SLLSFW3A April   2025  – June 2025 SN55LVTA4-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Unused Enable Pins
      2. 7.3.2 Driver Disabled Output
      3. 7.3.3 Driver Equivalent Schematics
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Detailed Design Procedure
          1. 8.1.1.1.1 Interconnecting Media
        2. 8.1.1.2 Design Requirements
        3. 8.1.1.3 Application Curve
      2. 8.1.2 Cold Sparing
      3. 8.1.3 Power Supply Recommendations
        1. 8.1.3.1 Supply Bypass Capacitance
      4. 8.1.4 Layout
        1. 8.1.4.1 Layout Guidelines
          1. 8.1.4.1.1 Microstrip vs. Stripline Topologies
          2. 8.1.4.1.2 Dielectric Type and Board Construction
          3. 8.1.4.1.3 Recommended Stack Layout
          4. 8.1.4.1.4 Separation Between Traces
          5. 8.1.4.1.5 Crosstalk and Ground Bounce Minimization
        2. 8.1.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
  11. 10Receiving Notification of Documentation Updates
  12. 11Support Resources
  13. 12Trademarks
  14. 13Electrostatic Discharge Caution
  15. 14Glossary
  16. 15Revision History
  17. 16Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VCC –0.5 4 V
Input voltage VI –0.5 VCC + 0.5 V
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 °C
Junction temperature, TJ -55 140 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.