SNVSCF2 November   2025 LM65680

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Wettable Flanks
    2. 5.2 Pinout Design for Clearance and FMEA
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Input Voltage Range (VIN1, VIN2)
      2. 7.3.2  High-Voltage Bias Supply Subregulator (VCC, BIAS)
      3. 7.3.3  Precision Enable and Adjustable Input Voltage UVLO (EN/UVLO)
      4. 7.3.4  Output Voltage Setpoint (FB, BIAS)
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Mode Selection and Clock Synchronization (MODE/SYNC)
        1. 7.3.6.1 Clock Synchronization
        2. 7.3.6.2 Clock Locking
      7. 7.3.7  Device Configuration (CNFG/SYNCOUT)
      8. 7.3.8  Dual-Random Spread Spectrum (DRSS)
      9. 7.3.9  High-Side MOSFET Gate Drive (BST)
      10. 7.3.10 Configurable Soft Start (SS)
        1. 7.3.10.1 Recovery From Dropout
      11. 7.3.11 Protection Features
        1. 7.3.11.1 Power-Good Monitor (PG)
        2. 7.3.11.2 Overcurrent and Short-Circuit Protection
        3. 7.3.11.3 Hiccup-Mode Protection
        4. 7.3.11.4 Thermal Shutdown
      12. 7.3.12 Two-Phase, Single-Output Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Train Components
        1. 8.1.1.1 Buck Inductor
        2. 8.1.1.2 Output Capacitors
        3. 8.1.1.3 Input Capacitors
        4. 8.1.1.4 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
      3. 8.1.3 Maximum Ambient Temperature
        1. 8.1.3.1 Derating Curves
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – 5V, 8A Synchronous Buck Regulator With Wide Input Voltage Range and High Efficiency
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Choosing the Switching Frequency
          3. 8.2.1.2.3  Buck Inductor Selection
          4. 8.2.1.2.4  Input Capacitor Selection
          5. 8.2.1.2.5  Output Capacitors
          6. 8.2.1.2.6  Output Voltage Setpoint
          7. 8.2.1.2.7  Compensation Components
          8. 8.2.1.2.8  Setting the Input Voltage UVLO
          9. 8.2.1.2.9  EMI Mitigation, RDRSS
          10. 8.2.1.2.10 Bootstrap Capacitor, CBST
        3. 8.2.1.3 Application Curves
      2.      Design 2 – High Efficiency, 48V to 12V, 400kHz Synchronous Buck Regulator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Buck Inductor Selection
          2. 8.2.2.2.2 Input Capacitor Selection
          3. 8.2.2.2.3 Output Capacitors
          4. 8.2.2.2.4 Output Voltage Setpoint
          5. 8.2.2.2.5 Compensation Components
          6. 8.2.2.2.6 Feedforward Capacitor
          7. 8.2.2.2.7 Soft-Start Capacitor
        3. 8.2.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Design and Layout
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 Low-EMI Design Resources
        2. 9.2.1.2 Thermal Design Resources
        3. 9.2.1.3 Multiphase Design Resources
        4. 9.2.1.4 PCB Layout Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.1.1 Thermal Design and Layout

For a DC/DC regulator to be useful over a particular temperature range, the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The LM65680/60/40 converter is available in a small 4.5mm × 4.5mm 26-pin Enhanced HotRod QFN package to cover a range of application requirements. The Section 6.4 table summarizes the thermal metrics of this package, with related detail provided by the Semiconductor and IC Package Thermal Metrics application note.

The 26-pin eQFN package offers a means of removing heat from the semiconductor die through the exposed thermal pad at the base of the package. This exposed pad connects thermally to the substrate of the LM65680/60/40 (ground). This connection allows a significant improvement in heatsinking, and the PCB must be designed with thermal lands, thermal vias, and one or more ground planes to complete the heat removal subsystem. The exposed pad of the LM65680/60/40 solders to the ground-connected copper land on the PCB directly underneath the device package, reducing the IC thermal resistance to a very low value.

Preferably, use a four-layer board with 2oz copper thickness for all layers to provide low impedance, proper shielding and lower thermal resistance. Numerous vias with a 0.3mm diameter connected from the thermal land (and from the area around the PGND pins) to the internal and solder-side ground planes are vital to promote heat transfer. In a multi-layer PCB design, a solid ground plane locates on the PCB layer below the power-stage components. Not only does this placement provide a plane for the power-stage currents to flow, but this placement also represents a thermally conductive path away from the heat-generating devices.

TI recommends providing adequate device heatsinking by using vias near the PGND and VIN pins to connect to the system ground plane or VIN strap, both of which dissipate heat. Use as much copper as possible for the system ground plane on the top and bottom layers and avoid plane cuts and bottlenecks for the heat flow to optimize heat spreading.