SCES639F January   2007  – September 2025 TXB0101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (DRY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements, VCCA = 1.2V
    8. 5.8  Timing Requirements, VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements, VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements, VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements, VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics, VCCA = 1.2V (DRY)
    13. 5.13 Switching Characteristics, VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics, VCCA = 1.5V ± 0.1V (DRY)
    15. 5.15 Switching Characteristics, VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics, VCCA = 1.8V ± 0.15V (DRY)
    17. 5.17 Switching Characteristics, VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics, VCCA = 2.5V ± 0.2V (DRY)
    19. 5.19 Switching Characteristics, VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics, VCCA = 3.3V ± 0.3V (DRY)
    21. 5.21 Switching Characteristics, VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Architecture
      2. 6.3.2 Power Up
      3. 6.3.3 Enable and Disable
      4. 6.3.4 Pullup or Pulldown Resistors on I/O Lines
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Input Driver Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

7.4.1 Layout Guidelines

For device reliability, the following common printed-circuit board layout guidelines are recommended.

  • Bypass capacitors should be used on power supplies, and should be placed as close as possible to the VCCA, VCCB pin and GND pin.
  • Short trace lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 10ns, making sure that any reflection encounters low impedance at the source driver.