SLAA649G October   2014  – August 2021 MSP430F2001 , MSP430F2002 , MSP430F2003 , MSP430F2011 , MSP430F2012 , MSP430F2013 , MSP430F2013-EP , MSP430F2101 , MSP430F2111 , MSP430F2112 , MSP430F2121 , MSP430F2122 , MSP430F2131 , MSP430F2132 , MSP430F2232 , MSP430F2234 , MSP430F2252 , MSP430F2254 , MSP430F2272 , MSP430F2274 , MSP430F2274-EP , MSP430F233 , MSP430F2330 , MSP430F235 , MSP430F2350 , MSP430F2370 , MSP430F2410 , MSP430F2416 , MSP430F2417 , MSP430F2418 , MSP430F2419 , MSP430F247 , MSP430F2471 , MSP430F248 , MSP430F2481 , MSP430F249 , MSP430F249-EP , MSP430F2491 , MSP430F2616 , MSP430F2617 , MSP430F2618 , MSP430F2619 , MSP430F2619S-HT , MSP430FR2032 , MSP430FR2033 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430G2001 , MSP430G2101 , MSP430G2102 , MSP430G2111 , MSP430G2112 , MSP430G2121 , MSP430G2131 , MSP430G2132 , MSP430G2152 , MSP430G2153 , MSP430G2201 , MSP430G2202 , MSP430G2203 , MSP430G2210 , MSP430G2211 , MSP430G2212 , MSP430G2213 , MSP430G2221 , MSP430G2230 , MSP430G2230-EP , MSP430G2231 , MSP430G2231-EP , MSP430G2232 , MSP430G2233 , MSP430G2252 , MSP430G2253 , MSP430G2302 , MSP430G2302-EP , MSP430G2303 , MSP430G2312 , MSP430G2313 , MSP430G2332 , MSP430G2332-EP , MSP430G2333 , MSP430G2352 , MSP430G2353 , MSP430G2402 , MSP430G2403 , MSP430G2412 , MSP430G2413 , MSP430G2432 , MSP430G2433 , MSP430G2444 , MSP430G2452 , MSP430G2453 , MSP430G2513 , MSP430G2533 , MSP430G2544 , MSP430G2553 , MSP430G2744 , MSP430G2755 , MSP430G2855 , MSP430G2955 , MSP430I2020 , MSP430I2021 , MSP430I2030 , MSP430I2031 , MSP430I2040 , MSP430I2041

 

  1.   Trademarks
  2. Introduction
  3. Comparison of MSP430FR4xx and MSP430FR2xx Devices
  4. In-System Programming of Nonvolatile Memory
    1. 3.1 Ferroelectric RAM (FRAM) Overview
    2. 3.2 FRAM Cell
    3. 3.3 Protecting FRAM Using the Memory Write Protection Bit
    4. 3.4 FRAM Memory Wait States
    5. 3.5 Bootloader (BSL)
    6. 3.6 JTAG and Security
    7. 3.7 Production Programming
  5. Hardware Migration Considerations
  6. Device Calibration Information
  7. Important Device Specifications
  8. Core Architecture Considerations
    1. 7.1 Power Management Module (PMM)
      1. 7.1.1 Core LDO and LPM3.5 LDO
      2. 7.1.2 SVS
      3. 7.1.3 VREF
      4. 7.1.4 Debug in Low-Power Mode
    2. 7.2 Clock System
      1. 7.2.1 DCO Frequencies
      2. 7.2.2 FLL, REFO, and DCO Tap
      3. 7.2.3 FRAM Access at 16 MHz, ADC Clock, and Clocks-on-Demand
    3. 7.3 Operating Modes, Wake-up Times, and Reset
      1. 7.3.1 LPMx.5
      2. 7.3.2 Reset
        1. 7.3.2.1 Behavior of POR and BOR
        2. 7.3.2.2 Reset Generation
        3. 7.3.2.3 Determining the Cause of Reset
    4. 7.4 Interrupt Vectors
    5. 7.5 FRAM and the FRAM Controller
      1. 7.5.1 Flash and FRAM Overview Comparison
      2. 7.5.2 Cache Architecture
  9. Peripheral Considerations
    1. 8.1  Watchdog Timer
    2. 8.2  Ports
      1. 8.2.1 Digital Input/Output
      2. 8.2.2 Capacitive Touch I/O
    3. 8.3  Analog-to-Digital Converters
      1. 8.3.1 ADC10 to ADC
    4. 8.4  Communication Modules
      1. 8.4.1 USI to eUSCI
      2. 8.4.2 USCI to eUSCI
    5. 8.5  Timer and IR Modulation Logic
    6. 8.6  Backup Memory
    7. 8.7  Hardware Multiplier (MPY32)
    8. 8.8  RTC Counter
    9. 8.9  Interrupt Compare Controller (ICC)
    10. 8.10 LCD
    11. 8.11 Smart Analog Combo (SAC)
    12. 8.12 Comparator
  10. ROM Libraries
  11. 10Conclusion
  12. 11References
  13. 12Revision History

ADC10 to ADC

Compared to ADC10 in F2xx, the ADC module in the FR4xx has been redesigned for lower power and also includes some new features. Some of the significant differences are:

  • The ADC module in FR4xx devices supports both 10-bit ADC and 12-bit ADC configurations.
  • The ADC10 internal reference is no longer a part of the ADC module in FR4xx. The VREF generation block is in the PMM module (see Section 7.1.3).
  • If the reference buffer is used for the ADC reference voltage, and the conversion rate is below 50 kbps, setting ADCSR = 1 reduces the current consumption of the buffer approximately 50%.
  • The data transfer controller (DTC) is used for automatic storage of conversion results in the F2xx family. In the FR4xx family, the DTC is not supported.
  • In FR4xx, up to 10 input channels are available externally and 2 channels are available internally. The 1.2-V VREF can be output to a device-specific external channel. The on-chip temperature sensor can be internally connected to channel A12. The 1.5-V VREF can be internally connected to channel A13. For detailed connection, see the 10-Bit Analog-to-Digital Converter (ADC) section in the device-specific data sheet.
  • In FR4xx, a new added window comparator block allows the ADC module to monitor analog signals without CPU interaction. The window comparator can generate interrupts when specific thresholds have been reached.
  • The interrupt vector register ADCIV has six interrupt flag sources including three from the window comparator function.
  • Increased options for the ADC clock dividers and controlling the sampling rate in FR4xx.
  • ADC10OSC is renamed to MODOSC in the FR4xx family.
  • In the MSP430FR413x and MSP430FR203x devices, the ADC pin selection is set in the SYSCFG2 register. For other FR2xx devices, ADC pin selection is set in the PxSEL0 and PxSEL1 registers.
  • Because there is only one pair of power supply pins (DVCC and DVSS) in FR4xx devices, to achieve good ADC performance, board design should avoid system noise:
    • Place the decoupling capacitors as close as possible to DVCC.
    • Select the reference voltage carefully.
    • Do not route high-frequency toggled digital signals close to power lines or ADC input signals.
    • Do not toggle I/O pins while the ADC is working.
    • Find more design guidance for the ADC on www.ti.com.

Some register names have been changed to include the added functionality. For more information when porting firmware, see the MSP430FR4xx and MSP430FR2xx family user's guide.