SLUSFQ8B December   2024  – June 2025 BQ2969T

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Details
        1. 7.3.1.1 Input Sense Voltage, Vx
        2. 7.3.1.2 Output Drive, OUT
        3. 7.3.1.3 Supply Input, VDD
        4. 7.3.1.4 Control / PTC Input Pin, CTL
        5. 7.3.1.5 Regulated Supply Output, REG
      2. 7.3.2 Overvoltage Sensing for OUT
      3. 7.3.3 Regulator Output Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 NORMAL Mode
      2. 7.4.2 OVERVOLTAGE Mode
      3. 7.4.3 UNDERVOLTAGE Mode
      4. 7.4.4 CTL / OVERTEMPERATURE Mode
      5. 7.4.5 CUSTOMER TEST MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 CTL for PTC Thermistor Protection
      5. 8.2.5 CTL for External OUT Overdrive
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL  THERMAL  BQ2969T UNIT
SON UNIT
(8 PINS) UNIT
RθJA Junction-to-ambient thermal resistance 80.0 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 102.5 °C/W
RθJB Junction-to-board thermal resistance 46.5 °C/W
ψJT Junction-to-top characterization parameter 6.1 °C/W
ψJB Junction-to-board characterization parameter 46.5 °C/W
RθJC(bottom) Junction-to-case(bottom) thermal resistance 22.7 °C/W