SLOS224K July   1999  – May 2024 THS4031 , THS4032

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information - THS4031
    5. 5.5  Thermal Information - THS4032
    6. 5.6  Electrical Characteristics - THS4031, RL = 150Ω
    7. 5.7  Electrical Characteristics - THS4031, RL = 1kΩ
    8. 5.8  Electrical Characteristics - THS4032, RL = 150Ω
    9. 5.9  Electrical Characteristics - THS4032, RL = 1kΩ
    10. 5.10 Typical Characteristics - THS4031
    11. 5.11 Typical Characteristics - THS4032
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 Low-Pass Filter Configurations
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Selection of Multiplexer
        2. 7.2.2.2 Signal Source
        3. 7.2.2.3 Driving Amplifier
        4. 7.2.2.4 Driving Amplifier Bandwidth Restriction
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 General PowerPAD™ Integrated Circuit Package Design Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC– to VCC+ Supply voltage 33 V
VI Input voltage ±VCC V
IO Output current(2) 240 mA
VIO Differential input voltage ±1.5 V
IIN Continuous input current 10 mA
TA Operating free-air temperature C-suffix 0 70 °C
I-suffix –40 85
TJ Junction temperature Any condition 150 °C
Maximum junction temperature, continuous operation, long term reliability(3) 130
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) When continuously operating at any output current, do not exceed the maximum junction temperature. Keep the output current less than the absolute maximum rating regardless of time interval.
(3) The maximum junction temperature for continuous operation is limited by package constraints. Operation greater than this temperature can result in reduced reliability, lifetime of the device, or both.