SLAA649G October   2014  – August 2021 MSP430F2001 , MSP430F2002 , MSP430F2003 , MSP430F2011 , MSP430F2012 , MSP430F2013 , MSP430F2013-EP , MSP430F2101 , MSP430F2111 , MSP430F2112 , MSP430F2121 , MSP430F2122 , MSP430F2131 , MSP430F2132 , MSP430F2232 , MSP430F2234 , MSP430F2252 , MSP430F2254 , MSP430F2272 , MSP430F2274 , MSP430F2274-EP , MSP430F233 , MSP430F2330 , MSP430F235 , MSP430F2350 , MSP430F2370 , MSP430F2410 , MSP430F2416 , MSP430F2417 , MSP430F2418 , MSP430F2419 , MSP430F247 , MSP430F2471 , MSP430F248 , MSP430F2481 , MSP430F249 , MSP430F249-EP , MSP430F2491 , MSP430F2616 , MSP430F2617 , MSP430F2618 , MSP430F2619 , MSP430F2619S-HT , MSP430FR2032 , MSP430FR2033 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430G2001 , MSP430G2101 , MSP430G2102 , MSP430G2111 , MSP430G2112 , MSP430G2121 , MSP430G2131 , MSP430G2132 , MSP430G2152 , MSP430G2153 , MSP430G2201 , MSP430G2202 , MSP430G2203 , MSP430G2210 , MSP430G2211 , MSP430G2212 , MSP430G2213 , MSP430G2221 , MSP430G2230 , MSP430G2230-EP , MSP430G2231 , MSP430G2231-EP , MSP430G2232 , MSP430G2233 , MSP430G2252 , MSP430G2253 , MSP430G2302 , MSP430G2302-EP , MSP430G2303 , MSP430G2312 , MSP430G2313 , MSP430G2332 , MSP430G2332-EP , MSP430G2333 , MSP430G2352 , MSP430G2353 , MSP430G2402 , MSP430G2403 , MSP430G2412 , MSP430G2413 , MSP430G2432 , MSP430G2433 , MSP430G2444 , MSP430G2452 , MSP430G2453 , MSP430G2513 , MSP430G2533 , MSP430G2544 , MSP430G2553 , MSP430G2744 , MSP430G2755 , MSP430G2855 , MSP430G2955 , MSP430I2020 , MSP430I2021 , MSP430I2030 , MSP430I2031 , MSP430I2040 , MSP430I2041

 

  1.   Trademarks
  2. Introduction
  3. Comparison of MSP430FR4xx and MSP430FR2xx Devices
  4. In-System Programming of Nonvolatile Memory
    1. 3.1 Ferroelectric RAM (FRAM) Overview
    2. 3.2 FRAM Cell
    3. 3.3 Protecting FRAM Using the Memory Write Protection Bit
    4. 3.4 FRAM Memory Wait States
    5. 3.5 Bootloader (BSL)
    6. 3.6 JTAG and Security
    7. 3.7 Production Programming
  5. Hardware Migration Considerations
  6. Device Calibration Information
  7. Important Device Specifications
  8. Core Architecture Considerations
    1. 7.1 Power Management Module (PMM)
      1. 7.1.1 Core LDO and LPM3.5 LDO
      2. 7.1.2 SVS
      3. 7.1.3 VREF
      4. 7.1.4 Debug in Low-Power Mode
    2. 7.2 Clock System
      1. 7.2.1 DCO Frequencies
      2. 7.2.2 FLL, REFO, and DCO Tap
      3. 7.2.3 FRAM Access at 16 MHz, ADC Clock, and Clocks-on-Demand
    3. 7.3 Operating Modes, Wake-up Times, and Reset
      1. 7.3.1 LPMx.5
      2. 7.3.2 Reset
        1. 7.3.2.1 Behavior of POR and BOR
        2. 7.3.2.2 Reset Generation
        3. 7.3.2.3 Determining the Cause of Reset
    4. 7.4 Interrupt Vectors
    5. 7.5 FRAM and the FRAM Controller
      1. 7.5.1 Flash and FRAM Overview Comparison
      2. 7.5.2 Cache Architecture
  9. Peripheral Considerations
    1. 8.1  Watchdog Timer
    2. 8.2  Ports
      1. 8.2.1 Digital Input/Output
      2. 8.2.2 Capacitive Touch I/O
    3. 8.3  Analog-to-Digital Converters
      1. 8.3.1 ADC10 to ADC
    4. 8.4  Communication Modules
      1. 8.4.1 USI to eUSCI
      2. 8.4.2 USCI to eUSCI
    5. 8.5  Timer and IR Modulation Logic
    6. 8.6  Backup Memory
    7. 8.7  Hardware Multiplier (MPY32)
    8. 8.8  RTC Counter
    9. 8.9  Interrupt Compare Controller (ICC)
    10. 8.10 LCD
    11. 8.11 Smart Analog Combo (SAC)
    12. 8.12 Comparator
  10. ROM Libraries
  11. 10Conclusion
  12. 11References
  13. 12Revision History

Digital Input/Output

The main differences in the FR4xx general-purpose I/O (GPIO) pins are:

  • P1 and P2 ports support interrupt inputs in the FR4xx devices, the same as in the F2xx devices. In addition, P1 and P2 interrupts can be used to wake up FR4xx devices from LPMx.5 power modes. In MSP430FR231x devices, P2.2, P2.3, P2.4, and P2.5 do not support interrupts. In MSP430FR211x devices, P1.4, P1.5, P1.6, and P1.7 do not support interrupts. In MSPFR235x devices, P1, P2, P3 and P4 all support interrupts. In MSP430FR267x and FR247x devices, all GPIOs including P1, P2, P3, P4, P5, and P6 support interrupts.
  • Peripheral function select in the MSP430FR413x and MSP430FR203x devices uses one register for Port x function selection: PxSEL0. Other FR2xx devices use two registers for Port x function selection: PxSEL0 and PxSEL1. F2xx also uses two registers for Port x function selection: PxSEL and PxSEL2. See the device-specific data sheet for details.
  • In F2xx, the high-impedance leakage current is ±50 nA. In FR4xx, this specification is ±20 nA.
  • Configuration of digital I/Os after BOR reset

    To prevent cross currents during startup of the device, all port pins are high-impedance with Schmitt triggers and module functions are disabled. To enable the I/O functions after a BOR reset, first configure the ports, and then clear the LOCKLPM5 bit. For details, see the section on configuration after reset in the digital I/O chapter of the MSP430FR4xx and MSP430FR2xx family user's guide.

  • Configuration for LPMx.5 power modes

    During LPMx.5 the I/O pin states are held and locked based on the settings before entry to LPMx.5, regardless of the default I/O register settings. Only the pin conditions are retained. All port configuration register settings such as PxDIR, PxREN, PxOUT, PxIES, and PxIE contents are lost and must be reconfigured after exit from LPMx.5. After wake from LPMx.5, the LOCKLPM5 bit can be cleared to release I/O pin conditions and I/O interrupt configuration. For details, see the section on configuration for LPMx.5 low-power modes in the digital I/O chapter of the MSP430FR4xx and MSP430FR2xx family user's guide.

  • Configuration of unused port pins

    To prevent a floating input and to reduce power consumption, unused I/O pins should be configured as I/O function, output direction, and left unconnected on the PCB. Alternatively, the integrated pullup or pulldown resistor can be enabled by setting the PxREN bit of the unused pin to prevent a floating input.

  • Configuration of unbonded pins

    In the MSP430FR413x and MSP430FR203x MCUs, some pins are not bonded out in packages with fewer pins than the 64-pin PM package. Configure these unbonded pins as unused port pins. See Table 8-1 for the unbonded pins for different MSP430FR413x and MSP430FR203x packages.

Table 8-1 Pins Not Bonded Out on MSP430FR413x and MSP430FR203x Packages
Unbonded Pins for FR413x and FR203x Package G56(1)Unbonded Pins for FR413x and FR203x Package G48(1)
P5.6/L38P5.6/L38
P5.7/L39P5.7/L39
P6.6/L22P6.6/L22
P6.7/L23P6.7/L23
P7.6/L6P7.6/L6
P7.7/L7P7.7/L7
P8.0/SMCLK/A8P8.0/SMCLK/A8
P8.1/ACLK/A9P8.1/ACLK/A9
P8.2/TA1CLK
P8.3/TA1.2
P5.4/L36
P5.5/L37
P6.4/L20
P6.5/L21
P7.4/L4
P7.5/L5
See the device-specific data sheet for detailed information.