SBOS558D April   2011  – April 2025 INA200-Q1 , INA201-Q1 , INA202-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Current-Shunt Monitor
    6. 6.6 Electrical Characteristics: Comparator
    7. 6.7 Electrical Characteristics: General
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Hysteresis
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Comparator
      2. 8.3.2 Output Voltage Range
    4. 8.4 Device Functional Modes
  10. 9 Application Information
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 Selecting RS
      3. 9.1.3 Input Filtering
      4. 9.1.4 Accuracy Variations as a Result of VSENSE and Common-Mode Voltage
        1. 9.1.4.1 Normal Case 1: VSENSE ≥ 20 mV, VCM ≥ VS
        2. 9.1.4.2 Normal Case 2: VSENSE ≥ 20 mV, VCM < VS
        3. 9.1.4.3 Low VSENSE Case 1: VSENSE < 20 mV, –16 V ≤ VCM < 0 V; and Low VSENSE Case 3: VSENSE < 20 mV, VS < VCM ≤ 80 V
        4. 9.1.4.4 Low VSENSE Case 2: VSENSE < 20 mV, 0 V ≤ VCM ≤ VS
      5. 9.1.5 Transient Protection
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Switch Overcurrent Shutdown
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 High-Side Switch Overcurrent Shutdown
      3. 9.2.3 Bidirectional Overcurrent Comparator
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Output vs Supply Ramp Considerations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1.2 Detailed Design Procedure

Figure 9-5 shows the basic connections for a low-side, switch overcurrent shutdown application. Connect input pins IN+ and IN– as close as possible to the current-sensing resistor (RSHUNT) to minimize any resistance in series with the shunt resistance. Additional resistance between the current-sensing resistor and input pins can result in errors in the measurement. When input current flows through this external input resistance, the voltage developed across the shunt resistor can differ from the voltage reaching the input pins. Connect the input pins to one of the three shunt options shown in Figure 9-5.

Use the device gain and shunt resistor value to calculate the OUT pin voltage, VOUT_TRIP, for the desired trip current, as shown in Equation 4:

Equation 4. VOUT_TRIP = ITRIP × RSHUNT × Gain

where

  • ITRIP = Desired trip current
  • RSHUNT = Shunt resistor value

Configure R1 and R2 so that the current trip point is equal to the 0.6-V reference voltage, as shown in Equation 5:

Equation 5. R2 / (R1 + R2) × VOUT_TRIP = 0.6 V