSE ≥ 20 mV, VCM < VS
        3. 9.1.4.3 Low VSENSE Case 1: VSENSE < 20 mV, –16 V ≤ VCM < 0 V; and Low VSENSE Case 3: VSENSE < 20 mV, VS < VCM ≤ 80 V
        4. 9.1.4.4 Low VSENSE Case 2: VSENSE < 20 mV, 0 V ≤ VCM ≤ VS
      5. 9.1.5 Transient Protection
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Switch Overcurrent Shutdown
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 High-Side Switch Overcurrent Shutdown
      3. 9.2.3 Bidirectional Overcurrent Comparator
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Output vs Supply Ramp Considerations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision C (April 2016) to Revision D (April 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Device Information table to Package Information Go
  • Removed sentence from Design Requirements: All other register settings are defaultGo
  • Changed Shunt resistor, RSHUNT value in Design Parameters table from: 5 mΩ to: 50 mΩGo
  • Added Output vs Supply Ramp Considerations subsection to the Power Supply Recommendations sectionGo

Changes from Revision B (November 2012) to Revision C (April 2016)

  • Added Device Information andESD Ratings, and Thermal Information tables, and Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Updated data sheet titleGo
  • Updated Features bullets for clarityGo
  • Changed MSOP to VSSOP throughout data sheet to match industry-standard termGo
  • Updated Applications bulletsGo
  • Updated Description section text for clarity Go
  • Changed all figures in data sheet to show Q1 device namesGo
  • Changed pin names in Absolute Maximum Ratings to show correct namesGo
  • Added Operating Temperature to Absolute Maximum Ratings tableGo
  • Changed CMP VOUT to CMPOUT in large-signal differential voltage gain parameter conditionGo
  • Deleted package name from Figure 27Go
  • Changed Figure 28 caption Go
  • Changed text from "RFILT – 3%" to "RFILT + 3%" in 2nd paragraph of Input Filtering sectionGo
  • Changed 22-kΩ R1 resistor to R3 in Figure 31Go

Changes from Revision A (September 2012) to Revision B (October 2012)

  • Changed from Mixed Production status to Production Data.Go
  • Changed device graphic from pair to singleGo
  • Added AEC-Q100 info to Features bulletsGo
  • Updated Applications bulletsGo
  • Removed D package from pin configuration image.Go