SPRABJ8B September   2022  – November 2023 AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Acronyms
  5. 2 Power
    1. 2.1 Discrete DC-DC Power Solution
    2. 2.2 Integrated PMIC Power Solution
    3. 2.3 Power Decoupling and Filtering
    4. 2.4 Power Consumption
    5. 2.5 Power Distribution Network
      1. 2.5.1 Simulations
        1. 2.5.1.1 Core Digital Power 1.2 V
        2. 2.5.1.2 Digital/Analog I/O Power 3.3 V
    6. 2.6 e-Fuse Power
  6. 3 Clocking
    1. 3.1 Crystal and Oscillator Input Options
    2. 3.2 Output Clock Generation
    3. 3.3 Crystal Selection and Shunt Capacitance
    4. 3.4 Crystal Placement and Routing
  7. 4 Resets
  8. 5 Bootstrapping
    1. 5.1 SOP Signal Implementation
    2. 5.2 OSPI/QSPI Memory Implementation
    3. 5.3 ROM OSPI/QSPI Boot Requirements
  9. 6 JTAG Emulators and Trace
  10. 7 Multiplexed Peripherals
  11. 8 Digital Peripherals
    1. 8.1 General Digital Peripheral Routing Guidelines
  12. 9 Analog Peripherals
    1. 9.1 General Analog Peripheral Routing Guidelines
      1. 9.1.1 Resolver ADC Routing Guidelines
  13. 10Layer Stackup
    1. 10.1 Key Stackup Features
  14. 11Vias
  15. 12BGA Power Fan-Out and Decoupling Placement
    1. 12.1 Ground Return
    2. 12.2 1.2 V Core Digital Power
      1. 12.2.1 Key Layout Considerations
    3. 12.3 3.3 V Digital and Analog Power
      1. 12.3.1 Key Layout Considerations
    4. 12.4 1.8 V Digital and Analog Power
      1. 12.4.1 Key Layout Considerations
  16. 13References
  17.   Revision History

2.3 Power Decoupling and Filtering

Table 2-1 describes the initial BGA decoupling and power filtering required for the AM263x and AM263Px. These were based on the initial simulation feedback of the Control Card EVM PCB and AM263x package with the transient use-cases shown in Table 2-3.

The decoupling network presented in the below sections and in the AM263x EVM schematics and layouts are reasonable starting points for any AM263x or AM263Px PCB design. However, due to specific PCB routing differences and the resulting plane capacitance and decoupling mounting inductances and other parasitics, it is highly recommended that designers simulate and measure their specific power distribution network performance. Simulations and measurements should ideally be done with target application software active, and intended operating environment conditions applied to the system.

The AM263Px Sensor Package has additional set of ADC reference voltages, ADC_VREFHI_G3 and ADC_VREFLO_G3, which are shown in Figure 2-10

Table 2-1 AM263x and AM263Px Recommended Decoupling per Power Net
Device Supply Quantity Comment Part Number Manufacturer
VDD_CORE 2 2.2 µF, 6.3 V, ± 10%, X7R, AEC-Q200 Grade 1, 0603 GCM188R70J225KE22D Murata
3 0.22 µF, 16 V,± 10%, X7R, AEC-Q200 Grade 1, 0402 GCM155R71C224KE02D Murata
16 0.01 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 CGA2B3X7R1H103K050BB TDK
VNWA 1 0.22 µF, 16 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 GCM155R71C224KE02D Murata
1 0.01 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 CGA2B3X7R1H103K050BB Murata
VDD_F 1 0.22 µF, 16 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 GCM155R71C224KE02D TDK
1 0.01 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 CGA2B3X7R1H103K050BB TDK
VDDAR_CORE 1 2.2 uF, 6.3 V, ± 10%, X7R, AEC-Q200 Grade 1, 0603 GCM188R70J225KE22D Murata
2 0.22 µF, 16 V,± 10%, X7R, AEC-Q200 Grade 1, 0402 GCM155R71C224KE02D Murata
1 Ferrite Bead, 120 Ω @ 100 MHz, 2 A, 0603 742792625 Wurth
3 0.01 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 CGA2B3X7R1H103K050BB TDK
VDDA18_LDO
VDDA18
VDDA18_OSC_PLL
VDDA18_TEMP		 1 3.3 µF, 10 V, ± 10%, X5R, 0603 GRM188R61A335KE15D Murata
4 0.1 µF, 6.3 V, ± 10%, X7R, 0402 GRM155R70J104KA01D Murata
VDDS18_LDO
VDDS18		 1 3.3 µF, 10 V, ± 10%, X5R, 0603 GRM188R61A335KE15D Murata
4 0.1 µF, 6.3 V, ± 10%, X7R, 0402 GRM155R70J104KA01D Murata
VDDS33 3 2.2 µF, 6.3 V, ± 10%, X7R, AEC-Q200 Grade 1, 0603 GCM188R70J225KE22D Murata
4 0.22 µF, 16 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 GCM155R71C224KE02D Murata
1 Ferrite Bead, 120 Ω @ 100 MHz, 2 A, 0603 742792625 Wurth
7 0.01 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 CGA2B3X7R1H103K050BB TDK
VDDA33 1 2.2 µF, 6.3 V, ± 10%, X7R, AEC-Q200 Grade 1, 0603 GCM188R70J225KE22D Murata
2 0.22 µF, 16 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 GCM155R71C224KE02D Murata
1 Ferrite Bead, 120 Ω @ 100 MHz, 2 A, 0603 742792625 Wurth
3 0.01 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0402 CGA2B3X7R1H103K050BB TDK
GUID-20220808-SS0I-XGSH-QK9V-SJTPHHDMZRS1-low.svg Figure 2-6 AM263x LaunchPad Excerpt – 1.2 V Power Decoupling Schematic
GUID-20220808-SS0I-VVHH-P530-RNGFFJQFWCBX-low.svg Figure 2-7 AM263x LaunchPad Excerpt – 3.3 V Digital I/O and Analog I/O Decoupling and Filtering Schematic
GUID-20220808-SS0I-7NGH-4Z35-41FMS95HDMJJ-low.svg Figure 2-8 AM263x LaunchPad Excerpt – 1.8 V Digital I/O and Analog I/O Decoupling and Filtering Schematic
GUID-20220808-SS0I-3XMN-CK14-9LS9XKFFDTFX-low.svg Figure 2-9 AM263x LaunchPad Excerpt – ADC and DAC VREF Decoupling Schematic
GUID-610F083F-9294-4BE6-AAC6-1B8CED6756C1-low.png Figure 2-10 AM263Px controlCard Excerpt – additional VREFHI_G3 and VREFLO_G3 connections