TI provides the following collaterals
to aid in hardware module design.
TI Reference Collaterals
- Texas Instruments, Antenna Design lists several factors to consider
when designing an antenna which can allow designers to maximize the achievable
performance for specific application.
- Texas Instruments, TI
mmWave Radar sensor RF PCB Design, Manufacturing and Validation Guide
application note helps sensor designers design, manufacture, and
validate a new mmWave Sensor board.
- Texas Instruments, Flash
Variants Supported by mmWave Sensor application note describes the
flash variants supported by TI mmWave Sensor.
- Texas Instruments, mmWave
Radar Radome Design Guide application note provides an introduction
to radome design and highlights key issues for designing a mmWave radome whilst
considering the radar sensor performance.
- Texas Instruments, Addressing 3 power design challenges for corner radar systems,
technical article
- Texas Instruments, Reliability advantages of TI flip-chip BGA packaging, marketing
white paper
- Texas Instruments, Thermal
Design Guide for Antenna on Package mmWave Sensor application note
helps in the thermal design aspect of TI Antenna on package mmWave sensor
products.
- Texas Instruments, Integration Considerations, webpage
- Texas Instruments, Hardware Design Checklist is a design checklist for the
AWR2944.
- Texas Instruments,
System Performance Measurement With the mmWave Sensor application
note discusses system performance measurement results using the high
performance mmWave sensor.
- Texas Instruments, Best
Practices for Placement and Angle of mmWave Radar Devices,
application bried