SNIS241 September   2025 TMP461-EP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Information
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Decoding Temperature Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
  9. Register Map
    1. 8.1 Register Information
      1. 8.1.1  Pointer Register
      2. 8.1.2  Local and Remote Temperature Registers
      3. 8.1.3  Status Register
      4. 8.1.4  Configuration Register
      5. 8.1.5  Conversion Rate Register
      6. 8.1.6  One-Shot Start Register
      7. 8.1.7  Channel Enable Register
      8. 8.1.8  Consecutive ALERT Register
      9. 8.1.9  η-Factor Correction Register
      10. 8.1.10 Remote Temperature Offset Register
      11. 8.1.11 Manufacturer Identification Register
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Related Documentation
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Serial Bus Address

To communicate with the TMP461-EP device, the controller must first address target devices using a target address byte. The target address byte consists of seven address bits and a direction bit indicating the intent of executing a read or write operation. The TMP461-EP allows up to nine devices to be connected to the SMBus, depending on the A0, A1 pin connections as described in Table 7-5. The A0 and A1 address pins must be isolated from noisy or high-frequency signals traces to avoid false address settings when these pins are set to a float state.

Table 7-5 TMP461-EP Target Address Options
A1 CONNECTIONA0 CONNECTIONTARGET ADDRESS
BINARYHEX
GNDGND1001 00048
GNDFloat1001 00149
GNDV+1001 0104A
FloatGND1001 0114B
FloatFloat1001 1004C
FloatV+1001 1014D
V+GND1001 1104E
V+Float1001 1114F
V+V+1010 00050