SNVSCF2 November   2025 LM65680

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Wettable Flanks
    2. 5.2 Pinout Design for Clearance and FMEA
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Input Voltage Range (VIN1, VIN2)
      2. 7.3.2  High-Voltage Bias Supply Subregulator (VCC, BIAS)
      3. 7.3.3  Precision Enable and Adjustable Input Voltage UVLO (EN/UVLO)
      4. 7.3.4  Output Voltage Setpoint (FB, BIAS)
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Mode Selection and Clock Synchronization (MODE/SYNC)
        1. 7.3.6.1 Clock Synchronization
        2. 7.3.6.2 Clock Locking
      7. 7.3.7  Device Configuration (CNFG/SYNCOUT)
      8. 7.3.8  Dual-Random Spread Spectrum (DRSS)
      9. 7.3.9  High-Side MOSFET Gate Drive (BST)
      10. 7.3.10 Configurable Soft Start (SS)
        1. 7.3.10.1 Recovery From Dropout
      11. 7.3.11 Protection Features
        1. 7.3.11.1 Power-Good Monitor (PG)
        2. 7.3.11.2 Overcurrent and Short-Circuit Protection
        3. 7.3.11.3 Hiccup-Mode Protection
        4. 7.3.11.4 Thermal Shutdown
      12. 7.3.12 Two-Phase, Single-Output Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Train Components
        1. 8.1.1.1 Buck Inductor
        2. 8.1.1.2 Output Capacitors
        3. 8.1.1.3 Input Capacitors
        4. 8.1.1.4 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
      3. 8.1.3 Maximum Ambient Temperature
        1. 8.1.3.1 Derating Curves
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – 5V, 8A Synchronous Buck Regulator With Wide Input Voltage Range and High Efficiency
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Choosing the Switching Frequency
          3. 8.2.1.2.3  Buck Inductor Selection
          4. 8.2.1.2.4  Input Capacitor Selection
          5. 8.2.1.2.5  Output Capacitors
          6. 8.2.1.2.6  Output Voltage Setpoint
          7. 8.2.1.2.7  Compensation Components
          8. 8.2.1.2.8  Setting the Input Voltage UVLO
          9. 8.2.1.2.9  EMI Mitigation, RDRSS
          10. 8.2.1.2.10 Bootstrap Capacitor, CBST
        3. 8.2.1.3 Application Curves
      2.      Design 2 – High Efficiency, 48V to 12V, 400kHz Synchronous Buck Regulator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Buck Inductor Selection
          2. 8.2.2.2.2 Input Capacitor Selection
          3. 8.2.2.2.3 Output Capacitors
          4. 8.2.2.2.4 Output Voltage Setpoint
          5. 8.2.2.2.5 Compensation Components
          6. 8.2.2.2.6 Feedforward Capacitor
          7. 8.2.2.2.7 Soft-Start Capacitor
        3. 8.2.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Design and Layout
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 Low-EMI Design Resources
        2. 9.2.1.2 Thermal Design Resources
        3. 9.2.1.3 Multiphase Design Resources
        4. 9.2.1.4 PCB Layout Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Pinout Design for Clearance and FMEA

As shown in Figure 5-1, the LM65680/60/40 has a carefully designed pinout arrangement that provides clearance spacing of at least 0.7mm between high-voltage pins (VIN, SW, and BST) and ground (PGND) to meet IPC-2221B and IPC-9592B external conductor clearance rules. The clearance from VIN1 and VIN2 to the PGND DAP is 1.1mm. The clearance from SW1, SW2, SW3, and BST to the PGND DAP is 0.7mm. In addition, NC (no-connect) pins separate VIN1 and PGND1, VIN2 and PGND2, VIN2 to BST, and BIAS to PG.

Moreover, the pinout is designed for critical applications with stricter quality, safety and reliability requirements. In terms of pin FMEA (failure mode effects analysis), the typical failure scenarios considered include short circuit to ground, short circuit to input supply (VIN), short circuit to an adjacent pin, and if a pin is left open circuit. These faults are considered as applied external to the IC and therefore designated as board-level failures rather than IC-level reliability failures. Example sources of such faults are stray conductive filaments causing pin-to-pin shorts or a board manufacturing defect causing an open-circuit track.