SBOS790A April   2017  – March 2025 INA233

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High-Accuracy Analog-to-Digital Convertor (ADC)
      2. 6.3.2 Interleaved Power Calculation
      3. 6.3.3 Power Accumulator and Energy Measurement
      4. 6.3.4 I2C-, SMBus-, and PMBus-Compatible Digital Interface
      5. 6.3.5 Multiple Fault Event Reporting
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous Verses Triggered Operation
      2. 6.4.2 Device Shutdown
      3. 6.4.3 Averaging and Conversion Time Considerations
      4. 6.4.4 Filtering and Input Considerations
    5. 6.5 Programming
      1. 6.5.1 Default Settings
      2. 6.5.2 Calibration Register and Scaling
      3. 6.5.3 Reading and Writing Telemetry Data and Warning Thresholds
      4. 6.5.4 Reading Telemetry Data and Warning Thresholds
        1. 6.5.4.1 Writing Telemetry Data and Warning Thresholds
      5. 6.5.5 System-Level Calibration With MFR_CALIRATION Command
      6. 6.5.6 Bus Overview
        1. 6.5.6.1 Serial Bus Address
        2. 6.5.6.2 Serial Interface
        3. 6.5.6.3 Writing to and Reading From the INA233
          1. 6.5.6.3.1 Packet Error Checking
          2. 6.5.6.3.2 Bus Timing Requirements
        4. 6.5.6.4 SMBus Alert Response
    6. 6.6 Register Maps
      1. 6.6.1 PMBus Command Support
      2. 6.6.2 Standard PMBus Commands
        1. 6.6.2.1  CLEAR_FAULTS (03h)
        2. 6.6.2.2  RESTORE_DEFAULT_ALL (12h)
        3. 6.6.2.3  CAPABILITY (19h)
        4. 6.6.2.4  IOUT_OC_WARN_LIMIT (4Ah) [default = 01111111 11111000]
        5. 6.6.2.5  VIN_OV_WARN_LIMIT (57h) [default = 01111111 11111000]
        6. 6.6.2.6  VIN_UV_WARN_LIMIT (58h) [default = 00000000 00000000]
        7. 6.6.2.7  PIN_OP_WARN_LIMIT (6Bh) [default = 11111111 11110000]
        8. 6.6.2.8  STATUS_BYTE (78h)
        9. 6.6.2.9  STATUS_WORD (79h)
        10. 6.6.2.10 STATUS_IOUT (7Bh)
        11. 6.6.2.11 STATUS_INPUT (7Ch)
        12. 6.6.2.12 STATUS_CML (7Eh)
        13. 6.6.2.13 STATUS_MFR_SPECIFIC (80h)
        14. 6.6.2.14 READ_EIN (86h)
        15. 6.6.2.15 READ_VIN (88h)
        16. 6.6.2.16 READ_IIN (89h)
        17. 6.6.2.17 READ_VOUT (8Bh)
        18. 6.6.2.18 READ_IOUT (8Ch, R)
        19. 6.6.2.19 READ_POUT (96h, R)
        20. 6.6.2.20 READ_PIN (97h, R)
        21. 6.6.2.21 MFR_ID (99h)
        22. 6.6.2.22 MFR_MODEL (9Ah)
        23. 6.6.2.23 MFR_REVISION (9Bh)
      3. 6.6.3 Manufacturer-Specific PMBus Commands
        1. 6.6.3.1 MFR_ADC_CONFIG (D0h) [default = 01000001 00100111]
        2. 6.6.3.2 MFR_READ_VSHUNT (D1h) [default = 00000000 00000000]
        3. 6.6.3.3 MFR_ALERT_MASK (D2h) [default = XXXXXXXX 11110000]
        4. 6.6.3.4 MFR_CALIBRATION (D4h) [default = 00000000 00000001]
        5. 6.6.3.5 MFR_DEVICE_CONFIG (D5h) [default = 00000010]
        6. 6.6.3.6 5.1.1 CLEAR_EIN (D6h)
        7. 6.6.3.7 TI_MFR_ID (E0h) [value = 01010100 01001001]
        8. 6.6.3.8 TI_MFR_MODEL (E1h) [value = 00110011 00110011]
        9. 6.6.3.9 TI_MFR_REVISION (E2h) [value = 01000001 00110000]
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Programming the Calibration Register
        2. 7.2.2.2 Calculating PMBus Coefficients
        3. 7.2.2.3 Programming Warning Thresholds
        4. 7.2.2.4 Calculating Returned Telemetry Values
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)INA233UNIT
DGS (VSSOP)
10 PINS
RθJAJunction-to-ambient thermal resistance171.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance42.9°C/W
RθJBJunction-to-board thermal resistance91.8°C/W
ψJTJunction-to-top characterization parameter1.5°C/W
ψJBJunction-to-board characterization parameter90.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.