16-MHz integrated analog microcontroller with 3.75-KB FRAM, OpAmp, TIA, comparator w/ DAC, 10-bit AD

MSP430FR2311

ACTIVE

Product details

Non-volatile memory (kB) 4 RAM (KB) 1 ADC 10-bit SAR GPIO pins (#) 16 Features OpAmp, Real-time clock, Transimpedance amplifier UART 1 USB No Number of I2Cs 1 SPI 2 Comparator channels (#) 2
Non-volatile memory (kB) 4 RAM (KB) 1 ADC 10-bit SAR GPIO pins (#) 16 Features OpAmp, Real-time clock, Transimpedance amplifier UART 1 USB No Number of I2Cs 1 SPI 2 Comparator channels (#) 2
TSSOP (PW) 16 22 mm² 5 x 4.4 TSSOP (PW) 20 42 mm² 6.5 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • Embedded microcontroller
    • 16-bit RISC architecture up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS Specifications)
  • Optimized low-power modes (at 3 V)
    • Active mode: 126 µA/MHz
    • Standby: real-time clock (RTC) counter (LPM3.5 with 32768-Hz crystal): 0.71 µA
    • Shutdown (LPM4.5): 32 nA without SVS
  • High-performance analog
    • Transimpedance amplifier (TIA) (1)
      • Current-to-voltage conversion
      • Half-rail input
      • Low-leakage negative input down to 5 pA, enabled on TSSOP16 package only
      • Rail-to-rail output
      • Multiple input selections
      • Configurable high-power and low-power modes
    • 8-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
    • Enhanced comparator (eCOMP)
      • Integrated 6-bit digital-to-analog converter (DAC) as reference voltage
      • Programmable hysteresis
      • Configurable high-power and low-power modes
    • Smart analog combo (SAC-L1)
      • Supports general-purpose op amp
      • Rail-to-rail input and output
      • Multiple input selections
      • Configurable high-power and low-power modes
  • Low-power ferroelectric RAM (FRAM)
    • Up to 3.75KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
  • Intelligent digital peripherals
    • IR modulation logic
    • Two 16-bit timers with three capture/compare registers each (Timer_B3)
    • One 16-bit counter-only RTC counter
    • 16-bit cyclic redundancy checker (CRC)
  • Enhanced serial communications
    • Enhanced USCI A (eUSCI_A) supports UART, IrDA, and SPI
    • Enhanced USCI B (eUSCI_B) supports SPI and I2C with support for remap feature (see Signal Descriptions)
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • External high-frequency crystal oscillator up to 16 MHz (HFXT)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • 16 I/Os on 20-pin package
    • 12 interrupt pins (8 pins of P1 and 4 pins of P2) can wake MCU from LPMs
    • All I/Os are capacitive touch I/Os
  • Development tools and software
  • Family members (also see Device Comparison)
    • MSP430FR2311: 3.75KB of program FRAM and 1KB of RAM
    • MSP430FR2310: 2KB of program FRAM and 1KB of RAM
  • Package options
    • 20-pin TSSOP (PW20)
    • 16-pin TSSOP (PW16)
    • 16-pin VQFN (RGY16)

(1)The transimpedance amplifier was originally given an abbreviation of TRI in descriptive text, pin names, and register names. The abbreviation has changed to TIA in all descriptive text, but pin names and register names still use TRI.

  • Embedded microcontroller
    • 16-bit RISC architecture up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS Specifications)
  • Optimized low-power modes (at 3 V)
    • Active mode: 126 µA/MHz
    • Standby: real-time clock (RTC) counter (LPM3.5 with 32768-Hz crystal): 0.71 µA
    • Shutdown (LPM4.5): 32 nA without SVS
  • High-performance analog
    • Transimpedance amplifier (TIA) (1)
      • Current-to-voltage conversion
      • Half-rail input
      • Low-leakage negative input down to 5 pA, enabled on TSSOP16 package only
      • Rail-to-rail output
      • Multiple input selections
      • Configurable high-power and low-power modes
    • 8-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
    • Enhanced comparator (eCOMP)
      • Integrated 6-bit digital-to-analog converter (DAC) as reference voltage
      • Programmable hysteresis
      • Configurable high-power and low-power modes
    • Smart analog combo (SAC-L1)
      • Supports general-purpose op amp
      • Rail-to-rail input and output
      • Multiple input selections
      • Configurable high-power and low-power modes
  • Low-power ferroelectric RAM (FRAM)
    • Up to 3.75KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
  • Intelligent digital peripherals
    • IR modulation logic
    • Two 16-bit timers with three capture/compare registers each (Timer_B3)
    • One 16-bit counter-only RTC counter
    • 16-bit cyclic redundancy checker (CRC)
  • Enhanced serial communications
    • Enhanced USCI A (eUSCI_A) supports UART, IrDA, and SPI
    • Enhanced USCI B (eUSCI_B) supports SPI and I2C with support for remap feature (see Signal Descriptions)
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator (MODOSC)
    • External 32-kHz crystal oscillator (LFXT)
    • External high-frequency crystal oscillator up to 16 MHz (HFXT)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • 16 I/Os on 20-pin package
    • 12 interrupt pins (8 pins of P1 and 4 pins of P2) can wake MCU from LPMs
    • All I/Os are capacitive touch I/Os
  • Development tools and software
  • Family members (also see Device Comparison)
    • MSP430FR2311: 3.75KB of program FRAM and 1KB of RAM
    • MSP430FR2310: 2KB of program FRAM and 1KB of RAM
  • Package options
    • 20-pin TSSOP (PW20)
    • 16-pin TSSOP (PW16)
    • 16-pin VQFN (RGY16)

(1)The transimpedance amplifier was originally given an abbreviation of TRI in descriptive text, pin names, and register names. The abbreviation has changed to TIA in all descriptive text, but pin names and register names still use TRI.

The MSP430FR231x FRAM microcontrollers (MCUs) are part of the MSP430™ MCU value line sensing family. The devices integrate a configurable low-leakage transimpedance amplifier (TIA) and a general purpose operational amplifier. The MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device to wake up from low-power modes to active mode typically in less than 10 µs. The feature set of these MCUs are well suited for applications ranging from smoke detectors to portable health and fitness accessories.

The ultra-low-power MSP430FR231x MCU family consists of several devices that feature embedded nonvolatile FRAM and different sets of peripherals targeted for various sensing and measurement applications. The architecture, FRAM, and peripherals, combined with extensive low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory technology that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at lower total power consumption.

The MSP430FR231x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP‑EXP430FR2311 LaunchPad™ development kit and the MSP‑TS430PW20 20-pin target development board. TI provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ Community Forum.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

The MSP430FR231x FRAM microcontrollers (MCUs) are part of the MSP430™ MCU value line sensing family. The devices integrate a configurable low-leakage transimpedance amplifier (TIA) and a general purpose operational amplifier. The MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device to wake up from low-power modes to active mode typically in less than 10 µs. The feature set of these MCUs are well suited for applications ranging from smoke detectors to portable health and fitness accessories.

The ultra-low-power MSP430FR231x MCU family consists of several devices that feature embedded nonvolatile FRAM and different sets of peripherals targeted for various sensing and measurement applications. The architecture, FRAM, and peripherals, combined with extensive low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory technology that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at lower total power consumption.

The MSP430FR231x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP‑EXP430FR2311 LaunchPad™ development kit and the MSP‑TS430PW20 20-pin target development board. TI provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ Community Forum.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide.

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Technical documentation

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Type Title Date
* Data sheet MSP430FR231x Mixed-Signal Microcontrollers datasheet (Rev. E) 09 Dec 2019
* Errata MSP430FR2311 Device Erratasheet (Rev. Q) 27 May 2021
* User guide MSP430FR4xx and MSP430FR2xx Family User's Guide (Rev. I) 13 Mar 2019
Application note UART-to-I2C Bridge Using Low-Memory MSP430™ MCUs (Rev. A) 29 Sep 2021
Application note ESD Diode Current Specification (Rev. B) 23 Aug 2021
Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 12 Aug 2021
Application note Designing With the MSP430FR4xx and MSP430FR2xx ADC (Rev. A) 02 Aug 2021
Application note Low-Power Battery Voltage Measurement With MSP430FR MCU On-Chip VREF and ADC (Rev. B) 02 Aug 2021
Application note Migrating from MSP430 F2xx and G2xx families to MSP430 FR4xx and FR2xx family (Rev. G) 02 Aug 2021
Application note Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B) 02 Aug 2021
Application note MSP430 System-Level ESD Considerations (Rev. B) 14 Jul 2021
User guide MSP430 MCUs Development Guide Book (Rev. A) 13 May 2021
Technical article A world of possibilities: 5 ways to use MSP430™︎ MCUs in your design 29 Apr 2021
User guide MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AA) 19 Feb 2021
Application note MSP430FR2xx and MSP430FR4xx DCO+FLL Application Guide 07 Dec 2020
Application note Small Size Custom BSL Based on ROM BSL for MSP430 FRAM MCUs 30 Oct 2020
Application note Temperature Sensing NTC Circuit With MSP430 Smart Analog Combo (Rev. C) 09 Mar 2020
Application note High-side current-sensing circuit design with MSP430 smart analog combo (Rev. B) 06 Mar 2020
Application note Low-noise long-range PIR sensor conditioner circuit MSP430 smart analog combo (Rev. A) 06 Mar 2020
Application note Low-side bidirectional current sensing circuit with MSP430™ smart analog combo (Rev. A) 06 Mar 2020
Application note Single-supply low-side unidirectional current-sensing circuit with MSP430 SAC (Rev. A) 06 Mar 2020
Application note Strain gauge bridge amplifier circuit with MSP430 smart analog combo (Rev. A) 06 Mar 2020
Application note Temperature Sensing PTC Circuit With MSP430 Smart Analog Combo (Rev. B) 06 Mar 2020
Application note Transimpedance amplifier circuit with MSP430 smart analog combo (Rev. A) 06 Mar 2020
Application note MSP430 System ESD Troubleshooting Guide 13 Dec 2019
White paper Enabling tomorrow’s sensing applications with smart analog microcontrollers (Rev. A) 22 Nov 2019
Application note How to Use the Smart Analog Combo and Transimpedance Amplifier on MSP430FR2311 (Rev. A) 15 Nov 2019
Technical article Designing a blood glucose meter and pulse oximeter with the MSP430 MCU Smart Analog Combo 07 Sep 2018
Technical article Designing a smoke detector with the MSP430 MCU Smart Analog Combo 09 Aug 2018
E-book Enhance simple analog and digital functions for $0.25 (Rev. B) 07 Feb 2018
Application note Code Porting From MSP430FR2000 to MSP430FR2311 MCUs 25 Oct 2017
Technical article Sense, measure and more with MSP430™ MCUs at embedded world 2017 14 Mar 2017
Design guide MSP430FR2311 IR Reflection-Sensing Subsystem Design Guide 03 Aug 2016
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) 01 Apr 2016
Application note VLO Calibration on the MSP430FR4xx and MSP430FR2xx Family (Rev. A) 19 Feb 2016
Application note MSP Code Protection Features 07 Dec 2015
White paper Building Automation with MSP MCUs 27 Jul 2015
Application note MSP430 FRAM Quality and Reliability (Rev. A) 01 May 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Development kit

MSP-EXP430FR2311 — MSP430FR2311 LaunchPad™ development kit

The MSP-EXP430FR2311 LaunchPad™ development kit is an easy-to-use microcontroller development board for MSP430FR2000, MSP430FR21xx and MSP430FR23xx MCUs. It contains everything needed to start developing quickly including on-board emulation for programming, debugging and energy measurements. The (...)

Development kit

MSP-TS430PW20 — Target Development Board for MSP430FR2000, MSP430FR21x and MSP430FR23x MCUs - 20-pin

The MSP-TS430PW20 is a standalone zero insertion force (ZIF) socket target board used to program and debug the MSP430 MCU in-system through the JTAG interface or the Spy Bi-Wire (2-wire JTAG) protocol. The development board supports all MSP430FR2000, MSP430FR21xx or MSP430FR23xx MCUs in a 20-pin or (...)

In stock
Limit: 10
Hardware programming tool

MSP-FET — MSP MCU Programmer and Debugger

The MSP-FET is a powerful emulation development tool – often called a debug probe – which allows users to quickly begin development on MSP low-power microcontrollers (MCU).

It supports programming and real-time debugging over both JTAG and SBW interfaces. Furthermore, the MSP-FET also provides a (...)

In stock
Limit: 999999999
Hardware programming tool

MSP-GANG — MSP-GANG production programmer

The MSP Gang Programmer (MSP-GANG) is a MSP430™/MSP432™ device programmer that can program up to eight identical MSP430/MSP432 Flash or FRAM devices at the same time. It connects to a host PC using a standard RS-232 or USB connection and provides flexible programming options that allow (...)

Software development kit (SDK)

MSPWARE — MSP430Ware for MSP Microcontrollers

MSP430Ware is a collection of resources that help users to effectively create and build MSP430 code. These resources support ALL MSP430 microcontrollers (MCUs). As one user mentioned, “It’s essentially everything developers need to become MSP430 microcontroller experts!”

This complete collection of (...)

Driver or library

MSP-FRAM-UTILITIES — FRAM embedded software utilities for MSP ultra-low-power microcontrollers

The Texas Instruments FRAM Utilities is designed to grow as a collection of embedded software utilities that leverage the ultra-low-power and virtually unlimited write endurance of FRAM. The utilities are available for MSP430FRxx FRAM microcontrollers and provide example code to help start (...)
IDE, configuration, compiler or debugger

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio؜™ software is an integrated development environment (IDE) that supports TI's microcontroller (MCU) and embedded processor portfolios. Code Composer Studio software comprises a suite of tools used to develop and debug embedded applications. The software includes an (...)
IDE, configuration, compiler or debugger

ENERGYTRACE — EnergyTrace Technology

EnergyTrace™ software for MSP430™ MCUs, MSP432™ MCUs, CC13xx wireless MCUs and CC26xx wireless MCUs is an energy-based code analysis tool that measures and displays the energy profile of an application and helps optimize it for ultra-low-power consumption.

As most developers know, it is difficult to (...)

IDE, configuration, compiler or debugger

IAR-KICKSTART — IAR Embedded Workbench

IAR Embedded Workbench delivers a complete development toolchain for building and debugging embedded applications for your selected target microcontroller. The included IAR C/C++ Compiler generates highly optimized code for your application, and the C-SPY Debugger is a fully integrated debugger for (...)
From: IAR Systems
Software programming tool

UNIFLASH — UniFlash stand-alone flash tool for microcontrollers, Sitara™; processors and SimpleLink™

Supported devices: CC13xx, CC25xx, CC26xx, CC3x20, CC3x30, CC3x35, Tiva, C2000, MSP43x, Hercules, PGA9xx, IWR12xx, IWR14xx, IWR16xx, IWR18xx , IWR68xx, AWR12xx, AWR14xx, AWR16xx, AWR18xx.  Command line only: AM335x, AM437x, AM571x, AM572x, AM574x, AM65XX, K2G

CCS Uniflash is a standalone tool used to (...)

Support software

MSP430FR231x Code Examples (Rev. E)

SLAC708E.ZIP (417 KB)
Simulation model

MSP430FR2311 SAC TINA-TI Reference Design (Rev. C)

SLAM331C.TSC (567 KB) - TINA-TI Reference Design
Simulation model

MSP430FR2311 SAC TINA-TI Spice Model (Rev. C)

SLAM332C.ZIP (6 KB) - TINA-TI Spice Model
Simulation model

MSP430FR231x TIA TINA-TI Reference Design

SLAM346.TSC (59 KB) - TINA-TI Reference Design
Simulation model

MSP430FR231x TIA TINA-TI Spice Model

SLAM347.ZIP (6 KB) - TINA-TI Spice Model
Design tool

CIRCUIT0020 — Transimpedance Amplifier Circuit

The transimpedance op amp circuit configuration converts an input current source into an output voltage. The current to voltage gain is based on the feedback resistance. The circuit is able to maintain a constant voltage bias across the input source as the input current changes which benefits many (...)
Design tool

CIRCUIT060001 — Single-supply, low-side, unidirectional current-sensing circuit

This single–supply, low–side, current sensing solution accurately detects load current up to 1A and converts it to a voltage between 50mV and 4.9V. The input current range and output voltage range can be scaled as necessary and larger supplies can be used to accommodate larger swings.
Design tool

CIRCUIT060002 — Temperature sensing with NTC thermistor circuit

This temperature sensing circuit uses a resistor in series with a negative–temperature–coefficient (NTC) thermistor to form a voltage divider, which has the effect of producing an output voltage that is linear over temperature. The circuit uses an op amp in a non–inverting (...)
Design tool

CIRCUIT060003 — Temperature sensing with PTC thermistor circuit

This temperature sensing circuit uses a resistor in series with a positive–temperature–coefficient (PTC) thermistor to form a voltage–divider, which has the effect of producing an output voltage that is linear over temperature. The circuit uses an op amp in a non–inverting (...)
Design tool

CIRCUIT060004 — Low-noise and long-range PIR sensor conditioner circuit

This two stage amplifier design amplifies and filters the signal from a passive infrared (PIR) sensor. The circuit includes multiple low–pass and high–pass filters to reduce noise at the output of the circuit to be able to detect motion at long distances and reduce false triggers. This (...)
Design tool

CIRCUIT060005 — High-side current sensing with discrete difference amplifier circuit

This single–supply, high–side, low–cost current sensing solution detects load current between 50mA and 1A and converters it to an output voltage from 0.25V to 5V. High–side sensing allows for the system to identify ground shorts and does not create a ground disturbance on the load.
Design tool

CIRCUIT060006 — Bridge amplifier circuit

A strain gauge is a sensor whose resistance varies with applied force. To measure the variation in resistance, the strain gauge is placed in a bridge configuration. This design uses a 2 op amp instrumentation circuit to amplify a differential signal created by the change in resistance of a strain (...)
Design tool

CIRCUIT060007 — Low-side, bidirectional current-sensing circuit

This single-supply low-side, bidirectional current sensing solution can accurately detect load currents from –1A to 1A. The linear range of the output is from 110mV to 3.19V. Low-side current sensing keeps the common-mode voltage near ground, and is thus most useful in applications with large (...)
Design tool

CIRCUIT060009 — Half-wave rectifier circuit

The precision half-wave rectifier inverts and transfers only the negative-half input of a time varying input signal (preferably sinusoidal) to its output. By appropriately selecting the feedback resistor values, different gains can be achieved. Precision half-wave rectifiers are commonly used with (...)
Design tool

MSP-3P-SEARCH — MSP Third party search tool

TI has partnered with multiple companies to offer a wide range of solutions and services for TI MSP devices. These companies can accelerate your path to production using MSP devices. Download this search tool to quickly browse third-party details and find the right third-party to meet your needs.

The (...)

Reference designs

TIDM-FRAM-IRREFLECTIONSENSING — MSP430FR2311 Microcontroller IR Reflection Sensing Reference Design

This reference design demonstrates an IR reflection sensing solution based on an MSP430™ FRAM microcontroller (MCU) with configurable analog for sensing and measurement applications. It demonstrates the MCU's ultra-low-power feature with the benefit of FRAM technology and integrated (...)
Reference designs

TIDM-FRAM-EEPROM — EEPROM Emulation and Sensing With MSP430 FRAM Microcontrollers

This reference design describes an implementation of emulating electrically-erasable programmable read-only memory (EEPROM) using Ferroelectric Random Access Memory (FRAM) technology on MSP430™ ultra-low-power microcontrollers (MCUs) combined with the additional sensing capabilities that can (...)
Reference designs

TIDA-01585 — 24V, 36W Sensorless BLDC Sinusoidal Motor Drive With Closed-Loop Speed Control Reference Design

This brushless DC (BLDC) motor drive reference design uses closed-loop control to achieve a very-high speed accuracy using only two chips. The first chip is a cost effective entry level MCU out of the popular ultra-low power MSP430 family. The other (DRV10987) is a three-phase, sensorless, 180° (...)
Reference designs

TIDA-01070 — HVAC Coil Airflow Sensor Reference Design for Predictive Maintenance in Air Filter Replacement

This design provides a reference for monitoring airflow efficiency and temperature through heat ventilation and air conditioner (HVAC) systems. The reference design is used in conjunction with solid state relays and piezoelectric vibration sensors to monitor and react accordingly to low airflow and (...)
Package Pins Download
TSSOP (PW) 16 View options
TSSOP (PW) 20 View options
VQFN (RGY) 16 View options

Ordering & quality

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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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