SLLSFW3A April   2025  – June 2025 SN55LVTA4-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Unused Enable Pins
      2. 7.3.2 Driver Disabled Output
      3. 7.3.3 Driver Equivalent Schematics
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Detailed Design Procedure
          1. 8.1.1.1.1 Interconnecting Media
        2. 8.1.1.2 Design Requirements
        3. 8.1.1.3 Application Curve
      2. 8.1.2 Cold Sparing
      3. 8.1.3 Power Supply Recommendations
        1. 8.1.3.1 Supply Bypass Capacitance
      4. 8.1.4 Layout
        1. 8.1.4.1 Layout Guidelines
          1. 8.1.4.1.1 Microstrip vs. Stripline Topologies
          2. 8.1.4.1.2 Dielectric Type and Board Construction
          3. 8.1.4.1.3 Recommended Stack Layout
          4. 8.1.4.1.4 Separation Between Traces
          5. 8.1.4.1.5 Crosstalk and Ground Bounce Minimization
        2. 8.1.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
  11. 10Receiving Notification of Documentation Updates
  12. 11Support Resources
  13. 12Trademarks
  14. 13Electrostatic Discharge Caution
  15. 14Glossary
  16. 15Revision History
  17. 16Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) D UNIT
(SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 84.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.0 °C/W
RθJB Junction-to-board thermal resistance 41.8 °C/W
ψJT Junction-to-top characterization parameter 11.1 °C/W
ψJB Junction-to-board characterization parameter 41.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.