SLOS970B January   2018  – January 2025 TPA6404-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Parameter measurement Information
  8. 7 Detailed description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Differential Analog inputs
      2. 7.3.2 Gain Control and AC-Coupling
      3. 7.3.3 High-Frequency Pulse-Width Modulator (PWM)
      4. 7.3.4 Gate Drive
      5. 7.3.5 Power FETs
      6. 7.3.6 Load Diagnostics
        1. 7.3.6.1 DC Load Diagnostics
          1. 7.3.6.1.1 Automatic DC Load Diagnostics
          2. 7.3.6.1.2 I2C Controlled DC Load Diagnostics
        2. 7.3.6.2 Line Output Diagnostics
        3. 7.3.6.3 AC Load Diagnostics
          1. 7.3.6.3.1 Impedance Phase Reference Measurement
          2. 7.3.6.3.2 Impedance Phase Measurement
          3. 7.3.6.3.3 Impedance Magnitude Measurement
      7. 7.3.7 Protection and Monitoring
        1. 7.3.7.1 Over current Limit (ILIMIT)
        2. 7.3.7.2 Over current Shutdown (ISD)
        3. 7.3.7.3 DC Detect
        4. 7.3.7.4 Clip Detect
        5. 7.3.7.5 Global Over Temperature Warning (OTW), Over Temperature Shutdown (OTSD) and Thermal Foldback (TFB)
        6. 7.3.7.6 Channel Over Temperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 7.3.7.7 Thermal Foldback
        8. 7.3.7.8 Undervoltage (UV) and Power-On-Reset (POR)
        9. 7.3.7.9 Over Voltage (OV) and Load Dump
      8. 7.3.8 Power Supply
        1. 7.3.8.1 Power-Supply Sequence
      9. 7.3.9 Hardware Control Pins
        1. 7.3.9.1 FAULT
        2. 7.3.9.2 WARN
        3. 7.3.9.3 MUTE
        4. 7.3.9.4 STANDBY
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes and Faults
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Communication Bus
      2. 7.5.2 I2C Bus Protocol
      3. 7.5.3 Random Write
      4. 7.5.4 Sequential Write
      5. 7.5.5 Random Read
      6. 7.5.6 Sequential Read
  9. 8 Registers
    1. 8.1 Register Maps
      1. 8.1.1  Mode Control Register (address = 0x00) [default = 0x00]
      2. 8.1.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
      3. 8.1.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
      4. 8.1.4  Channel State Control Register (address = 0x04) [default = 0x55]
      5. 8.1.5  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
      6. 8.1.6  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
      7. 8.1.7  DC Load Diagnostic Control 3 Register (address = 0x0B) [default = 0x11]
      8. 8.1.8  DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
      9. 8.1.9  DC Load Diagnostic Report 2 Register (address = 0x0D) [default = 0x00]
      10. 8.1.10 DC Load Diagnostics Report 3—Line Output—Register (address = 0x0E) [default = 0x00]
      11. 8.1.11 Channel State Reporting Register (address = 0x0F) [default = 0x55]
      12. 8.1.12 Channel Faults (Over current, DC Detection) Register (address = 0x10) [default = 0x00]
      13. 8.1.13 Global Faults 1 Register (address = 0x11) [default = 0x00]
      14. 8.1.14 Global Faults 2 Register (address = 0x12) [default = 0x00]
      15. 8.1.15 Warnings Register (address = 0x13) [default = 0x20]
      16. 8.1.16 Pin Control Register (address = 0x14) [default = 0x00]
      17. 8.1.17 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
      18. 8.1.18 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
      19. 8.1.19 AC Load Diagnostic Report Ch1 through CH4 Registers (address = 0x17–0x1A) [default = 0x00]
      20. 8.1.20 AC Load Diagnostic Report Phase High Register (address = 0x1B) [default = 0x00]
      21. 8.1.21 AC Load Diagnostic Report Phase Low Register (address = 0x1C) [default = 0x00]
      22. 8.1.22 AC Load Diagnostic Report STI High Register (address = 0x1D) [default = 0x00]
      23. 8.1.23 AC Load Diagnostic Report STI Low Register (address = 0x1E) [default = 0x00]
      24. 8.1.24 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
      25. 8.1.25 Clip Control Register (address = 0x22) [default = 0x01]
      26. 8.1.26 Clip Warning Register (address = 0x24) [default = 0x00]
      27. 8.1.27 Current LIMIT Status Register (address = 0x25) [default = 0x00]
      28. 8.1.28 Fault and Warning Pin Control Register (address = 0x27) [default = 0x7F]
      29. 8.1.29 Thermal Foldback Control Register (address = 0x28) [default = 0x00]
      30. 8.1.30 AC Diagnostic Frequency Control Register (address = 0x2A) [default = 0x32]
      31. 8.1.31 SYNC PIN Control Register (address = 0x2B) [default = 0x02]
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 AM Radio Avoidance
      2. 9.1.2 Parallel BTL Operation (PBTL)
      3. 9.1.3 Reconstruction Filter Design
      4. 9.1.4 Line Driver Applications
    2. 9.2 Typical Applications
      1. 9.2.1 BTL Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Hardware Design
          2. 9.2.1.2.2 Bootstrap Capacitors
          3. 9.2.1.2.3 Output Reconstruction Filter
        3. 9.2.1.3 Application Curves
        4. 9.2.1.4 PBTL Application
          1. 9.2.1.4.1 Design Requirements
          2. 9.2.1.4.2 Detailed Design Procedure
            1. 9.2.1.4.2.1 Hardware Design
          3. 9.2.1.4.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Electrical Connection of Thermal pad and Heat Sink
        2. 9.4.1.2 EMI Considerations
        3. 9.4.1.3 General Considerations
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
    5. 10.5 Support Resources
    6. 10.6 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DKQ|56
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TPA6404-Q1 DKQ Package56-Pin HSSOP With Exposed Thermal PadTop ViewFigure 4-1 DKQ Package56-Pin HSSOP With Exposed Thermal PadTop View
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
AVDD5PWRVoltage regulator bypass. Connect 1µF capacitor from AVDD to AVSS
AVSS4PWRAVDD bypass capacitor return
BST_1M31PWRBootstrap capacitor connection pins for high-side gate driver
BST_1P35PWRBootstrap capacitor connection pins for high-side gate driver
BST_2M37PWRBootstrap capacitor connection pins for high-side gate driver
BST_2P41PWRBootstrap capacitor connection pins for high-side gate driver
BST_3M44PWRBootstrap capacitor connection pins for high-side gate driver
BST_3P48PWRBootstrap capacitor connection pins for high-side gate driver
BST_4M50PWRBootstrap capacitor connection pins for high-side gate driver
BST_4P54PWRBootstrap capacitor connection pins for high-side gate driver
DVDD18PWRDVDD supply input. Connect 1 µF capacitor from DVDD to DVSS
DVSS17GNDDVDD Ground Reference
FAULT26DOReports a fault (active low, open drain), 100-kΩ internal pull-up resistor
GND1, 8, 28, 33, 36, 39, 46, 49, 52GNDGround
GVDD_346PWRGate drive voltage regulator for channel 3 and 4, derived from VBAT input pins. Connect 2.2µF capacitor to GND
GVDD_127PWRGate drive voltage regulator for channel 1 and 2, derived from VBAT input pins. Connect 2.2µF capacitor to GND
I2C_ADDR022DII2C address pins. Refer to Table 7-7
I2C_ADDR123
IN_1M16AINegative input for the channel
IN_1P15AIPositive input for the channel
IN_2M14AINegative input for the channel
IN_2P13AIPositive input for the channel
IN_3M12AINegative input for the channel
IN_3P11AIPositive input for the channel
IN_4M10AINegative input for the channel
IN_4P9AIPositive input for the channel
MUTE25DIMutes the device outputs (active low), 100-kΩ internal pull-down resistor
OUT_1M32NONegative output for the channel
OUT_1P34POPositive output for the channel
OUT_2M38NONegative output for the channel
OUT_2P40POPositive output for the channel
OUT_3M45NONegative output for the channel
OUT_3P47POPositive output for the channel
OUT_4M51NONegative output for the channel
OUT_4P53POPositive output for the channel
PVDD2, 29, 30, 42, 43, 55, 56PWRPVDD voltage input (can be connected to battery)
SCL20DII2C clock input
SDA21DI/OI2C data input and output
STANDBY24DIEnables low power standby state (active Low), 1MΩ internal pull-down resistor
SYNC19DI/OSync clock input or output
VBAT3PWRBattery voltage input
WARN27DOClip and overtemperature warning (active low, open drain), 100kΩ internal pull-up resistor
Thermal Pad—GNDProvides both electrical and thermal connection for the device. Heatsink must be connected to GND.
(1) AI = analog input, GND = ground, PWR = power, PO = positive output, NO = negative output, DI = digital input, DO = digital output, DI/O = digital input and output, NC = No Connection