SCES639F January   2007  – September 2025 TXB0101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (DRY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements, VCCA = 1.2V
    8. 5.8  Timing Requirements, VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements, VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements, VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements, VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics, VCCA = 1.2V (DRY)
    13. 5.13 Switching Characteristics, VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics, VCCA = 1.5V ± 0.1V (DRY)
    15. 5.15 Switching Characteristics, VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics, VCCA = 1.8V ± 0.15V (DRY)
    17. 5.17 Switching Characteristics, VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics, VCCA = 2.5V ± 0.2V (DRY)
    19. 5.19 Switching Characteristics, VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics, VCCA = 3.3V ± 0.3V (DRY)
    21. 5.21 Switching Characteristics, VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Architecture
      2. 6.3.2 Power Up
      3. 6.3.3 Enable and Disable
      4. 6.3.4 Pullup or Pulldown Resistors on I/O Lines
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Input Driver Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TXB0101UNIT
DBV (SOT-23)DCK (SC70)DRL (SOT)YZP (DSBGA)

DRY (USON)

6 PINS6 PINS6 PINS6 PINS

6 PINS

RθJAJunction-to-ambient thermal resistance192.3266.9204.2105.8

277.6

°C/W
RθJC(top)Junction-to-case (top) thermal resistance164.880.476.41.6

163.1

°C/W
RθJBJunction-to-board thermal resistance38.699.138.710.8

158.9

°C/W
ψJTJunction-to-top characterization parameter43.71.53.43.1

29.3

°C/W
ψJBJunction-to-board characterization parameter38.198.338.510.8

158.2

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/A

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.