SBOU024C august   2004  – july 2023 PGA309

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Related Documentation from Texas Instruments
    3.     If You Need Assistance
    4.     Information About Cautions and Warnings
    5.     FCC Warning
    6.     Trademarks
  3. 1Introduction
    1. 1.1  PGA309 Functional Description
    2. 1.2  Sensor Error Adjustment Range
    3. 1.3  Gain Scaling
    4. 1.4  Offset Adjustment
    5. 1.5  Voltage Reference
    6. 1.6  Sensor Excitation and Linearization
    7. 1.7  ADC for Temperature Sensing
    8. 1.8  External EEPROM and Temperature Coefficients
    9. 1.9  Fault Monitor
    10. 1.10 Over-Scale and Under-Scale Limits
    11. 1.11 Power-Up and Normal Operation
    12. 1.12 Digital Interface
    13. 1.13 Pin Configuration
  4. 2Detailed Description
    1. 2.1  Gain Scaling
      1. 2.1.1 PGA309 Transfer Function
      2. 2.1.2 Solving For Gain Settings
    2. 2.2  Offset Scaling
    3. 2.3  Zero DAC and Gain DAC Architecture
    4. 2.4  Output Amplifier
    5. 2.5  Reference Voltage
    6. 2.6  Linearization Function
      1. 2.6.1 System Definitions
      2. 2.6.2 Key Linearization Design Equations
        1. 2.6.2.1 Lin DAC Counts Conversion
      3. 2.6.3 Key Ideal Design Equations
        1. 2.6.3.1 Linearization Design
        2.       37
    7. 2.7  Temperature Measurement
      1. 2.7.1 Temp ADC Start-Convert Control
      2. 2.7.2 External Temperature Sensing with an Excitation Series Resistor
    8. 2.8  Fault Monitor
    9. 2.9  Over-Scale and Under-Scale
      1. 2.9.1 Over-Scale and Under-Scale Calculation
      2.      44
    10. 2.10 Noise and Coarse Offset Adjust
    11. 2.11 General AC Considerations
  5. 3Operating Modes
    1. 3.1 Power-On Sequence and Normal Stand-Alone Operation
    2. 3.2 EEPROM Content and Temperature Lookup Table Calculation
      1. 3.2.1 Temperature Lookup Table Calculation
        1. 3.2.1.1 Temperature Lookup Table Calculation
        2.       52
        3.       53
    3. 3.3 Checksum Error Event
    4. 3.4 Test Pin
    5. 3.5 Power-On Initial Register States
      1. 3.5.1 PGA309 Power-Up State
  6. 4Digital Interface
    1. 4.1  Description
    2. 4.2  Two-Wire Interface
      1. 4.2.1 Device Addressing
      2. 4.2.2 Two-Wire Access to PGA309
    3. 4.3  One-Wire Interface
    4. 4.4  One-Wire Interface Timeout
    5. 4.5  One-Wire Interface Timing Considerations
    6. 4.6  Two-Wire Access to External EEPROM
    7. 4.7  One-Wire Interface Initiated Two-Wire EEPROM Transactions
    8. 4.8  PGA309 Stand-Alone Mode and Two-Wire Transactions
    9. 4.9  PGA309 Two-Wire Bus Master Operation and Bus Sharing Considerations
    10. 4.10 One-Wire Operation with PRG Connected to VOUT
    11. 4.11 Four-Wire Modules and One-Wire Interface (PRG)
  7. 5Application Background
    1. 5.1 Bridge Sensors
    2. 5.2 System Scaling Options for Bridge Sensors
      1. 5.2.1 Absolute Scale
      2. 5.2.2 Ratiometric Scale
    3. 5.3 Trimming Real World Bridge Sensors for Linearity
    4. 5.4 PGA309 Calibration Procedure
  8. 6Register Descriptions
    1. 6.1 Internal Register Overview
    2. 6.2 Internal Register Map
      1. 6.2.1 Register 0: Temp ADC Output Register (Read Only, Address Pointer = 00000)
      2. 6.2.2 Register 1: Fine Offset Adjust (Zero DAC) Register (Read/Write, Address Pointer = 00001)
      3. 6.2.3 Register 2: Fine Gain Adjust (Gain DAC) Register (Read/Write, Address Pointer = 00010)
      4. 6.2.4 Register 3: Reference Control and Linearization Register (Read/Write, Address Pointer = 00011)
      5. 6.2.5 Register 4: PGA Coarse Offset Adjust and Gain Select/Output Amplifier Gain Select Register (Read/Write, Address Pointer = 00100)
      6. 6.2.6 Register 5: PGA Configuration and Over/Under-Scale Limit Register (Read/Write, Address Pointer = 00101)
      7. 6.2.7 Register 6: Temp ADC Control Register (Read/Write, Address Pointer = 00110)
      8. 6.2.8 Register 7: Output Enable Counter Control Register (Read/Write, Address Pointer = 00111)
      9. 6.2.9 Register 8: Alarm Status Register (Read Only, Address Pointer = 01000)
  9.   A External EEPROM Example
    1.     A.1 PGA309 External EEPROM Example
      1.      A.1.1 Gain and Offset Scaling for External EEPROM
      2.      94
  10.   B Detailed Block Diagram
    1.     B.1 Detailed Block Diagram
  11.   C Glossary
  12.   Revision History

1.7 ADC for Temperature Sensing

The compensation for the sensor span and offset drifts is driven by the temperature sense circuitry. Either internal or external temperature sensing is possible. The temperature can be sensed in one of the following ways:

  • Bridge impedance change (excitation current sense, in the positive or negative part of the bridge), for sensors with large temperature coefficient of resistance (TCR > 0.1%/°C)
  • On-chip PGA309 temperature, when the chip is located sufficiently close to the sensor
  • External diode, thermistor, or RTD placed on the sensor membrane. An internal 7μA current source may be register-enabled to excite these types of temperature sensors.

The temperature signal is digitized by the onboard Temp ADC. The output of the Temp ADC is used by the control digital circuit to read data from the Lookup Table in an external EEPROM, and set the output of the Gain DAC and the Zero DAC to the calibrated values as temperature changes.

An additional function provided through the Temp ADC is the ability to read the VOUT pin back through the Temp ADC input mux. This provides flexibility for a digital output through either One-Wire or Two-Wire interface, as well as the possibility for an external microcontroller to perform real-time custom calibration of the PGA309.