SLVSIO8 September   2026 TPS638221

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Scheme
        1. 7.3.1.1 Buck Operation
        2. 7.3.1.2 Boost Operation
        3. 7.3.1.3 Buck-Boost Operation
      2. 7.3.2 Operation Mode
        1. 7.3.2.1 PFM Operation
        2. 7.3.2.2 Forced-PWM Operation (FPWM)
        3. 7.3.2.3 Ultra-sonic Mode Operation
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Enable and Soft Start
      5. 7.3.5 Protection Functions
        1. 7.3.5.1 Input Voltage Protection (IVP)
        2. 7.3.5.2 Output Voltage Protection (OVP)
        3. 7.3.5.3 Current Limit Mode and Overcurrent Protection
        4. 7.3.5.4 Output Short Circuit Protection (Hiccup)
        5. 7.3.5.5 Thermal Shutdown
      6. 7.3.6 Power Good
      7. 7.3.7 Load Disconnect
      8. 7.3.8 Output Discharge
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 3.3V Output Power Supply
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Output Capacitor Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Setting the Output Voltage
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Export Control Notice
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     67

6.5 Electrical Characteristics

TJ = -40℃ to 125℃, VIN = 2.0V to 5.5V. Typical values are at VIN = 3.6V, VOUT = 3.3V and TJ = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
VIN Input voltage range 1.8 5.5 V
VIT+ Positive-going UVLO threshold voltage 1.8 1.9 2.0 V
VIT- Negative-going UVLO threshold 1.6 1.7 1.8 V
VHYS Hysteresis voltage 200 mV
IQ Quiescent current into VIN VIN = 3.6V, VEN = 3.6V, VOUT = 3.3V,
non-switching, TJ = –40°C to 85°C		 2.3 4 µA
IQ Quiescent current into VOUT VIN = 3.6V, VEN = 3.6V, VOUT = 3.3V,
non-switching, TJ = –40°C to 85°C		 0.3 1 µA
ISD Shutdown current into VIN VIN = 3.6V, VOUT = 0V, VEN = 0V
TJ = –40°C to 85°C		 0.3 2.5 µA
I/O SIGNALS
VIT+ Positive-going input threshold voltage MODE, EN 0.82 V
VIT– Negative-going input threshold voltage MODE, EN 0.33 V
VIM Mid-level input voltage MODE 0.6 V
IIH High-level input current MODE VMODE = 1.2V 0.01 0.1 µA
IIL Low-level input current MODE VMODE = 0V 0.01 0.1 µA
IIB Input bias current EN VEN = 0V to 5.5V 2.5 30 nA
REN EN pin pulldown resistor EN = low 800 kΩ
POWER STAGE
VO Output voltage range 1.2 5.5 V
VREF Feedback Regulation Voltage 0.792 0.800 0.808 V
PFM valley - DC offset PFM operation 0.7 1.5 2.5 %
DC offset Ultra-sonic operation, VOUT ≥ 2.5V 0.7 1.25 2.5 %
IFB_lkg Leakage current at FB pin 50 nA
Valley switching current limit 5.7 6.5 7 A
Reverse valley switching current limit -4.0 -3.3 -2 A
Hysteresis current 800 mA
Buck side RDS(on) High-side MOSFET on resistance on buck side 11.6 mΩ
Low-side MOSFET on resistance on buck side 15.5
Boost side RDS(on) High-side MOSFET on resistance on boost side 11.6
Low-side MOSFET on resistance on boost side 15.3
Ilkg Leakage current into VIN to LX1 EN = GND, VIN=5.5V, VLX1=0V, TJ = –40°C to 85°C 0.03 4 µA
Ilkg Leakage current into VOUT to LX2 EN = GND, VOUT=5.5V, VLX2=0V, TJ = –40°C to 85°C 0.03 4 µA
Ilkg Leakage current into LX1 to GND EN = GND, VLX1=5.5V, TJ = –40°C to 85°C 0.02 4 µA
Ilkg Leakage current into LX2 to GND EN = GND, VLX2=5.5V, TJ = –40°C to 85°C 0.02 4 µA
IDISCHG Output discharge current VIN = 3.0V 160 mA
TIMING PARAMETER
tSS Soft-start time 0.2 0.3 0.4 mS
td(EN) Delay between a rising edge on the EN pin and the start of output voltage ramp 200 240 µS
Switching frequency at ultra-sonic mode 24 kHz
PROTECTION
VT+(IVP) Input OVP threshold voltage 5.65 5.75 5.95 V
Input OVP hysteresis 100 mV
VT+(OVP) Output OVP threshold voltage 5.65 5.75 5.95 V
Output OVP hysteresis 100 mV
VPG_TH_rising Power good threshold for rising 95 %
VPG_TH_falling Power good threshold for falling 90 %
VPG_low Power good low level output voltage 0.36 V
Ilkg PG pin leakage current 0.03 µA
hiccup on time 2 mS
hiccup off time 74 mS
Thermal shutdown threshold temperature TJ rising 165 °C
Thermal shutdown hysteresis 20 °C