SNVSCF2 November 2025 LM65680
PRODUCTION DATA
100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Standard quad-flat no-lead (QFN) packages do not have solderable or exposed pins and terminals that are easily viewed. Visually determining whether or not the package is successfully soldered onto the printed-circuit board (PCB) is therefore difficult. The wettable-flank process is developed to resolve the issue of side-lead wetting of leadless packaging. The LM65680/60/40 is assembled using a 26-pin Enhanced HotRod WQFN package with dimple wettable flanks that allow side-lead solder inspection during manufacturing. This visual indicator of solderability reduces inspection time and manufacturing costs.