SCES639F January   2007  – September 2025 TXB0101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (DRY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements, VCCA = 1.2V
    8. 5.8  Timing Requirements, VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements, VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements, VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements, VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics, VCCA = 1.2V (DRY)
    13. 5.13 Switching Characteristics, VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics, VCCA = 1.5V ± 0.1V (DRY)
    15. 5.15 Switching Characteristics, VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics, VCCA = 1.8V ± 0.15V (DRY)
    17. 5.17 Switching Characteristics, VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics, VCCA = 2.5V ± 0.2V (DRY)
    19. 5.19 Switching Characteristics, VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics, VCCA = 3.3V ± 0.3V (DRY)
    21. 5.21 Switching Characteristics, VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Architecture
      2. 6.3.2 Power Up
      3. 6.3.3 Enable and Disable
      4. 6.3.4 Pullup or Pulldown Resistors on I/O Lines
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Input Driver Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision E (March 2023) to Revision F (September 2025)

  • Added DRY package information throughout the documentGo

Changes from Revision D (March 2017) to Revision E (March 2023)

  • Changed the Body Size for YZP package from: 1.1mm × 1.20mm to: 0.9mm × 1.40mm in the Packaging Information table Go
  • Changed Note 1 in the Absolute Maximum Ratings Go

Changes from Revision C (June 2015) to Revision D (March 2017)

  • Added Absolute maximum junction temperature, TJ in Absolute Maximum Ratings Go
  • Added TXB0101 Port A and Port B specifications in ESD Ratings tableGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from Revision B (May 2012) to Revision C (June 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Removed Ordering Information table Go

Changes from Revision A (November 2008) to Revision B (March 2012)

  • Added notes to pin out graphics.Go