SNIS214E june   2021  – july 2023 TMP114

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 1.2 V Compatible Logic Inputs
      2. 8.3.2 Cyclic Redundancy Check (CRC)
      3. 8.3.3 Temperature Limits
      4. 8.3.4 Slew Rate Warning
      5. 8.3.5 NIST Traceability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
        1. 8.4.2.1 One-Shot Temperature Conversions
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 I2C and SMBus Interface
      3. 8.5.3 Device Address
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Auto-Increment
        2. 8.5.4.2 Writes
          1. 8.5.4.2.1 CRC Enabled Writes
        3. 8.5.4.3 Reads
          1. 8.5.4.3.1 CRC Enabled Reads
        4. 8.5.4.4 General Call Reset Function
        5. 8.5.4.5 Time-Out Function
        6. 8.5.4.6 Coexist on I3C MixedBus
        7. 8.5.4.7 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Separate I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Equal I2C Pullup and Supply Voltage Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Typical Characteristics

GUID-7F324763-1C83-4C46-8FA1-29CAA3F0DDA5-low.svg
VDD = 1.8 V
Conversion Period 31.25 ms to 2 s
AVG = 0 or 8 Averages
Figure 7-1 Temperature Error vs Temperature
GUID-20210924-SS0I-ZG4L-X5Z4-B6LKN6GPSQ0W-low.svg
Figure 7-3 Active Current vs Temperature
GUID-20210924-SS0I-LMJG-WXJJ-LXMVQZQ44FND-low.svg
Figure 7-5 Shutdown Current vs Temperature
GUID-20210924-SS0I-TXSP-P0G6-VZR4RHGWSHMZ-low.svg
TA = 25°C
Figure 7-7 Supply Current vs VDD With Toggling SCL
GUID-20210924-SS0I-TXCC-GBTL-KLTXJQRZ2GRB-low.svg
A.
Figure 7-9 Conversion Time vs Temperature
GUID-20210924-SS0I-NVB2-CP92-NFKPD2ZF0GKJ-low.svg
TSTART = Room (25°C), TFINISH = 75°C
Figure 7-11 Response Time
GUID-20210927-SS0I-JMMV-FHGG-XKDD9D4WBP96-low.svg
TA = 25°C
Figure 7-13 Data Distribution With 6.4-ms Conversion Time and Averaging Off
GUID-20210927-SS0I-SRFT-T62G-ZDL8WVLF27QG-low.svg
TA = 25°C
Figure 7-15 Data Distribution With 3.5-ms Conversion Time and Averaging Off
GUID-20210927-SS0I-FLMB-GHPJ-RB04ZMP87PDG-low.svg
TA = 25°C
Figure 7-17 Data Distribution With 2-ms Conversion Time and Averaging Off
GUID-20210927-SS0I-TMBP-VKGX-V7GJCL8VPMHM-low.svg
TA = 25°C
Figure 7-19 Data Distribution With 1.2-ms Conversion Time and Averaging Off
GUID-20210924-SS0I-CVM2-CMWN-HJK37MVVLZ7C-low.svg
VDD = 1.2 V
Conversion Period 31.25 ms to 2 s
AVG = 0 or 8 Averages
Figure 7-2 Temperature Error vs Temperature
GUID-20210924-SS0I-N0DW-CST9-NJB3DQXM3JDG-low.svg
A.
Figure 7-4 Standby Current vs Temperature
GUID-20210924-SS0I-KL6Z-HJ1K-PVGQWMTMFVHD-low.svg
TA = –40°C
Figure 7-6 Supply Current vs VDD With Toggling SCL
GUID-20210924-SS0I-XS73-WGRK-FZLNTR66S5PS-low.svg
TA = 125°C
Figure 7-8 Supply Current vs VDD With Toggling SCL
GUID-20210924-SS0I-GKJ8-BXRQ-JLP9DCMWBH45-low.svg
A.
Figure 7-10 VOL vs Temperature
GUID-20210927-SS0I-LLJL-WDDP-5M3HMQFC8J6Q-low.svg
TA = 25°C
Figure 7-12 Data Distribution With 6.4-ms Conversion Time and Averaging On
GUID-20210927-SS0I-6GZN-9DZP-7NMMJ3GPSG0Q-low.svg
TA = 25°C
Figure 7-14 Data Distribution With 3.5-ms Conversion Time and Averaging On
GUID-20210927-SS0I-PQXG-SFL9-5F8KGV82RJMZ-low.svg
TA = 25°C
Figure 7-16 Data Distribution With 2-ms Conversion Time and Averaging On
GUID-20210927-SS0I-5BLM-VDZ0-8QCGK67LR6KK-low.svg
TA = 25°C
Figure 7-18 Data Distribution With 1.2-ms Conversion Time and Averaging On