SNIS237A December   2024  – April 2025 TMP118

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Comparator and Hysteresis
      4. 7.3.4 Strain Tolerance
      5. 7.3.5 NIST Traceability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 One-Shot Mode (OS)
    5. 7.5 Programming
      1. 7.5.1 I2C and SMBus Interface
        1. 7.5.1.1 Serial Interface
          1. 7.5.1.1.1 Bus Overview
          2. 7.5.1.1.2 Device Address
          3. 7.5.1.1.3 Writing and Reading Operation
            1. 7.5.1.1.3.1 Writes
            2. 7.5.1.1.3.2 Reads
          4. 7.5.1.1.4 General-Call Reset Function
          5. 7.5.1.1.5 Timeout Function
          6. 7.5.1.1.6 Coexistence on I3C Mixed Bus
  9. Device Registers
    1. 8.1 Register Map
      1. 8.1.1 Temp_Result Register (address = 00h) [reset = 0000h]
      2. 8.1.2 Configuration Register (address = 01h) [reset = 60B0h]
      3. 8.1.3 TLow_Limit Register (address = 02h) [reset = 2580h]
      4. 8.1.4 THigh_Limit Register (address = 03h) [reset = 2800h]
      5. 8.1.5 Device ID Register (Address = 0Bh) [reset = 1180h]
      6. 8.1.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
      7. 8.1.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
      8. 8.1.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Separate I2C Pullup and Supply Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Equal I2C Pullup and Supply Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Device Comparison

Table 4-1 Device Address Options
7-BIT I2C TARGET ADDRESS

DEVICE

HEX

BINARY

TMP118A/ TMP118MA

0x48

1001000'b

TMP118B/ TMP118MB

0x49

1001001'b

TMP118C/ TMP118MC

0x4A

1001010'b

TMP118D/ TMP118MD

0x4B

1001011'b

Table 4-2 Device Options
FeatureTMP113TMP114TMP117TMP117MTMP117NTMP118TMP118MTMP119
VDD (V)1.4 - 5.51.08 - 1.981.7 - 5.51.7 - 5.51.7 - 5.51.4 - 5.51.4 - 5.51.7 - 5.5

Current Consumption (25°C)

IAVG at 1Hz (μA)1.40.633.53.53.51.41.43.5
IQ_ACTIVE (μA)

55

68

135

135

135

55

55

135

ISB (μA)0.850.261.251.251.250.750.751.25

ISD (μA)

0.07

0.16

0.25

0.25

0.25

0.065

0.065

0.25

Accuracy

0°C to 45°C

(typ)

0.1

0.1

0.05

0.05

0.1

0.05(1)

0.05(1)

0.03

(max)

0.3

0.2

0.1

0.1

0.2

0.15(1)

0.2(1)

0.08

-55°C (max)-

-

0.25

-

0.3

-

-

0.15

-40°C (max)

0.75

0.5

0.15

-

0.2

0.4

-

0.11

-20°C (max)

0.5

0.5

0.1

-

0.2

0.2(1)

0.2(1)

0.09

-10°C (max)

0.5

0.3

0.1

-

0.2

0.2(1)

0.2(1)

0.09

0°C (max)

0.3

0.3

0.1

0.15

0.2

0.15(1)

0.15(1)

0.08

20°C (max)

0.3

0.2

0.1

0.1

0.2

0.1(1)

0.1(1)

0.08

45°C (max)

0.3

0.2

0.1

0.1

0.2

0.1(1)

0.1

(1)

0.08

60°C (max)

0.3

0.3

0.15

0.15

0.2

0.2(1)

0.2(1)

0.09

85°C (max)

0.5

0.5

0.2

0.2

0.2

0.2(1)

0.2(1)

0.15

100°C (max)

0.75

0.5

0.2

-

0.2

0.4

-

0.15

125°C (max)

0.75

0.5

0.25

-

0.25

0.4

-

0.2

150°C (max)-

-

0.3

-

0.3

-

-

0.2

Packaging Dimension

Dimensions [mm × mm × mm]BGA: 1.49 × 0.95 × 0.531

PicoStar™: 0.76 × 0.76 × 0.15

BGA: 1.49 × 0.95 × 0.531

WSON: 2.0 × 2.0 × 0.8

PicoStar™: 0.61 × 0.55 × 0.24

BGA: 1.49 × 0.95 × 0.525

Features

I2C Addresses

ADD0 Pin (4)

Factory Set (4)

ADD0 Pin (4)Factory Set (4)ADD0 Pin (4)

NIST Traceable

Yes

No

Yes

Yes

Yes

Yes

Yes

Yes

Accuracy specified over VDD= 1.62 - 3.6V. The max accuracy is ±0.4°C for the full VDD range (1.4V to 5.5V)
TMP118 TMP118 Device NomenclatureFigure 4-1 TMP118 Device Nomenclature
Table 4-3 TMP118 Device Nomenclature Detail

Field Description

Field Detail

Sensor FamilyTMP: Temperature Sensors
Device Name118
Device Type (Optional)
  • TMP118
  • TMP118M for Medical Temperature Range
I2C Address
  • TMP118A/ TMP118MA - 0x48/ 1001000'b
  • TMP118B/ TMP118MB - 0x49/ 1001001'b
  • TMP118C/ TMP118MC - 0x4A/ 1001010'b
  • TMP118D/ TMP118MD - 0x4B/ 1001011'b
Temperature Range
  • Standard Temp Range (TMP118xI): -40°C to 125°C
  • Medical Temp Range (TMP118MxI): -20°C to 85°C
TI Package DesignatorYMS, PicoStarTM package, 0.3mm pitch
T&R Packing SizeLarge T&R, SPQ = 12,000 units